한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)
- 한국마이크로전자및패키징학회 2000년도 추계 기술심포지움 논문집
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- Pages.107-111
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- 2000
T peel 테스트에 의한 Cu/Cr/Polyimide계의 계면파괴에너지 평가
Estimation of Interfacial Fracture Energy of Cu/Cr/Polyimide System by T Peel Test
- Song, J.Y. (Dept. of Materials Science and Engineering, KAIST) ;
- Yu, Jin (Dept. of Materials Science and Engineering, KAIST)
- 발행 : 2000.11.01