• Journal of Soil and Groundwater Environment
• /
• v.23 no.1
• /
• pp.1-13
• /
• 2018

A series of experiments using transparent micromodels with an artificial pore network etched on glass plates was performed to investigate the effects of flow rate on the migration and distribution of resident wetting porewater (deionized water) and injecting non-wetting fluid (n-hexane). Multicolored images transformed from real RGB images were used to distinguish n-hexane from porewater and pore structure. Hexane flooding followed by immiscible displacement with porewater, migration through capillary fingering, preferential flow and bypassing were observed during injection experiments. The areal displacement efficiency increases as the injection of n-hexane continues until the equilibrium reaches. Experimental results showed that the areal displacement efficiency at equilibrium increases as the flow rate increases. Close observation reveals that preferential flowpaths through larger pore bodies and throats and clusters of entrapped porewater were frequently created at lower flow rate. At higher flow rate, randomly oriented forward and lateral flowpaths of n-hexane displaces more porewater at an efficiency close to stable displacement. It may resulted from that the pore pressure of n-hexane, at higher flow rate, increases fast enough to overcome capillary pressure acting on smaller pore throats as well larger ones. Experimental results in this study may provide fundamental information on migration and distribution of immiscible fluids in subsurface porous media.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2001.04a
• /
• pp.45-47
• /
• 2001

Due to pressure from threatened legislation in Europe, consumer and governmental pressure in Japan, and glob머 market considerations in the US, there is a rapidly growing interest in lead-free solderinger, Although the move to lead free soldering seems inevitable, many problems will arise in production assembly. It is generally acknowledged that the lead-free solders available offer a much s smaller process window than lead/tin, related mainly to the higher soldering temperatures which naturally result from increases of liquidus temperatures of at least 300 C. However, raising reflow temperatures from the current 220-2300 C to 250 2600 C will lead to problems with the boards and components as well as i increasing oxidation effects. There is a need to keep reflow temperatures low without reducing solderablity. Some results on benefits of inert atmospheres are discussed in this paper. For example, testing in a nitrogen atmosphere, with 300 ppm oxygen, by the N National Physical Laboratory (NPU has revealed clear benefits for ine$\pi$mg lead-free alloys, by restoring the solderability to lead/tin levels, by enabling lower soldering temperatures. However, there has been little testing over a range of oxygen levels in nitrogen and this is an important issue in determining n nitrogen supply and oven costs. Some results are reported here from work by NPL conducted for BOC in w which solderability was evaluated for tin기ead and tin/silver/copper eutectic a alloys in a wetting balance over a range of oxygen levels form 10 ppm to 21% ( (air). The studies confirm that acceptable wetting times occur in inert atmospheres a at soldering temperatures 20 to 300 C lower than are possible in air.

• Corrosion Science and Technology
• /
• v.9 no.6
• /
• pp.259-264
• /
• 2010

In continuous hot dip galvanizing process, oxide formation on steel surface has an influence on Zn wetting. High strength automotive steel contains high amount of Si and Mn, where Si-Mn composite oxides such as $Mn_2SiO_4$ or $MnSiO_3$ covers the surface after annealing. Zn wetting depends on how the aluminothermia reaction can reduce the Mn-Si composite oxides and then form inhibition layer such as $Fe_2Al_5$ on the steel surface. The outward diffusion of metallic ions such as $Mn^{2+}$, $Si^{2+}$ in the steel matrix is very important factor for the formation of the surface oxides on the steel surface. The surface state and grain boundaries provide an important role for the diffusion and the surface oxide reactions. Some elements such as P, Sb, and B have a strong affinity for the interface precipitation, and it influence the diffusivity of metallic ions on grain boundaries. B oxide forms very rapildly on the steel surface during the annealing, and this promote complex oxides with $SiO_2$ or MnO. P has inter-reacted with other elements on the grain boundaries and influence the diffusion through on them. Small addition of Sb could suppress the decarburization from steel surface and retards the formation of internal and external selective oxides on the steel surface. Interface control by the trace elements such as Sb could be available to improve the Zn wettability during the hot dip galvanizing.

• Journal of the Korean Wood Science and Technology
• /
• v.22 no.2
• /
• pp.46-53
• /
• 1994

This study was conducted to investigate a feasibility of manufacturing wood fiber thermoplastic composites and to evaluate their mechanical properties. Wood fiber as a potential reinforcing filler was compounded with two thermoplastics (polypropylene and high density polyethylene) in high intensity thermokinetic plastic mixer aided with a wetting agent. It was found that wood fiber thermoplastic composites could be manufactured by injection molding process. The tensile and flexural strength of injection molded specimens were improved greatly with increasing wood fiber concentration. Tensile and flexural modulus increased proportionately with wood fiber concentration. Wood fiber provided reinforcement with thermoplastics in terms of strength and modulus. However, the percent elongation at break and energy to break were reduced with increasing wood fiber loadings. Impact strength also showed similar trend.

