• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.04a
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• pp.15-19
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• 2003

Polymeric micro lens arrays with diameters of $13\~96\;{\mu}m$ fabricated using the micro-compression molding with electro formed mold inserts. In the present study, the electro forming process was used to make the metallic micro-mold insert for micro-molding of microlens array. The wettability property of the fabricated mold insert was examined by measuring the contact angle of the polymer melt on the mold insert. Microlenses were compression-molded with the fabricated mold insert. The effects of the molding temperature and wettability property on the replication quality of the molded lenses were analyzed experimentally.

• Journal of Welding and Joining
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• v.20 no.3
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• pp.116-121
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• 2002

For the accumulation of a fundamental knowledge about the behavior of glass solder during the joining of ceramics, the wettability of solder on silicon nitride have been measured by sessile drop method. $SiO_2-MgO-Al_2O_3$ g1ass solder and oxynitride glass solders were selected as examples while silicon nitride which were used as substrates. Contact angle of solder on silicon nitride didn't decrease with time at high nitrogen content in the solder, but low nitrogen content in solders have the time-dependent property. Reason which contact angle of low nitrogen content in solders decrease on silicon nitride was that diffusion of nitrogen take place between solder and silicon nitride.

• Journal of Welding and Joining
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• v.18 no.6
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• pp.74-82
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• 2000

The fluxless wetting properties of UBM-coated Si-wafer to the binary lead-free solders(Sn-Ag, Sn-Sb, Sjn-In, Sn0Bi) were estimated by wetting balance method. With the new wettability indices from the wetting curves of one side coated specimen, the wetting property estimation of UBM-coated Si-wafer was possible. For UBM of Si-chip, Au/Cu/Cr UBm was better than au/Ni/TI in the point of wetting time/ At general reflow process temperature, the wettability of high melting point solders(Sn-Sb, Sn-Ag) was better than that of low melting point one(Sn-Bi, Sn-In). The contact angle of the one side coated Si-plate to the solder could be calculated from the force balance equation by measuring the static state force and the tilt angle.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.533-538
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• 2003

It has been shown that ion implantation produces remarkable improvements in surface-sensitive physical and chemical properties as well as other mechanical properties, in polymers. In this study, ion implantation was performed onto polymer, PC(polycarbonate), in order to investigate surface hydrophilic property through contact angle measurement using distilled water. PC was irradiated with N, Ar, Xe ions at the irradiation energy of $20\;{\sim}\;50keV$ and the dose range of $5{\times}10^{15},\;1{\times}10^{16},\;7{\times}10^{16}\;ions/cm^2$. The contact angle of water has been reduced with increasing fluence and ion mass but increased with increasing implanted energy. The changes of chemical and structural property are discussed in view of infrared spectroscopy and FT-IR, XPS, which shows increasing C-O bonding and C-C bonding. The root mean square of surface roughness examined by means of AFM changed smoothly from 0.387nm to 0.207nm and the change of wettability was discussed with respect to elastic and inelastic collisions obtained as results of TRIM simulation. It was found that wettability of the modified PC surface was affected on change of functional group and nuclear stopping or linear energy transfer(LET, energy deposited per unit track length per ion) that causes chain scission by displacing atom from polymer chains, but was not greatly dependant on surface morphology.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.233-233
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• 2015

We report on a simple method for inducing physical and chemical property-gradient on nanoimprinted patterns by intensity-regulated plasma treatment under caved sample stage. As for the size gradient, a line pattern having a linewidth of 294.9 nm was etched to have gradually varying width from 277.4 nm to 147.9 nm. Modified pattern was proven to be adaptable to replica stamp for reversal patterning. To investigate the wettability gradient, imprinted nanopatterns were coated with fluoroalkylsilane to increase the hydrophobicity, and the surface was modified to have gradually varying wettability from hydrophobic to hydrophilic (contact angle was ${\sim}160^{\circ}$ to ${\sim}5^{\circ}$ on a single chip). This method is expected to be applicable to the selective adsorption of biological entities and hydrodynamic manipulation of liquid droplets for the pumpless microfluidics.

