Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)
- 1995.07c
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- Pages.1171-1173
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- 1995
The capacitance characteristics of polyimide thin films by VDP Method
진공 증착 중합법에 의해 제작된 폴리이미드박막의 유전특성
Abstract
Polyimide thin films were fabricated through the vapor deposition polymerization method, and the structure and capacitance characteristics of them were investigated in detail. It was found that the chemical structure and uniformity of the film could be stabilized with curing. The peaks of
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