대한전기학회:학술대회논문집 (Proceedings of the KIEE Conference)
- 대한전기학회 1995년도 하계학술대회 논문집 C
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- Pages.1437-1439
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- 1995
공정변수가 p+ 박막의 잔류응력 분포에 미치는 영향
Effect of Process Parameters on the Residual Stress Distribution in p+ Films
- Yang, E.H. (Department of Control and Instrumentation Engineering AJOU University) ;
- Yang, S.S. (Department of Control and Instrumentation Engineering AJOU University)
- 발행 : 1995.07.20
초록
This paper investigates the effect of thermal oxidation on the profile of the residual stress along the depth of p+ silicon films by quantitative determination method. Two examples for the application of this method illustrate that most of p+ region is subjected to the tensile stress except the region near the front surface and that the stress gradient of the film oxidized at
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