• 제목/요약/키워드: via

검색결과 27,661건 처리시간 0.048초

팸토초 레이저를 이용한 3차원 패키징 기술 (3D Packaging Technology Using Femto Laser)

  • 김주석;신영의;김종민;한성원
    • 대한용접접합학회:학술대회논문집
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    • 대한용접접합학회 2006년 추계학술발표대회 개요집
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    • pp.190-192
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    • 2006
  • The 3-dimensional(3D) chip stacking technology is one of the leading technologies to realize a high density and high performance system in package(SIP). It could be found that it is the advanced process of through-hole via formation with the minimum damaged on the Si-wafer. Laser ablation is very effective method to penetrate through hole on the Si-wafer because it has the advantage that formed under $100{\mu}m$ diameter through-hole via without using a mask. In this paper, we studied the optimum method for a formation of through-hole via using femto-second laser heat sources. Furthermore, the processing parameters of the specimens were several conditions such as power of output, pulse repetition rate as well as irradiation method and time. And also the through-hole via form could be investigated and analyzed by microscope and analyzer.

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Stabilization of Co Semigroups in infinite dimensional systems by a compact linear feedback via the steady state Riccati equation

  • Park, Dong-Jo
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 1987년도 한국자동제어학술회의논문집(한일합동학술편); 한국과학기술대학, 충남; 16-17 Oct. 1987
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    • pp.729-733
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    • 1987
  • Stability of Co Semigroups perturbed via the steady state Riccati equation (SSRE) is studied. We consider an infinite dimensional system : .chi. over dot = A.chi. + Bu, in, (A), domain of A, where A is the infinitesimal generator of a Co semigroup [T(t), t.geq.0] in H. If the original Co semigroup [T(t), t.geq.0] has a lower bound : vertical bar T(t).chi. vertical bar .geq. k vertical bar .chi. vertical bar, for all .chi. in H. t.geq. 0 and k>0, then the perturbed Co semigroup via the SSRE, where the feedback operator B is compact, cannot be exponentially stable. Physical interpretation of this result is as follows : in real applications, a finite number of actuators are available, therefore the operator B is compact. When the original system is inherently unstable, that is, has an infinite number of unstable modes, the perturbed system via the SSRE cannot be stable with a uniform decay rate.

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Studies of Harmonic Performance on PBG Via Structures

  • Tong Ming-Sze;Kim Hyeong-Seok;Lu Yilong
    • KIEE International Transactions on Electrophysics and Applications
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    • 제5C권2호
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    • pp.81-85
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    • 2005
  • This paper presents some interesting results regarding the harmonic performance on the photonic band-gap (PBG) structures formed by periodic conducting vias. Study on PBG structures has been one of the major topics in electromagnetics, microelectronics, and communications areas. In most of the studies, the band-gap filtering behavior was fulfilled by a periodic pattern of perforations on the ground planes of microstrip lines. Nevertheless, the PBG characteristics can also be realized using a periodic via-pattern along the transmission-line circuits. Hence, some of the via-typed PBG structures are studied and their frequency characteristics in terms of the scattering parameters are presented. It is found that by varying the length of vias with respect to the period pattern, different harmonic performances are observed.

모듈 합성을 위한 비아 겹침이 없는 미로 배선 (Non-stacked-via maze ruting for module generation)

  • 권성훈;오명섭;신현철
    • 전자공학회논문지A
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    • 제32A권1호
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    • pp.222-233
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    • 1995
  • For effective module generation, a detailed router which can handle complicated routing regions on multimple layers of interconnection under various constraints is necessary. In this paper, a new improved maze routing technique is described, which can find the shortest path for each net without allowing stacked vias. In this method, two cost values are stored at each grid point. The cost values represent the routing costs from the terminal of the net being routed to the grid point. One cost value shows the cost of the shortest path without making a via at the grid point and the other cost value shows that with making a via at the grid point. This is the first systematic maze routing technique which can find the shortest path without via-stacking.

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LTCC 기판의 미세 비아홀 펀칭 중 공정 변수의 영향 평가 (Evaluation of Punching Process Variables Influencing Micro Via-hole Quality of LTCC Green Sheet)

  • 백승욱;임성한;오수익
    • 소성∙가공
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    • 제14권3호
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    • pp.277-281
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    • 2005
  • LTCC(Low temperature co-fired ceramic) is being recognized as a significant packaging material of electrical devices for the advantages such as relatively low temperature being needed for process, low conductor resistance and high printing resolution. In the process of LTCC electrical devices, the punched via-hole quality is one of the most important factors on the performance of the device. However, its mechanism is very complicated and optimization of the process seems difficult. In this paper, to clarify the process, via-hole punching experiments were carried out and the punched holes were examined in terms of their burr formation. The effects of thickness of PET sheet, ceramic sheet and punch-to- die clearance on via-hole quality were also discussed. Optimum process conditions are proposed and a factor $\kappa$ is introduced to express effect of the process variables.

자화된 유도결합 플라즈마에서의 $SF_6/O_2$ 특성 및 Silicon Via에 대한 식각 특성

  • 김완수;이우현;박완재;김혁;황기웅
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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    • pp.455-456
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    • 2012
  • 최근 반도체 소자의 Design rule의 지속적인 축소로 물리적 한계에 다가서고 있는 상황이다. 이에 대한 대책으로 여러가지 방안이 대두되고 있으며 그 중 하나로 TSV (Through Silicon Via)를 적용한 3D 혹은 stack scheme이 개발되고 있다. TSV 공정은 throughput의 향상을 위해 high etch rate를 기본 필요 조건으로 한다. 본 연구에서는 자화된 유도결합 식각 장치하에서 $SF_6/O_2$ 플라즈마의 특성을 Langmuir Probe와 Actinometry를 이용하여 측정하고 자화여부에 따른 특성 차이와 이의 Silicon Via에 대한 특성에 대해 살펴보았다.

