• Title/Summary/Keyword: wet etching

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Fabrication of a Nano-Wire Grid Polarizer for Brightness Enhancement in TFT-LCD Display (TFT-LCD용 휘도 성능을 향상시키는 나노 와이어 그리드 편광 필름의 제작)

  • Huh, Jong-Wook;Nam, Su-Yong
    • Journal of the Korean Graphic Arts Communication Society
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    • v.29 no.3
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    • pp.105-124
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    • 2011
  • TFT-LCD consists of LCD panel on the top, circuit unit on the side and BLU on the bottom. The recent development issues of BLU-dependent TFT-LCD have been power consumption minimization, slimmerization and size maximization. As a result of this trend, LED is adopted as BLU instead of CCFL to increase brightness and to reduce thickness. In liquid crystal displays, the light efficiency is below 10% due to the loss of light in the path from a light source to an LCD panel and presence of absorptive polarizer. This low efficiency results in low brightness and high power consumption. One way to circumvent this situation is to use a reflective polarizer between backlight units and LCD panels. Since a nano-wire grid polarizer has been known as a reflective polarizer, an idea was proposed that it can be used for the enhancement of the brightness of LCD. The use of reflective polarizing film is increasing as edge type LED TV and 3D TV markets are growing. This study has been carried out to fabrication of the nano-wire grid polarizer(NWGP) and investigated the brightness enhancement of LCD through polarization recycling by placing a NWGP between an c and a backlight unit. NWGPs with a pitch of 200nm were fabricated using laser interference lithography and aluminum sputtering and wet etching. And The NWGP fabrication process was using by the UV imprinting and was applied to plastic PET film. In this case, the brightness of an LCD with NWGPs was 1.21 times higher than that without NWGPs due to polarization recycling.

A Polysilicon Field Effect Transistor Pressure Sensor of Thin Nitride Membrane Choking Effect of Right After Turn-on for Stress Sensitivity Improvement (스트레스 감도 향상을 위한 턴 온 직후의 조름 효과를 이용한 얇은 질화막 폴리실리콘 전계 효과 트랜지스터 압력센서)

  • Jung, Hanyung;Lee, Junghoon
    • Journal of Sensor Science and Technology
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    • v.23 no.2
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    • pp.114-121
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    • 2014
  • We report a polysilicon active area membrane field effect transistor (PSAFET) pressure sensor for low stress deflection of membrane. The PSAFET was produced in conventional FET semiconductor fabrication and backside wet etching. The PSAFET located at the front side measured pressure change using 300 nm thin-nitride membrane when a membrane was slightly strained by the small deflection of membrane shape from backside with any physical force. The PSAFET showed high sensitivity around threshold voltage, because threshold voltage variation was composed of fractional function form in sensitivity equation of current variation. When gate voltage was biased close to threshold voltage, a fractional function form had infinite value at $V_{tn}$, which increased the current variation of sensitivity. Threshold voltage effect was dominant right after the PSAFET was turned on. Narrow transistor channel established by small current flow was choked because electron could barely cross drain-source electrodes. When gate voltage was far from threshold voltage, threshold voltage effect converged to zero in fractional form of threshold voltage variations and drain current change was mostly determined by mobility changes. As the PSAFET fabrication was compatible with a polysilicon FET in CMOS fabrication, it could be adapted in low pressure sensor and bio molecular sensor.

The Fabrication and Magnetoresistance of Nanometer-sized Spin Device Driven by Current Perpendicular to the Plane (수직전류 인가형 나노 스핀소자의 제조 및 자기저항 특성)

  • Chun, M.G.;Lee, H.J.;Jeung, W.Y.;Kim, K.Y.;Kim, C.G.
    • Journal of the Korean Magnetics Society
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    • v.15 no.2
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    • pp.61-66
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    • 2005
  • In order to make submicron cell for spin-injection device, lift-off method using Pt stencil and wet etching was chosen. This approach allows batch fabrication of stencil substrate with electron-beam lithography. It simplifies the process between magnetic film stack deposition and final device testing, thus enabling rapid turnaround in sample fabrication. Submicron junctions with size of $200nm{\times}300nm$ and $500nm{\times}500nm$ 500 nm and pseudo spin valve structure of $CoFe(30{\AA})/Cu(100{\AA})/CoFe(120{\AA}$) was deposited into the nanojunctions. MR ratio was 0.8 and $1.1{\%}$, respectively and spin transfer effect was confirmed with critical current of $7.65{\times}10^7A/cm^2$.

