Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)

The Korean Institute of Electrical Engineers (대한전기학회)
권호 표지

Heating simulations of the pancake in the simplified 3D microwave oven

간략화된 Cavity내부의 Pancake 가열 시뮬레이션

  • Lee, Pyeong-Hwa (Dept. of Electronic Engineering, Seoul City University) ;
  • Cheon, Chang-Yul (Dept. of Electronic Engineering, Seoul City University) ;
  • Lee, Seung-Woo (Dept. of Electrical Engineering, Seoul National University) ;
  • Hahn, Song-Yop (Dept. of Electrical Engineering, Seoul National University) ;
  • Cho, Kyu-Wan (LG Electronics Inc. ( Living System Laboratory )) ;
  • Kim, Eung-Su (LG Electronics Inc. ( Living System Laboratory )) ;
  • Jeong, Bong-Sik (LG Electronics Inc. ( Living System Laboratory )) ;
  • Kim, Hyun-Jung (LG Electronics Inc. ( Living System Laboratory ))
  • 이평화 (서울시립대 전자공학과) ;
  • 천창율 (서울시립대 전자공학과) ;
  • 이승우 (서울대 전기공학과) ;
  • 한송엽 (서울대 전기공학과) ;
  • 조규완 ((주) LG 전자 ( 생활시스템 연구소 )) ;
  • 김응수 ((주) LG 전자 ( 생활시스템 연구소 )) ;
  • 정봉식 ((주) LG 전자 ( 생활시스템 연구소 )) ;
  • 김현정 ((주) LG 전자 ( 생활시스템 연구소 ))
  • Published : 1996.07.22
Download PDF
⟨ Previous Next ⟩

Abstract

This paper presents simulations of the pancake in the simplified 3D microwave oven. The results were compared with experimental data. For the comparison we used infrared photography of the heated pancake and electric field distribution obtained by simulation. Finite Element Method (FEM) using edge element is employed for the simulation. For solving the large sparse system parallelled QMR method was used.

Keywords