Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2000.11a
- /
- Pages.3-8
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- 2000
Package Design for Protecting Active Chip Surface from Damage due to a Dicing Saw Blade
- Lee, Seong-Min (Department of Materials Science & Engineering University of Inchon)
- Published : 2000.11.01
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