• 제목/요약/키워드: vacuum deposition

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Ultrahigh Vacuum Chemical Vapor Deposition (UHVCVD)법에 의한 GaAs와 InGaAs 박막의 선택 에피택시 (Selective Area Epitaxy of GaAs and InGaAs by Ultrahigh Vacuum Chemical vapor Deposition(UHVCVD))

  • 김성복
    • 한국진공학회지
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    • 제4권3호
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    • pp.275-282
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    • 1995
  • III족 원료 가스로 triethylgallium(TEGa)과 trimethylindium(TMIn)을 사용하고 V족 원료 가스로 사전 열 분해하지 않은 arsine(AsH3)과 monoethylarsine(MEAs)을 사용하여 ultrahigh vacuum chemical vapor deposition(UHVCVD)법으로 Si3N4로 패턴된 GaAs(100)기판 위에 GaAs와 InGaAsqkr막을 선택적으로 에피택시 성장을 하였다. V족 원료 가스를 사전 열 분해하지 않으므로 넓은 성장 온도 구간과 V/lll 비율에서도 선택적으로 박막이 성장되었다. 또한 선택 에피택시의 성장 메카니즘을 규명하기 위하여 다양한 filling factor(전체면적중 opening된 면적의 비율)를 가지는 기판을 제작하여 성장에 사용하였다. UHVCVD법에서는 마스크에 면적중 opening된 면적의 비율)를 가지는 기판을 제작하여 성장에 사용하였다. UHVCVD법에서는 마스크에 입사된 분자 상태의 원료 기체가 탈착된 후 표면 이동이나 가스 상태의 확산과정 없이 마스크로부터 제거되므로 패턴의 크기와 모양에 따른 성장 속도의 변화나 조성의 변화가 없을 뿐만 아니라 chemical beam epitaxy(CBE)/metalorganic molecular beam epitaxy(MOMBE)법에서 알려진 한계 성장온도 이하에서 선택 에피택시 성장이 이루어졌다.

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Fabrication of Conductive ZnO Thin Filn Using UV-Enhanced Atomic Layer Deposition

  • 양다솜;김홍범;성명모
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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    • pp.373-373
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    • 2012
  • We fabricated conductive zinc oxide (ZnO) thin film at low temperature by UV-enhanced atomic layer deposition. The atomic layer deposition relies on alternate pulsing of the precursor gases onto the substrate surface and subsequent chemisorption of the precursors. In this experiment, diethylzinc (DEZ) and $H_2O$ were used as precursors with UV light. The UV light was very effective to improve the conductivity of the ZnO thin film. The thickness, transparency and resistivity were investigated by ellisometry, UV-visible spectroscopy and Four-point probe.

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화학기상증착법(CVD)을 이용한 진공 박막 공정기술 (Thin Film Vacuum Process Technology via Chemical Vapor Deposition Methods)

  • 홍완식
    • 진공이야기
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    • 제1권3호
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    • pp.9-13
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    • 2014
  • Vacuum growth of thin films via chemical vapor deposition (CVD) methods has been extensively used in modern semiconductor and flat panel display industries. The CVD processes have a wide range of variation and are categorized according to their working conditions, power sources, precursor materials, and so forth. Basic components and process steps common to all CVD branches are discussed. In addition, characteristics and applications of two major CVD techniques - LPCVD and PECVD - are reviewed briefly.

Study on Improvement of Diamond Deposition on Al2O3 Ceramic Substrates by a DC Arc Plasmatron

  • Kang, In-Je;Joa, Sang-Beom;Chun, Se-Min;Lee, Heon-Ju
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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    • pp.457-457
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    • 2012
  • We presented plasma processing using a DC Arc Plasmatron for diamond deposition on Al2O3 ceramic substrates. Plasma surface treatments were conducted to improve deposition condition before processing for diamond deposition. The Al2O3 ceramic substrates deposited, $5{\times}15mm^2$, were investigated by Scanning Electron Microscopy (SEM), Fourier Transform Infrared Spectroscopy (FTIR) and X-ray Diffraction (XRD). Properties of diamond (111), (220) and (311) peaks were shown in XRD. We identified nanocrystalline diamond films on substrates. The results showed that deposition rate was approximately $2.2{\mu}m/h$ after plasma surface treatments. Comparing the above result with a common processing, deposition rate was improved. Also, the surface condition was improved more than a common processing for diamond deposition on Al2O3 ceramic substrates.

