대한전기학회:학술대회논문집 (Proceedings of the KIEE Conference)

대한전기학회 (The Korean Institute of Electrical Engineers)
권호 표지

후막형 전류제한소자제작과 전류제한특성 연구

The study on characterization of current limit and fabrication of device for current limit formed by thick film

  • 임성훈 (전북대학교 전기공학과) ;
  • 강형곤 (전북대학교 전기공학과) ;
  • 최명호 (전북대학교 전기공학과) ;
  • 한병성 (전북대학교 전기공학과)
  • Lim, Sung-Hun (Chonbuk National University Dept. of Electrical Engineering) ;
  • Kang, Hyeong-Gon (Chonbuk National University Dept. of Electrical Engineering) ;
  • Choi, Myung-Ho (Chonbuk National University Dept. of Electrical Engineering) ;
  • Han, Byung-Sung (Chonbuk National University Dept. of Electrical Engineering)
  • 발행 : 1999.07.19
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초록

$YBa_2Cu_3O_x$ superconducting thick film was fabricated by surface diffusion process of $Y_2BaCUO_5$ and the mixed compound of $(3BaCuO_2+2CuO)$ expected to be liquid phase above the peritectic temperature of YBa2Cu30x. For the surface diffusion. 3BaCu02+2CuO mixed with binder material was patterned on $Y_2BaCuO_5$ substrate by the screen printing method. The characteristic of current limit on thick film fabricated was measured. The thick film limited the current from $2.8213mA_{rms}$ to $4.2034mA_{rms}$ with $500{\Omega}$ load resistance, and from $4.1831mA{rms}$ to $4.2150mA_{rms}$ with $10{\Omega}$ load resistance.

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