• Title/Summary/Keyword: whole powder pattern fitting

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Physico-mechanical, AC-conductivity and microstructural properties of FeCl3 doped HPMC polymer films

  • Prakash, Y.;Somashekarappa, H.;Manjunath, A.;Mahadevaiah, Mahadevaiah;Somashekar, R.
    • Advances in materials Research
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    • v.2 no.1
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    • pp.37-49
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    • 2013
  • The transition metal salt doped solid polymer electrolyte [TSPE] were prepared with HPMC as a host polymer. The virgin and doped films were prepared by solution-casting method and investigated using wide angle X-ray scattering method. Micro structural parameters like lattice strain (g%), stacking/twin faults, the average number of unit cells counted in a direction perpendicular to the Bragg's plane (hkl) spacing of (hkl) planes dhkl, crystallite size Ds, distortion width, standard deviation were determined by whole pattern powder fitting (WPPF) method, which is an extension of single order method. It is found that the crystallite size decreases with the increase in the content of $FeCl_3$. This decrease is due to increase in localized breaking of polymer network which also accounts for the amorphous nature of the material. The filler inorganic salt $FeCl_3$ acts as plasticizer. FTIR study also confirms and justifies the interaction between the polymer and in-organic salt in the matrix. Physical properties like mechanical stability and Ac conductivity in these films are in conformity with the X-ray results.