Shape anisotropy and magnetic properties of Co/Ni anti-dot arrays

  • Deshpande, N.G.;Seo, M.S.;Kim, J.M.;Lee, S.J.;Lee, Y.P.;Rhee, J.Y.;Kim, K.W.
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.444-444
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    • 2011
  • Recently, patterned magnetic films and elements attract a wide interest due to their technological potentials in ultrahigh-density magnetic recording and spintronic devices. Among those patterned magnetic structures, magnetic anti-dot patterning induces a strong shape anisotropy in the film, which can control the magnetic properties such as coercivity, permeability, magnetization reversal process, and magneto-resistance. While majority of the previous works have been concentrated on anti-dot arrays with a single magnetic layer, there has been little work on multilayered anti-dot arrays. In this work, we report on study of the magnetic properties of bilayered anti-dot system consisting of upper perforated Co layer of 40 nm and lower continuous Ni layer of 5 nm thick, fabricated by photolithography and wet-etching processes. The magnetic hysteresis (M-H) loops were measured with a superconducting-quantum-interference-device (SQUID) magnetometer (Quantum Design: MPMS). For comparison, investigations on continuous Co thin film and single-layer Co anti-dot arrays were also performed. The magnetic-domain configuration has been measured by using a magnetic force microscope (PSIA: XE-100) equipped with magnetic tips (Nanosensors). An external electromagnet was employed while obtaining the MFM images. The MFM images revealed well-defined periodic domain networks which arise owing to the anisotropies such as magnetic uniaxial anisotropy, configurational anisotropy, etc. The inclusion of holes in a uniform magnetic film and the insertion of a uniform thin Ni layer, drastically affected the coercivity as compared with single Co anti-dot array, without severely affecting the saturation magnetization ($M_s$). The observed changes in the magnetic properties are closely related to the patterning that hinders the domain-wall motion as well as to the magneto-anisotropic bilayer structure.

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Microstructure and Electrical Resistivity of Ink-Jet Printed Nanoparticle Silver Films under Isothermal Annealing (잉크젯 프린팅된 은(Ag) 박막의 등온 열처리에 따른 미세조직과 전기 비저항 특성 평가)

  • Choi, Soo-Hong;Jung, Jung-Kyu;Kim, In-Young;Jung, Hyun-Chul;Joung, Jae-Woo;Joo, Young-Chang
    • Korean Journal of Materials Research
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    • v.17 no.9
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    • pp.453-457
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    • 2007
  • Interest in use of ink-jet printing for pattern-on-demand fabrication of metal interconnects without complicated and wasteful etching process has been on rapid increase. However, ink-jet printing is a wet process and needs an additional thermal treatment such as an annealing process. Since a metal ink is a suspension containing metal nanoparticles and organic capping molecules to prevent aggregation of them, the microstructure of an ink-jet printed metal interconnect 'as dried' can be characterized as a stack of loosely packed nanoparticles. Therefore, during being treated thermally, an inkjet-printed interconnect is likely to evolve a characteristic microstructure, different from that of the conventionally vacuum-deposited metal films. Microstructure characteristics can significantly affect the corresponding electrical and mechanical properties. The characteristics of change in microstructure and electrical resistivity of inkjet-printed silver (Ag) films when annealed isothermally at a temperature between 170 and $240^{\circ}C$ were analyzed. The change in electrical resistivity was described using the first-order exponential decay kinetics. The corresponding activation energy of 0.44 eV was explained in terms of a thermally-activated mechanism, i.e., migration of point defects such as vacancy-oxygen pairs, rather than microstructure evolution such as grain growth or change in porosity.

