한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)
- 한국마이크로전자및패키징학회 1999년도 1st Korea-Japan Advanced Semiconductor Packaging Technology Seminar
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- Pages.127-154
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- 1999
High Integration Packaging Technology for RF Application
- Lee, Young-Min (Compound Semiconductor Department Micro-Electronics Technology Lab. Electrics and Telecommunications Research Institute)
- 발행 : 1999.12.01
초록
Interconnect - Wire bonding-> Flip chip interconnect ; At research step, Au stud bump bonding seems to be more proper .Package -Plastic package->
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