The Fabrication of Mulilayer Chip NTC Thermistor for Mobile Communication Telephone

이동통신 단말기에 이용되는 적층 칩 써미스터 제작

Oxides of the form $Mn_{3}O_4$-$Co_{3}O_4$-NiO present properties that make them useful as multilayer chip NTC thermistor for mobile communication telephone. When $Mn_{2}Ni_{x}CO_{1-x}O_4$ composition with the X = 0.12$\sim$0.24 at sintered temperature 1250$^{\circ}C$, resistivity and B-constant were 300$\sim$450[${\Omega}-cm$] and 3250$\sim$3450, respectively. Multilayer chip NTC(Negative Temperature Coefficient) resistor were fabricated with 4 layer by a conventional multilayer capacitor techniques, using 100 pd paste as internal electrode and $Mn_{2}Ni_{0.20}CO_{0.8}O_4$ composition as NTC materials. In particular, resistance change ratio (${\Delta}R$), the important factor for reliability, varied within $\pm$3%, indicating the compositions of multilayer chip NTC thermistor products could be available for mobile communication telephone.