• Title/Summary/Keyword: via holes

Search Result 139, Processing Time 0.028 seconds

Analysis and Suppression of Parasitic Resonance in Millimeter-wave Ceramic Packages (밀리미터파용 세라믹 패키지에서의 기생공진 해석 및 억제 방법)

  • Seo, Jae-Ok;Kim, Jin-Ryang;Lee, Hae-Yeong
    • Journal of the Institute of Electronics Engineers of Korea TC
    • /
    • v.39 no.2
    • /
    • pp.101-107
    • /
    • 2002
  • High performance packages must protect circuits from the internal leakaged-electromagnetic fields as well as the surrounding. In this paper, we characterized an electromagnetically-shielded millimeter-wave ceramic package from 20 to 40 ㎓ using FEM(Finite Element Method). From these calculation results, the parasitic resonance is observed at 33.4 ㎓. We use metal-filled via-holes at the ceramic package walls and resonance has been suppressed in a frequency range from 20 to 40 ㎓. These calculation results will be helpful for MMIC packaging using electromagnetically-shielded millimeter-wave ceramic packages.

A Latch-Up Immunized Lateral Trench IGBT with $p^{+}$ Diverter Structure for Smart Power IC (스마트 파워 IC를 위한 $p^{+}$ Diverter 구조의 횡형 트랜치 IGBT)

  • 문승현;강이구;성만영;김상식
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.14 no.7
    • /
    • pp.546-550
    • /
    • 2001
  • A new Lateral Trench Insulated Gate Bipolar Transistor(LTIGBT) with p$^{+}$ diverter was proposed to improve the characteristics of the conventional LTIGBT. The forward blocking voltage of the proposed LTIGBT with p$^{+}$ diverter was about 140V. That of the conventional LTIGBT of the same size was 105V. Because the p$^{+}$ diverter region of the proposed device was enclosed trench oxide layer, he electric field moved toward trench-oxide layer, and punch through breakdown of LTIGBT with p$^{+}$ diverter was occurred, lately. Therefore, the p$^{+}$ diverter of the proposed LTIGBT didn't relate to breakdown voltage in a different way the conventional LTIGBT. The Latch-up current densities of the conventional LTIGBT and proposed LTIGBT were 540A/$\textrm{cm}^2$, and 1453A/$\textrm{cm}^2$, respectively. The enhanced latch-up capability of the proposed LTIGBT was obtained through holes in the current directly reaching the cathode via the p$^{+}$ divert region and p$^{+}$ cathode layer beneath n$^{+}$ cathode layer./ cathode layer.

  • PDF

Development of 3D-based On-Machine Measurement Operating System

  • Yoon Gil-Sang;Heo Young-Moo;Kim Gun-Hee;Cho Myeong-Woo
    • International Journal of Precision Engineering and Manufacturing
    • /
    • v.6 no.3
    • /
    • pp.45-50
    • /
    • 2005
  • This paper proposed an efficient manufacturing system using the OMM (on-machine measurement) system. The OMM system is software-based 3D modeler for inspection on machine, and it is interfaced with machine tools via RS232C. The software is composed of two inspection modules; one is touch probe operating module, and the other is laser displacement sensor operating module. The module for touch probe needs the inspection feature extracted from CAD data. The touch probe moves to workpiece by three operating modes as follows: manual, general and automatic mode. The operating module of the laser displacement sensor is used to inspect profiles and very small holes. An advantage of this inspection method is the ability to execute on-line inspection during machining or afterward. The efficiency of proposed system which can predict and define the machining errors of each process was verified, so the developed system was applied to inspect a mold-base (cavity, core).

Design of The Dual-band Resonator for Magnetic Resonance Wireless Power Transfer (자기공진방식 이중대역 무선전력전송 공진기 설계)

  • Yoon, Nanae;Seo, Chulhun
    • Journal of the Institute of Electronics and Information Engineers
    • /
    • v.52 no.12
    • /
    • pp.41-45
    • /
    • 2015
  • In this paper, the single port dual-band resonator for magnetic resonance wireless power transfer is proposed. The proposed dual-band resonator is consists of 20 turns spiral coil, a single loop, matching circuit, lumped elements, and a single port. The two sides of the matching circuit are connected to via holes. The spiral coil is operated at MF-band and single loop is operated at HF-band, respectively. We use two of the same structure resonators and simulated and the power transfer efficiency was calculated. The efficiency of simulation and measurement is above 60% at the MF and HF bands, and the distance is 100 mm.