• Proceedings of the KWS Conference
• /
• 2009.11a
• /
• pp.73-73
• /
• 2009

In this sutdy, a new class ACA(Anisotropic Conductive Adhesive) with low-melting-point alloy(LMPA) and self-organized interconnection method were developed. This developed self-organized interconnection method are achieved by the flow, melting, coalescence and wetting characteristics of the LMPA fillers in ACA. In order to observe self-interconnection characteristic, the QFP($14{\times}14{\times}2.7mm$ size and 1mm lead pitch) was used. Thermal characteristic of the ACA and temperature-dependant viscosity characteristics of the polymer were observed by differential scanning calorimetry(DSC) and torsional parallel rheometer, respectively. A electrical and mechanical characteristics of QFP bonding were measured using multimeter and pull tester, respectively. Wetting and coalescence characteristics of LMPA filler particles and morphology of conduction path were observed by microfocus X-ray inspection systems and cross-sectional optical microscope. As a result, the developed self-organized interconnection method has a good electrical characteristic($2.41m{\Omega}$) and bonding strength(17.19N) by metallurgical interconnection of molten solder particles in ACA.

• Journal of the Korean Geotechnical Society
• /
• v.31 no.8
• /
• pp.17-28
• /
• 2015

The purpose of this study is to measure the volumetric water content of unsaturated soils during drying and wetting process by using volumetric pressure plate extractor (VPPE) incorporated with time domain reflectometry (TDR). The VPPE consists of a pressure cell, a pressure regulator, a burette system and a TDR probe. Two samples with different initial void ratios were prepared in the pressure cell, and the air pressure at the range of 0.1 kPa - 50 kPa was applied to adjust the matric suction by the pressure regulator. The burette system was used to measure the volumetric water content change of the sample according to the matric suction. In addition, the TDR probe, installed in the cell, was used to evaluate the dielectric constant from the reflected signal of the electromagnetic wave at the probe. The volumetric water content of specimen was estimated by the empirical equation between the volumetric water content and dielectric constant, which was calibrated with the Jumunjin sand. The test results show that the volumetric water content calculated by TDR probe is strongly correlated to the measured value by burette system. The hysteresis occurs during drying and wetting process. Furthermore, the degree of hysteresis reduces in the repeated process. This study suggests that TDR may be effectively used to evaluate the water content soil for the determination of water characteristic curve of unsaturated soils.

• ETRI Journal
• /
• v.46 no.2
• /
• pp.347-359
• /
• 2024

A simultaneous transfer and bonding (SITRAB) process using areal laser irradiation is introduced for high-yield and cost-effective production of mini- or micro-light-emitting diode (LED) display panels. SITRAB materials are special epoxy-based solvent-free pastes. Three types of pot life are studied to obtain a convenient SITRAB process: Room temperature pot life (RPL), stage pot life (SPL), and laser pot life (LPL). In this study, the RPL was found to be 1.2 times the starting viscosity at 25℃, and the SPL was defined as the time the solder can be wetted by the SITRAB paste at given stage temperatures of 80℃, 90℃, and 100℃. The LPL, on the other hand, was referred to as the number of areal laser irradiations for the tiling process for red, green, and blue LEDs at the given stage temperatures. The process windows of SPL and LPL were identified based on their critical time and conversion requirements for good solder wetting. The measured RPL and SPL at the stage temperature of 80℃ were 6 days and 8 h, respectively, and the LPL was more than six at these stage temperatures.

• Journal of the Microelectronics and Packaging Society
• /
• v.18 no.3
• /
• pp.53-57
• /
• 2011

In the modern packaging technologies highly condensed metal interconnects are typically formed by highcost processes. These methods inevitably require the precise controls of mutually dependant process parameters, which usually cause the difficulty of the change in the layout design for interconnects of chip to-chip, or chip-to-substrate. In order to overcome these problems, the unique concept and methodology of self-assembly even in micro-meter scale were developed. In this report we focus on the factors which influenced the self-formed bumps by analyzing the phenomenon experimentally. In case of RMA flux, homogenous pattern was obtained in both plain surface and cross-section surface observation. By using RA flux, the phenomena were accelerated although the self-formtion results was inhomogenous. With ussage of moderate RA flux, reaction rate of the self-formation was accelerated with homogeneous pattern.

• Transactions of the Korean Society of Automotive Engineers
• /
• v.9 no.5
• /
• pp.17-22
• /
• 2001

This paper is the first of companion papers, which investigate port-masking effects on lean misfire limit. Port-masking was applied to commercial SOHC 3-valve and DOHC 4-valve engine by inserting masking plates between manifold and port. To induce various conditions of stratification, six types of masking plates were applied. The masking plates were placed in the upstream of injector to prevent wall wetting and two ports were not separated to permit both fuel and air entering through masked port. The results were compared with those by conventional port throttling. The results show that lean misfire limit mainly depends on masking direction, that is, high lean misfire limit is achieved when the port near the spark plug is masked. The mechanism of stratification by masking is different from axial stratification by port throttling. In this case, the rich mixture entering through masked port plays a very important role in the stratification process.

• Journal of Welding and Joining
• /
• v.21 no.4
• /
• pp.63-68
• /
• 2003

Scanning electron microscopy (SEM) has been used as a surface measurement instrument and a tool for lithography in semiconductor process due to its high density localized beam. For those purposes, however, the maximum current of SEM Is less than 100pA, which is not enough fo material processing. In this paper SEM was modified to increase the amount of current reaching a specimen from gun part where current is generated, the possibility of applying SEM to material processing, especially microjoining, was investigated. The maximum current of SEM after modifications was measured up to 10$\mu$A, which is about 10$^{5}$ times greater than before modifications. Through experiments such as eutectic solder wetting on thin 304 stainless steel foil and microjoining of 10$\mu$m thick 304 stainless steel, the intensity of electron beam of SEM proved to be great enough fur material processing as heat source. And a tight jig system was found necessary to hold materials close enough fur successful microloining.