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VIA기반의 통신 인터페이스 개발 (Development of Communication Interface Based on Vl Architecture)

  • 이상기;이윤영;서대화
    • 한국정보과학회:학술대회논문집
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    • 한국정보과학회 2001년도 가을 학술발표논문집 Vol.28 No.2 (3)
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    • pp.85-87
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    • 2001
  • 하드웨어와 소프트웨어의 발전과 함께 컴퓨터에서 처리 해야 할 데이터량이 크게 증가하고 있다. 클러스터 내의 node들 사이에서 이런 대용량의 데이터들을 보다 빠르게 전송하기 위해서 Lightweight Messaging 기법이 등장하였으며, 대표적으로 AM, FM, U-Net, VIA등이 있다. 이 중에서 VIA는 커널 수준에서 구현된 TCP/IP를 대신해서 사용자 수준에서 커널을 거치지 않고 네트워크 장치와 직접적으로 통신을 할 수 있게 하여 다양한 분야에서 사용되고 있으며, 새로운 프로토콜의 표준으로 자리를 잡아가고 있다. 그러나 이러한 장점에도 불구하고 프로그래밍의 난이성 때문에 제대로 숙지하기 가지는 많은 시간의 투자가 필요한 것이 사실이다. 이에 이 논문에서는 EVIL(Easy-to-use Virtual Interface Library)이라는, 개발자들이 좀더 쉽게 접근할 수 있는 라이브러리를 제안하였다 그리고 EVIL. Native VIA TCP/IP로 각각 같은 역할을 하는 프로그램을 작성하여 기존의 프로토콜들과 성능을 비교하였다.

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미세 후두현미경술시 윤상갑상막천자를 통한 고빈도 제트환기법 (High Frequency Jet Ventilation via Cricothyroid Membrane Puncture under Microlaryngoscopic Surgery)

  • 양훈식;김용주;김춘길
    • 대한기관식도과학회지
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    • 제1권1호
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    • pp.109-115
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    • 1995
  • High frequency Jet ventilation (HFJV) via cricothyroid membrane puncture contols frequency of ventilation as 20-200/min and persuits adequate gas exchange. HFJV was known to have advantages such as improvement of PaO$_2$, lesser barotrauma, stable hemodynamic effects, good operative field and lesser movement of head. The purpose of this study was to clarify the advantages of HFJV in cases of microlaryngeal surgery which operating time was expected even within 30 minutes. Twenty-eight patients were divided two groups : 1)control group : general endotracheal Intubation anesthesia. 2)experimental group : HFJV via cricothyroid membrane puncture with intravenous anesthesia, frequency 40/min, I/E ratio 40%, driving pressure 40 psi. We analyzed blood pressure, arterial blood gas, score of general condition and recovery time after operation. In conclusion, HFJV via cricothyroid membrane puncture had a good score of general condition and rapid recovery of consciousness, although some accumulation of P$CO_2$and elevation of blood pressure.

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Miniaturized Broadband ENG ZOR Antenna Using a High Permeability Substrate

  • Ko, Seung-Tae;Lee, Jeong-Hae
    • Journal of electromagnetic engineering and science
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    • 제11권3호
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    • pp.201-206
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    • 2011
  • This paper presents a miniaturized epsilon negative (ENG) zeroth-order resonance (ZOR) patch antenna with an improved bandwidth. The miniaturization and the broad bandwidth of the ENG ZOR patch antenna are achieved by using a meandered via and a high permeability substrate instead of a straight via and a dielectric substrate. The use of a meandered via allows miniaturization of the ENG ZOR patch antenna without narrowing the bandwidth. The use of a high permeability substrate allows further miniaturization of the ENG ZOR patch antenna and improvement of the bandwidth. A high permeability substrate consisting of a multi-layered substrate is designed to have a small material loss. The antenna (kr=0.32) has a 10 dB fractional bandwidth of ~1 %, which is 1.74 times as broad as that of an antenna with a dielectric substrate.

Beam Efficiency of Wireless Power Transmission via Radio Waves from Short Range to Long Range

  • Shinohara, Naoki
    • Journal of electromagnetic engineering and science
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    • 제10권4호
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    • pp.224-230
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    • 2010
  • Wireless power transmission (WPT) is useful technology in near future. There are some kinds of the WPT technologies, WPT via radio waves, resonance coupling, and inductive. Especially the WPT via radio waves is used for multi-purposes from short range to long range application. However, unfortunately it is misunderstood that it is low efficiency and low power. In this paper, I show the theory of beam efficiency between transmitting antennas and receiving antennas and also show some high efficient applications of the WPT via radio waves. Especially, I pick up a wireless power charging system of an electric vehicle and show the experimental results. I show difference between the theory of beam efficiency and the experimental results of short range WPT. I indicate that reasons of poor beam efficiency in the experiment are (1) change of impedance caused by mutual coupling between transmitting antennas and receiving antennas, (2) oblique direction of microwave power to receiving antennas caused by short distance.