Eutectic Temperature Effect on Au Thin Film for the Formation of Si Nanostructures by Hot Wire Chemical Vapor Deposition

  • Ji, Hyung Yong;Parida, Bhaskar;Park, Seungil;Kim, MyeongJun;Peck, Jong Hyeon;Kim, Keunjoo
    • Current Photovoltaic Research
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    • v.1 no.1
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    • pp.63-68
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    • 2013
  • We investigated the effects of Au eutectic reaction on Si thin film growth by hot wire chemical vapor deposition. Small SiC and Si nano-particles fabricated through a wet etching process were coated and biased at 50 V on micro-textured Si p-n junction solar cells. Au thin film of 10 nm and a Si thin film of 100 nm were then deposited by an electron beam evaporator and hot wire chemical vapor deposition, respectively. The Si and SiC nano-particles and the Au thin film were structurally embedded in Si thin films. However, the Au thin film grew and eventually protruded from the Si thin film in the form of Au silicide nano-balls. This is attributed to the low eutectic bonding temperature ($363^{\circ}C$) of Au with Si, and the process was performed with a substrate that was pre-heated at a temperature of $450^{\circ}C$ during HWCVD. The nano-balls and structures showed various formations depending on the deposited metals and Si surface. Furthermore, the samples of Au nano-balls showed low reflectance due to surface plasmon and quantum confinement effects in a spectra range of short wavelength spectra range.

Fabrication and Characteristic of C-doped Base AlGaAs/GaAs HBT using Carbontetrachloride $CCI_4$ ($CCI_4$ 를 사용하여 베이스를 탄소도핑한 AlGaAs/GaAs HBT의 제작 및 특성)

  • 손정환;김동욱;홍성철;권영세
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.30A no.12
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    • pp.51-59
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    • 1993
  • A 4${\times}10^{19}cm^{3}$ carbon-doped base AlGaAs/GaAs HBY was grown using carbontetracholoride(CCl$_4$) by atmospheric pressure MOCVD. Abruptness of emitter-base junction was characterized by SIMS(secondary ion mass spectorscopy) and the doping concentration of base layer was confirmed by DXRD(double crystal X-ray diffractometry). Mesa-type HBTs were fabricated using wet etching and lift-off technique. The base sheet resistance of R$_{sheet}$=550${\Omega}$/square was measured using TLM(transmission line model) method. The fabricated transistor achieved a collector-base junction breakdown voltage of BV$_{CBO}$=25V and a critical collector current density of J$_{O}$=40kA/cm$^2$ at V$_{CE}$=2V. The 50$\times$100$\mu$$^2$ emitter transistor showed a common emitter DC current gain of h$_{FE}$=30 at a collector current density of JS1CT=5kA/cm$^2$ and a base current ideality factor of ηS1EBT=1.4. The high frequency characterization of 5$\times$50$\mu$m$^2$ emitter transistor was carried out by on-wafer S-parameter measurement at 0.1~18.1GHz. Current gain cutoff frequency of f$_{T}$=27GHz and maximum oscillation frequency of f$_{max}$=16GHz were obtained from the measured Sparameter and device parameters of small-signal lumped-element equivalent network were extracted using Libra software. The fabricated HBT was proved to be useful to high speed and power spplications.

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High Frequency Impedance of Meander Pattern Fabricated by Co-base Amorphous Ribbon (Co계 아몰퍼스리본을 이용하여 제작한 마안더패턴의 고주파 임피던스특성)

  • Shin, Kwang-Ho;Park, Kyung-Il;Geon, Sa-Gong;Song, Jae-Yeon;Kim, Young-Hak
    • Journal of the Korean Magnetics Society
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    • v.13 no.4
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    • pp.160-164
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    • 2003
  • The external magnetic field dependency of the impedance, resistance, and inductance of the meander pattern fabricated by using Co-base amorphous ribbon has been investigated in the frequency range of 300 ㎑∼1 ㎓. The amorphous ribbon was patterned to the meander pattern through conventional photolithography and wet etching process. The extremely high sensitivity in impedance changing ratio by external magnetic field was observed. This is due to the transverse magnetic anisotropy the pattern which was induced by magnetic field annealing. The impedance had peak value at the external field of -13 Oe and the impedance changing ratio 100 ${\times}$ (Z$\_$13/-Z$\_$0/)/Z$\_$0/) was about 210% at the frequency of 50 MHz.

