• Journal of the Korean Wood Science and Technology
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• v.41 no.6
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• pp.490-496
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• 2013

The board using recycled wood waste chip tends to decrease in terms of physical and mechanical properties. The reasons are notably different shape of chips, components of used adhesive and impurity content, which bring the irregular quality and downgrading of board. More over, the board has higher emissivity of formaldehyde than regular board, because recycled chip contains adhesives that were used to make previous products. This low quality of products weakens the price and quality competitiveness, and it led to bringing the issue of problem in Korean board industry. For these reason, in this study, boards using byproducts of plywood were made to evaluate physical and mechanical properties according to manufacturing conditions. As a result, The board was consists of 4~16 mesh chips for core layer and veneer on both face and they were combined using EMDI, and its' bending strength was 57.7 $N/mm^2$ which is 215% higher than that of OSB (26.8 $N/mm^2$). Moreover, the emissivity of formaldehyde was 0.7 ppm, this board seems to substitute OSB for rated sheathing.

• Journal of the Korean Wood Science and Technology
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• v.42 no.5
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• pp.615-623
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• 2014

Increases of public attention on healthy environment lead to the regulation of indoor air quality such as Clean Healthy House Construction Standard. This standard covers emission of total volatile organic compounds (TVOCs) (e.g., formaldehyde, benzene, and toluene), ventilation, and use of environmentally-friendly products or functional products. Moisture absorption and desorption abilities are a recommended functionality for improving indoor air quality. In this study, moisture absorption and desorption capacities of carbonized board from wood-based panels and other materials were determined by using UNT-HEAT-01 according to ISO 24358:2008. Pine had higher moisture absorption and desorption capacities ($49.0g/m^2$ and $35.3g/m^2$, respectively) than hinoki cypress, cement board, gypsum board, oriented strand board, and medium density fiberboard (MDF). The moisture absorption and desorption capacities differed considerably according to the wood species. After carbonization process at $400^{\circ}C$, the absorption and desorption ability of MDF increased to 38% and 60%, respectively. However, moisture absorption and desorption capacities decreased with increasing carbonization temperature, but they were still higher than original MDF. Therefore, it is suggested that carbonization below $600^{\circ}C$ can improve moisture absorption/desorption capacities.

• Resources Recycling
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• v.19 no.2
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• pp.19-27
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• 2010

The purpose of this research was to see thermal and breaking type characteristics of waste wood for construction materials using high temperature and pressure equipment. In TG/DTA graph weight of waste wood was steeply decreased at $250^{\circ}C$, it has to be treated below $250^{\circ}C$ for construction materials. In popping test the needle-leaved tree was more broken in texture than the broad-leaved tree, especially, Chamaecyparis obtusa(W-7) was the best. The optimum result was obtained at temp. $200^{\circ}C$, pressure 3MPa among the experimental condition.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.47 no.3
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• pp.24-33
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• 2015

Linerboards containing wood flours were developed to increase solid contents in wet pressing process. Presence of wood flours in recycled fibers allowed passage of pressurized water at high wet pressing pressure, and increased solid contents while keeping the bulk of the board. The amount of wood flour addition should be controlled based on the intensity of the wet pressing pressure and the properties of the wood flours. Addition of cationic starch to the wood flour containing OCC furnish showed synergic increase of solid content and strength properties. Shapes of the wood flours such as spherical and rod type added to OCC furnish affected largely their solid content, drainage, and board physical properties.

• Journal of the Korea Furniture Society
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• v.23 no.4
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• pp.435-439
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• 2012

This research was performed to evaluate surface performance of gold plated carbonized board. After the carbonization at $850^{\circ}C$, volume, weight, and density decreased by 65.25%, 71.35% and 17.64%, respectively. Abrasion resistance and surface hardness of non-carbonized board exhibited the highest values of 0.093 g/100 revolution and 26.43 N/$mm^2$, respectively. Gold plated carbonized board showed intermediate values, 0.587 g/100 revolution of abrasion resistance and 24.35 N/$mm^2$ of surface hardness. Carbonized board showed the lowest values, 0.863 g of abrasion resistance and 21.50 N/$mm^2$, of surface hardness. These results were thought to reflect propertional relationship between abrasion resistance and surface hardness. Abrasion resistance and surface hardness of carbonized board appeared able to be improved by surface treatment such as plating.

• Journal of the Korean Wood Science and Technology
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• v.41 no.1
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• pp.58-63
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• 2013

This study is a basic research for practical applications of carbonized boards, which measured thermal conductivity and electrical properties of carbonized boards manufactured at different carbonization temperature ($400{\sim}1,100^{\circ}C$) using a medium density fiberboard, particleboard, plywood and wood (Fraxinus rhynchophylla). The highest value of thermal conductivity was 0.1326 m/k at carbonization temperature of $900^{\circ}C$ in the carbonized particleboard. Overall, the higher density of carbonized board, thermal conductivity was faster. As the electrical resistivity decreased with increased carbonization temperature, it was almost close to conductor after carbonization temperature of $1,000^{\circ}C$. When electricity has worked on the carbonized board by high voltage, the current and the electric power increased and surface temperature of carbonized board was high.

