Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)

The Korean Institute of Electrical Engineers (대한전기학회)
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A STUDY ON THE ANTI-CORROSION OF Al-Cu AFTER PLASMA ETCHING

Al-Cu막의 플라즈마 식각후 부식 억제에 관한 연구

  • Published : 1997.07.21
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Abstract

In this study, the mechanism underlying the corrosion problem have been investigated using X-ray photoelectron spectroscopy(XPS) and scanning electron microscopy(SEM), AES(Auger electron spectroscopy) In regard to the removal of Al-Cu corrsion, the subsequent treatment of the $SF_6$ plasma has also been completed. This work evaluated the effects of grain boundary on the AlCu after dry etching and the role of subsequent $SF_6$ plasma for the removal of AlCu corrosion.

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