Outcome of Open Reduction Via Retromandibular Approach for Mandibular Subcondyle Fracture (하악골 과두경부 골절에 있어서 후하악부 절개법을 이용한 관혈적 정복술의 유용성)

  • Lee, Hyung Chul;Kang, Dong Hee;Koo, Sang Hwan;Park, Seung Ha
    • Archives of Plastic Surgery
    • /
    • v.32 no.6
    • /
    • pp.739-743
    • /
    • 2005
  • Subcondylar fractures have generally been treated by intermaxillary fixation except in cases where there is an absolute indication for open reduction. The reason behind a less aggressive surgical approach lies on the inherent difficulties in manipulating fragments in such a small area at the risk of damaging facial nerves or vessels such as the internal maxillary artery. However, long-term follow-up studies showed that conservative treatment of subcondylar fractures results in disturbances of occlusal function, deviation of the mandible, internal derangement of the temporomandibular joint, and ankylosis of the joint. We carried out open reduction of dislocated subcondylar fractures in 14 patients from 2000 to 2004 by a retromandibular approach. After the reduction of fractured bone, two H-shaped miniplates with 6 holes were fixed with screws at the anterior and posterior surfaces of the subcondyle. The retromandibular approach allowed good access and easy manipulation of the subcondyle. Immediate relief from malocclusion and correction of mandibular midline shifting were observed in all patients. Late temporomandibular dysfunction and ankylosis were not observed. Open reduction with plate osteosynthesis made it possible to avoid IMF in 7 of the 14 patients. The present study shows that open reduction through this retromandibular approach can produce good outcome in adult patients with subcondylar fracture.

Vorticity Analysis Associated with Drafting Cylinders for Pneumatic Spinning

  • Bergada J.M.;Valencia E.;Coll Ll
    • Fibers and Polymers
    • /
    • v.7 no.2
    • /
    • pp.146-157
    • /
    • 2006
  • Traditional spinning systems have reached profitability limits in developed countries due to high production costs and low system productivity. Pneumatic spinning is seen as a developing system, because productivity is much higher than conventional systems. This study evaluates one of the main problems to increase productivity in pneumatic spinning, where air mass-flow is dragged by the drafting cylinders. This flow interacts with the incoming fibres deviating them from their expected path. Via laser anemometry, airflow velocity distribution around drafting cylinders has been measured and it has been found that vorticity is created at the cylinder's inlet. Extensive CFD simulation on the air flow dragged by the cylinders has given a clear insight into the vortex created, producing valuable information on how cylinder design affects the vorticity created. Several drafting cylinder designs have been tested without giving any improvement in productivity. However, the use of a drafting cylinder with holes in it produced good results to the problem of air currents, strongly reducing them and therefore allowing a sharp increase in yarn quality, as well as an increase in productivity. An extensive study on vortex kinematics has been undertaken, bringing with it a better understanding of vortex creation, development and breakdown.

Methods to Measure the Critical Dimension of the Bottoms of Through-Silicon Vias Using White-Light Scanning Interferometry

  • Hyun, Changhong;Kim, Seongryong;Pahk, Heuijae
    • Journal of the Optical Society of Korea
    • /
    • v.18 no.5
    • /
    • pp.531-537
    • /
    • 2014
  • Through-silicon vias (TSVs) are fine, deep holes fabricated for connecting vertically stacked wafers during three-dimensional packaging of semiconductors. Measurement of the TSV geometry is very important because TSVs that are not manufactured as designed can cause many problems, and measuring the critical dimension (CD) of TSVs becomes more and more important, along with depth measurement. Applying white-light scanning interferometry to TSV measurement, especially the bottom CD measurement, is difficult due to the attenuation of light around the edge of the bottom of the hole when using a low numerical aperture. In this paper we propose and demonstrate four bottom CD measurement methods for TSVs: the cross section method, profile analysis method, tomographic image analysis method, and the two-dimensional Gaussian fitting method. To verify and demonstrate these methods, a practical TSV sample with a high aspect ratio of 11.2 is prepared and tested. The results from the proposed measurement methods using white-light scanning interferometry are compared to results from scanning electron microscope (SEM) measurements. The accuracy is highest for the cross section method, with an error of 3.5%, while a relative repeatability of 3.2% is achieved by the two-dimensional Gaussian fitting method.

