• Corrosion Science and Technology
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• 제6권2호
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• pp.74-76
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• 2007

The increasing interest in the corrosion properties of weld joints in the corrosive environment is placing stringent demands on the manufacturing techniques and performance requirements, and the manufacture employs the high quality and efficiency welding process to produce welds. Welding plays an important role in the fabrication of chemical plants, nuclear power plant, ship construction, and this has led to an increasing attention to the corrosion resistant weld joints. This paper covers a recent technical trends of welding technologies for corrosion resistance properties including the COMPENDEX DB analysis of welding materials, welding process, and welding fabrications.

• Corrosion Science and Technology
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• 제6권1호
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• pp.33-35
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• 2007

Welding technology plays an important role in the fabrication of structure, and this has led to an increasing attention in the use of high quality advanced welding technology such as power beam welding, friction stir welding, and laser-arc hybrid welding, etc. At the same time, welding can influence various factors in the performance of plant and equipment, and corrosion behaviour of weldment has been one of the major issues for both welding and corrosion research engineers. The aim of this paper is to give a short survey of the recent technical trends of welding and corrosion behaviours including the electrochemical corrosion, stress corrosion cracking, and corrosion fatigue in connection with the welding materials, welding process, and welding fabrication.

• Journal of Welding and Joining
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• 제33권3호
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• pp.19-24
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• 2015

Joint properties of electric control unit (ECU) module using Sn-Cu-(X)Al(Si) lead-free solder alloy were investigated for automotive electronics module. In this study, Sn-0.5Cu-0.01Al(Si) and Sn-0.5Cu-0.03Al(Si) (wt.%) lead-free alloys were fabricated as bar type by doped various weight percentages (0.01 and 0.03 wt.%) of Al(Si) alloy to Sn-0.5Cu. After fabrications of lead-free alloys, the ball-type solder alloys with a diameter of 450 um were made by rolling and punching. The melting temperatures of 0.01Al(Si) and 0.03Al(Si) were 230.2 and $230.8^{\circ}C$, respectively. To evaluation of properties of solder joint, test printed circuit board (PCB) finished with organic solderability perseveration (OSP) on Cu pad. The ball-type solders were attached to test PCB with flux and reflowed for formation of solder joint. The maximum temperature of reflow was $260^{\circ}C$ for 50s above melting temperature. And then, we measured spreadability and shear strength of two Al(Si) solder materials compared to Sn-0.7Cu solder material used in industry. And also, microstructures in solder and intermetallic compounds (IMCs) were observed. Moreover, thickness and grain size of $Cu_6Sn_5$ IMC were measured and then compared with Sn-0.7Cu. With increasing the amounts of Al(Si), the $Cu_6Sn_5$ thickness was decreased. These results show the addition of Al(Si) could suppress IMC growth and improve the reliability of solder joint.