한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)

한국전기전자재료학회 (The Korean Institute of Electrical and Electronic Material Engineers)
권호 표지

이동통신용 적층 칩 필타 제작에서의 green sheet 특성

The green sheet properties of multilayer chip filter for mobile communication

  • 윤중락 (명지대학교 공과대학 전기공학과) ;
  • 이헌용 (명지대학교 공과대학 전기공학과)
  • 발행 : 1997.11.01
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초록

This paper presents green sheet Properties of multilayer chip filter for mobile communication. The role of solid loading content and lamination conditions in determining some of the green sheet properties are present. The optimun conditions were obtained solid loading 62:38, lamination temperature 7$0^{\circ}C$, lamination press 300~400 Kg/$\textrm{cm}^2$.

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