한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)
- 한국마이크로전자및패키징학회 1999년도 춘계 기술심포지움 전자부품 및 패키징 기술의 최신동향
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- Pages.54-69
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- 1999
Recent Technology Trends in BGA and Flip Chip
- Lee, Young-Min (Compound Semiconductor Department Micro-electronics Technology Lab.)
- 발행 : 1999.05.01