Growth behavior on initial layer of ZnO:P layers grown by magnetron sputtering with controlled by $O_2$ partial pressure

  • Kim, Yeong-Lee;An, Cheol-Hyeon;Bae, Yeong-Suk;Kim, Dong-Chan;Jo, Hyeong-Gyun
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2009.05a
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    • pp.28.1-28.1
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    • 2009
  • The superior properties of ZnO such as high exciton binding energy, high thermal and chemical stability, low growth temperature and possibility of wet etching process in ZnO have great interest for applications ranging from optoelectronics to chemical sensor. Particularly, vertically well-aligned ZnO nanorods on large areas with good optical and structural properties are of special interest for the fabrication of electronic and optical nanodevices. Currently, low-dimensional ZnO is synthesized by metal-organic chemical vapor deposition (MOCVD), molecular beam epitaxy (MBE), thermal evaporation, and sol.gel growth. Recently, our group has been reported about achievement the growth of Ga-doped ZnO nanorods using ZnO seed layer on p-type Si substrate by RF magnetron sputtering system at high rf power and high growth temperature. However, the crystallinity of nanorods deteriorates due to lattice mismatch between nanorods and Si substrate. Also, in the growth of oxide using sputtering, the oxygen flow ratio relative to argon gas flow is an important growth parameter and significantly affects the structural properties. In this study, Phosphorus (P) doped ZnO nanorods were grown on c-sapphire substrates without seed layer by radio frequency magnetron sputtering with various argon/oxygen gas ratios. The layer change films into nanorods with decreasing oxygen partial pressure. The diameter and length of vertically well-aligned on the c-sapphire substrate are in the range of 51-103 nm and about 725 nm, respectively. The photoluminescence spectra of the nanorods are dominated by intense near band-edge emission with weak deep-level emission.

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Piezo-electrically Actuated Micro Corner Cube Retroreflector (CCR) for Free-space Optical Communication Applications

  • Lee, Duk-Hyun;Park, Jae-Y.
    • Journal of Electrical Engineering and Technology
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    • v.5 no.2
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    • pp.337-341
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    • 2010
  • In this paper, an extremely low voltage operated micro corner cube retroreflector (CCR) was fabricated for free-space optical communication applications by using bulk silicon micromachining technologies. The CCR was comprised of an orthogonal vertical mirror and a horizontal actuated mirror. For low voltage operation, the horizontal actuated mirror was designed with two PZT cantilever actuators, torsional bars, hinges, and a mirror plate with a size of $400{\mu}m{\times}400{\mu}m$. In particular, the torsional bars and hinges were carefully simulated and designed to secure the flatness of the mirror plate by using a finite element method (FEM) simulator. The measured tilting angle was approximately $2^{\circ}$ at the applied voltage of 5 V. An orthogonal vertical mirror with an extremely smooth surface texture was fabricated using KOH wet etching and a double-SOI (silicon-on-insulator) wafer with a (110) silicon wafer. The fabricated orthogonal vertical mirror was comprised of four pairs of two mutually orthogonal flat mirrors with $400{\mu}m4 (length) $\times400{\mu}m$ (height) $\times30{\mu}m$ (thickness). The cross angles and surface roughness of the orthogonal vertical mirror were orthogonal, almost $90^{\circ}$ and 3.523 nm rms, respectively. The proposed CCR was completed by combining the orthogonal vertical and horizontal actuated mirrors. Data transmission and modulation at a frequency of 10 Hz was successfully demonstrated using the fabricated CCR at a distance of approximately 50 cm.