Proceedings of the IEEK Conference (대한전자공학회:학술대회논문집)
- 1999.06a
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- Pages.922-925
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- 1999
The Silylation Photo Resist Process and the Enhanced-Inductively Coupled Plasma (E-ICP)
Silylation Photo resist 공정과 Enhanced-Inductively Coupled Plasma (E-ICP)
Abstract
The Silylation photo-resist etch process was tested by Enhanced-ICP dry etcher. The comparison of the two process results of micro pattern etching with 0.25
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