• Journal of Welding and Joining
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• v.16 no.3
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• pp.157-166
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• 1998

Recently as environmental pollution caused by Pb has posed a serious threat to the global environment, the trend to regulate the usage of Pb in electronic industry is one the rise. Currently, the solder alloy with high Pb content, Sn-37%Pb, is utilized in the electronic assembly therefore, the objective of this study is to develop an alternative solder alloy for the existing Sn-37%Pb solder alloy. First thing, this work choosed Sn-5%Pb-1.5%Ag, Sn-5%Pb-1.5%Ag-x%Bi(x=1~5%) for candidate solder alloys, and examined their properties such as melting range, wettability, microhardness, tensile property, oxidation behavior and microstructure. Wettability was on the same level of Sn-37%Pb. Dissolution of Pb ion in Sn-5%Pb solder was 0.46ppm. This solder alloy revealed cellular dendrite microstructure $\beta$-Sn matrix, Pb-rich phase, Ag/Sn, and Cu/Sn Intermetallic compounds. The range of solidification temperature was within 3$0^{\circ}C$. Also these alloy displayed higher tensile strength and lower elongation than Sn-37%Pb. The resistance of oxidation in Sn-5%Pb-1.5%Ag solder alloy was superior to that of Sn-37%Pb solder alloy. But that of Sn-5%Pb-1.5%Ag-5%Bi solder alloy was equal to that of Sn-37%Pb solder alloy.

• Journal of Welding and Joining
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• v.16 no.3
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• pp.148-156
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• 1998

The purpose of this study is to investigate the characteristics of Pb-Free Sn-2%Ag-Bi solder alloys. The solder alloys used in this study is Sn-2%Ag-(3,5,7,9%) Bi It is examined that their properties such as melting range, wettability, microstructure, microhardness, and tensile property. The addition of Bi(3,5,7,9%) lowered the melting point of the solder and the melting range was 196~203$^{\circ}C$. The wettability of the solder as equal to that of Sn-37% Pb solder. The morphology of structure did not change largely by addition of Bi. But the structure of cellular dendrite of linear type displayed. The tensile strength of the solder was superior to that of Sn-37%Pb solder. But the elongation was inferior to that of Sn-37%Pb solder. The hardness of Sn-2%Ag solder was tow times and that of Sn-2%Ag-Bi solder was three times of that in Sn-37%Pb solder. But the effect of increment of Bi content did not change largely.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.9
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• pp.103-108
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• 2008

In-plane shear tests were performed to investigate the shear property change of FRP by plasma modification. Graphite/epoxy prepreg was used as a test material and plasma source was a microwave (2.4GHz) type. Plasma was induced by oxygen gas and its flow rate was kept $4{\sim}5$sccm with low vacuum state of $10^{-3}$ Torr. Prepreg was stacked unidirectionally ($[0^0]_8$) after plasma modification. Wettability was determined by measuring a contact angle. The results showed that the contact angle was decreased from $86^0$ to $45^0$ after plasma modification. Shear strength was also improved by ${\sim}10%$. SEM examination was made on the fracture surface and functional group produced by the plasma modification was investigated by XPS.

• Journal of Information Display
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• v.9 no.4
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• pp.6-10
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• 2008

In this study, the selective-wettability-inscription (SWI) technique for the wet-etchingless fabrication of surface microstructures applicable to wide-viewing liquid crystal displays (LCDs) on plastic substrates was demonstrated. On the basis of the selective wetting of the photopolymer, the bi-level microstructures were spontaneously formed to serve as spacers for maintaining uniform cell gap and protrusions for the generation of multi-domains. The LC cell that has bi-level microstructures shows good extinction in the field-off state and a wide-viewing property in the field-on state. The SWI technique would be useful for the fabrication of flexible displays on plastic substrates.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.2
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• pp.181-184
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• 2006

Nd:YAG($\lambda$=266 nm, pulse) laser beam was irradiated on the PDMS surface to improve its chemical reaction, wettability, adhesive property. The various surface modification methods of PDMS were already studied using oxygen plasma, ozone and corona discharge. The surface modification using laser has the advantage of the simple experiment that only directly irradiated laser beam on the PDMS surface in the air. After the laser treatment, the PDMS surface was investigated using a contact angle measuring instrument. The contact angle was decreased with a increase of the surface oxygen content. In conclusion, the wettability of PDMS surface was improved by the laser treatment without changing of its bulk characteristics.