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진공아크 증착법과 다른 공정에 의해 증착된 MgO 박막 특성 비교 (Comparison of characteristics of MgO films deposited by vacuum arc method with other methods.)

  • 이은성;김종국;이성훈;이건환
    • 한국진공학회지
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    • 제12권2호
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    • pp.112-117
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    • 2003
  • MgO 박막은 PDP(plasma display panels)분야에서 널리 사용되어 왔다. 본 연구에서는, 기존에 사용되고 있는 e-beam evaporation, reactive magnetron sputtering법과 arc deposition법으로 MgO 보호막을 증착하여 구조적 · 광학적 특성을 비교하였다. 반응 가스인 산소 가스의 유입량을 변화시켜 Mg metal target을 이용하여 vacuum arc deposition equipment 의해 유리 기판 위에 증착하였다. Ellipsometer를 이용하여 치밀도를 측정하고, MgO보호막의 마모율(erosion rate)를 측정하기 위해 가속 실험 방법을 도입, Ar+ 이온빔에 의한 erosion test를 시행하여 내마모성을 알아보았다. 또한, XPS와 UV test를 사용하여 MgO보호막의 광투과도에 미치는 수분의 영향을 조사한 결과, arc evaporation 법이 광투과도 90%이상을 유지하여 수분의 영향에 둔감한 것을 알 수 있었다. 한편, XRD와 AFM을 이용하여 MgO 박막의 구조와 표면 형상에 대해 조사하였다.

RF 마그네트론 스퍼터링으로 증착 된 GZO 박막의 진공 열처리온도에 따른 구조적, 광학적, 전기적 특성 연구 (Effect of Post Deposition Annealing Temperature on the Structural, Optical and Electrical Properties of GZO Films Prepared by RF Magnetron Sputtering)

  • 김대일
    • 열처리공학회지
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    • 제24권4호
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    • pp.199-202
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    • 2011
  • Ga doped ZnO thin films were deposited with RF magnetron sputtering on glass substrate without intentional substrate heating and then the effect of post deposition annealing temperature on the structural, optical and electrical properties of the films was investigated. The post deposition annealing process was conducted for 30 minutes in a vacuum of $1{\times}10^{-3}$ Torr and the vacuum annealing temperatures were 150 and $300^{\circ}C$, respectively. As increase annealing temperature, GZO films show the increment of the prefer orientation of ZnO (002) diffraction peak in the XRD pattern and the optical transmittance in a visible wave region was also increased, while the electrical sheet resistance was decreased. The figure of merit obtained in this study means that GZO films which vacuum annealed at $300^{\circ}C$ have the highest optoelectrical performance in this study.

진공환경에서 수평 웨이퍼 표면으로의 입자침착 해석 (Analysis on Particle Deposition onto a Horizontal Semiconductor Wafer at Vacuum Environment)

  • 유경훈
    • 대한기계학회논문집B
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    • 제26권12호
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    • pp.1715-1721
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    • 2002
  • Numerical analysis was conducted to characterize the gas flow field and particle deposition on a horizontal freestanding semiconductor wafer under the laminar flow field at vacuum environment. In order to calculate the properties of gas, the gas was assumed to obey the ideal gas law. The particle transport mechanisms considered were convection, Brownian diffusion and gravitational settling. The averaged particle deposition velocities and their radial distributions fnr the upper surface of the wafer were calculated from the particle concentration equation in an Eulerian frame of reference for system pressures of 1 mbar~1 atm and particle sizes of 2nm~10$^4$ nm(10 ${\mu}{\textrm}{m}$). It was observed that as the system pressure decreases, the boundary layer of gas flow becomes thicker and the deposition velocities are increased over the whole range of particle size. One thing to be noted here is that the deposition velocities are increased in the diffusion dominant particle size range with decreasing system pressure, whereas the thickness of the boundary layer is larger. This contradiction is attributed to the increase of particle mechanical mobility and the consequent increase of Brownian diffusion with decreasing the system pressure. The present numerical results showed good agreement with the results of the approximate model and the available experimental data.