High-Q Resonator with Substrate Integrated Waveguide(SIW) Structure (높은 Q 값을 갖는 기판 집적형 도파관(SIW) 공진기)

  • Yun Tae-Soon;Nam Hee;Lee Jong-Chul
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
    • /
    • v.17 no.4 s.107
    • /
    • pp.324-329
    • /
    • 2006
  • In this paper, a resonator with the substrate integrated waveguide(SIW) structure at the satellite communication band is presented. The SIW structure is realized by via-holes on the dielectric substrate and has an advantage of integration with other circuits. For the measurement, a designed back-to-back transition has the insertion loss of 0.4 dB at 18 GHz. Also, the quality factor of the resonator with the SIW structure including back-to-back transition is obtained to be 222. The high-Q resonator with the SIW structure can be used in filter, oscillator, and voltage controlled oscillator.

Low-temperature Synthesis of Graphene-CdLa2S4 Nanocomposite as Efficient Visible-light-active Photocatalysts

  • Zhu, Lei;Oh, Won-Chun
    • Journal of the Korean Ceramic Society
    • /
    • v.52 no.3
    • /
    • pp.173-179
    • /
    • 2015
  • We report the facile synthesis of graphene-$CdLa_2S_4$ composite through a facile solvothermal method at low temperature. The as-prepared products were characterized by X-ray diffraction (XRD) and by Scanning electron microscopy (SEM) with energy dispersive X-ray (EDX) analysis and BET analysis, revealing the uniform covering of the graphene nanosheet with $CdLa_2S_4$ nanocrystals. The as-prepared samples show a higher efficiency for the photocatalytic degradation of typical MB dye compared with P25 and $CdLa_2S_4$ bulk nanoparticles. The enhancement of visible-light-responsive photocatalytic properties by decolorization of Rh.B dye may be attributed to the following causes. Firstly, graphene nanosheet is capable of accepting, transporting and storing electrons, and thus retarding or hindering the recombination of the electrons with the holes remaining on the excited $CdLa_2S_4$ nanoparticles. Secondly, graphene nanosheet can increase the adsorption of pollutants. The final cause is that their extended light absorption range. This work not only offers a simple way to synthesize graphene-based composites via a one-step process at low temperature but also a path to obtain efficient functional materials for environmental purification and other applications.

Stencil-based 3D facial relief creation from RGBD images for 3D printing

  • Jung, Soonchul;Choi, Yoon-Seok;Kim, Jin-Seo
    • ETRI Journal
    • /
    • v.42 no.2
    • /
    • pp.272-281
    • /
    • 2020
  • Three-dimensional (3D) selfie services, one of the major 3D printing services, print 3D models of an individual's face via scanning. However, most of these services require expensive full-color supporting 3D printers. The high cost of such printers poses a challenge in launching a variety of 3D printing application services. This paper presents a stencil-based 3D facial relief creation method employing a low-cost RGBD sensor and a 3D printer. Stencil-based 3D facial relief is an artwork in which some parts are holes, similar to that in a stencil, and other parts stand out, as in a relief. The proposed method creates a new type of relief by combining the existing stencil techniques and relief techniques. As a result, the 3D printed product resembles a two-colored object rather than a one-colored object even when a monochrome 3D printer is used. Unlike existing personalization-based 3D printing services, the proposed method enables the printing and delivery of products to customers in a short period of time. Experimental results reveal that, compared to existing 3D selfie products printed by monochrome 3D printers, our products have a higher degree of similarity and are more profitable.