• Journal of the Korean Wood Science and Technology
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• v.48 no.1
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• pp.32-40
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• 2020

While the utilization of wood as a raw material in related industries has been increasing with the population increasing, the availability of wood from natural forests has continued to decline. An alternative to this situation is the manufacture of particleboard from non-wood lignocellulose materials through the modification of sandwich particleboard (SPb) using bamboo strands as reinforcement. In this study, strandsof belangke bamboo (Gigantochloa pruriens W) and tali bamboo (Gigantochloa apus) were utilized. The non-wood particles included sugar palm fibers, cornstalk, and sugarcane bagasse. The board was made in a three-layer composition of the face, back, and core in a ratio of 1: 2: 1. The binder used was 8% isocyanate resin. The sheet was pressed at a temperature of 160℃ for 5 min under a pressure of 3.0 N/㎟. Testing included physical and mechanical properties based on the JIS A 5908 (2003) standard, while acoustic testing was based on ISO 11654 (1997) standards. The results showed that using bamboo strands as reinforcement has an effect on the mechanical and physical properties of SPb. Almost all the types of boards met the JIS A 5908 (2003) standards, with the exception of thickness swelling (TS) and internal bond (IB) parameters. Based on the thickness swelling parameter, the C-type board exhibited the best properties. Overall, the B-type board thatused a belangke bamboo strand for the surface and sugarcane bagasse as the core underwent the best treatment. Based on the acoustical parameter, boards using a tali bamboo strand for the surface and sugar palm fiber as the core (E-type board) exhibited good sound absorption properties.

• Journal of the Korean Wood Science and Technology
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• v.42 no.2
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• pp.163-171
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• 2014

Environmental issues about indoor air quality have been increased and focused on volatile organic compounds (VOCs) caused cancer, asthma, and skin disease. Reducing VOCs has been attempted in many different methods such as using environmentally friendly materials and air cleaner or purifier. Charcoal is well known material for absorbing VOCs. Therefore, carbonized board from medium density fiberboard has been developed. We assumed that the source of carbonized boards can be any type of wood-based panels. In this study, carbonized boards were manufactured from oriented strand board (OSB) at 400, 600, 800, and $1000^{\circ}C$. Each carbonized OSB (c-OSB) was evaluated and determined physiomechanical characteristics such as exterior defects, dimensional shrinkage, modulus of elasticity, and bending strength. No external defects were observed on c-OSBs at all carbonizing conditions. As carbonizing temperature increased, less porosity between carbonized wood fibers was observed by SEM analysis. The higher rate of dimensional shrinkage was observed on c-OSB at $1000^{\circ}C$ (66%) than c-OSB at 400, 600, and $800^{\circ}C$ (47%, 58%, and 63%, respectively). The densities of c-OSBs were lower than original OSB, but there was no significant different among the c-OSBs. The bending strength of c-OSB increased 1.58 MPa (c-OSB at $400^{\circ}C$) to 8.03 MPa (c-OSB at $1000^{\circ}C$) as carbonization temperature increased. Carbonization temperature above $800^{\circ}C$ yielded higher bonding strength than that of gypsum board (4.6 MPa). In conclusion, c-OSB may be used in sealing and wall for decorating purpose without additional artwork compare to c-MDF which has smooth surface.

• Journal of the Korean Wood Science and Technology
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• v.48 no.2
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• pp.196-205
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• 2020

The purpose of this study was to investigate a method for improving the physical and mechanical properties of laminated board made from oil palm trunk (OPT). The effects of pretreating the lamina with heat-pressure and altering the lamina composition of the laminated board were investigated. The outer third of OPT in cross-section had high-density wood, while the underlying third had low to medium density. The hot press was applied to pretreat the lamina that had low to medium density. The lamina were 1.5 cm in thickness, 5 cm in width, and 65 cm in length. The hot press was applied at 2.94 MPa or 4.41 MPa at 150 ℃ for 60 minutes, and the target thickness of the lamina was 1 cm. The three layers of the laminated board samples were bonded with isocyanate adhesive at a glue spread of 300 g/㎡ and cold pressed at 0.98 MPa for 3 h. The laminated board samples were tested according to Japanese Agricultural Standard (JAS) 234-2003. The results showed that the densification of the inner lamina did not significantly affect the physical-mechanical properties of the laminated board produced. However, the laminated board made with high-density laminas for the outer layers fulfilled the JAS 234-2003 standard for the modulus of elasticity and the modulus of rupture.

• Journal of the Architectural Institute of Korea Structure & Construction
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• v.34 no.1
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• pp.53-60
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• 2018

For test on flooring board laminated with PVC decoration materials in order to replace the current surface materials such as HPL in decoration wood-based flooring board. the Results of comparison and analysis are as follows: For thermal conductivity, flooring board decorated with PVC did not show huge differences when temperature was rising and lowering compared to the flooring materials laminated with the existing HPL surface materials. It seems the most meaningful results for using it as indoor flooring materials. That is, in Korea where there is the culture focusing on ondol heating, use amount of heat energy and efficiency of flooring materials are very important and sensitive issues, involving immediately with household economy of final consumers, and it might be a criteria to judge basic performances required as flooring materials. As a result of the analysis on mandatory durability test items such as abrasion resistance, absorption width expansion rate, impact resistance, surface hardness, and impact absorption for flooring materials, compared to flooring board laminated with general HPL surface decoration materials, decoration wood-based flooring board laminated with PVC surface decoration materials which is higher abrasion resistance with smaller transformation and has better durability and impact absorption of the surface, is available for actual application as indoor flooring board, and for replacing surface decoration materials impregnated with heat-hardened resion such as HPL.