대한전기학회:학술대회논문집 (Proceedings of the KIEE Conference)
- 대한전기학회 1998년도 추계학술대회 논문집 학회본부 C
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- Pages.732-734
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- 1998
반도체용 박막재료의 열응력-변형 특성에 미치는 passivation 층의 영향 분석
Effects of passivation layer on the thermal deformation behavior of metal film used in semiconductor devices
- Choi, Ho-Seong (School of Materials Science and Engineering, Seoul National University) ;
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Lee, Kwang-Ryol
(Division of Ceramic, Korea Institute of Science and Technology) ;
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Kwon, Dong-Il
(School of Materials Science and Engineering, Seoul National University)
- 발행 : 1998.11.28
초록
Metal thin films such as aluminum have been used as interconnects in semiconductor device. Recently, these materials are applied to structural materials in microsensors and microactuators. In this study, we evaluate deformation and strength behavior of aluminum alloy film. Three layer model for thermal deformation of multilayered thin film material is introduced and applied to Si/Al(1%Si)/
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