Latchup Immunity Simulation of CMOS Well for Ion Implantation Process Simulation Conditions

CMOS Well의 Ion Implantation 공정조건에 따른 Latchup 면역성 모의실험

  • Kim, J.K. (Dept. of Electrical Eng. Korea University) ;
  • Yi, J.W. (Dept. of Electrical Eng. Korea University) ;
  • Kim, Y.H. (Dept. of Electrical Eng. Korea University) ;
  • Kim, T.H. (Dept. of Electrical Eng. Korea University) ;
  • Sung, Y.K. (Dept. of Electrical Eng. Korea University)
  • 김종관 (고려대학교 공과대학 전기공학과) ;
  • 이진우 (고려대학교 공과대학 전기공학과) ;
  • 김영훈 (고려대학교 공과대학 전기공학과) ;
  • 김태훈 (고려대학교 공과대학 전기공학과) ;
  • 성영권 (고려대학교 공과대학 전기공학과)
  • Published : 1996.07.22

Abstract

This paper deals with latchup effect in CMOS retrograde well, focusing on their dependence on I/I energy conditions, so we derived some latchup characteristics from simulation for different I/I conditions on implantation energies which were used in process simulation. From these results, we could understand the dependency of CMOS retrograde well latchup on I/I energy condition.

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