• 제목/요약/키워드: underlayer

검색결과 190건 처리시간 0.037초

CoCrMo/Cr 자성박막의 제조조건이 자기적성질에 미치는 영향 (The Effect of Sputtering Conditions on Magnetic Properties of CoCrMo/Cr Magnetic Thin Film)

  • 박정용;남인탁;홍양기
    • 한국자기학회지
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    • 제3권4호
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    • pp.320-324
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    • 1993
  • 스퍼터된 자기기록매체 Co-10at%Cr-2at%Mo/Cr 자성박막의 제조조건이 미세구조와 자기적특성에 미치는 영향을 조사하였다. 기판의 온도는 상온-$250^{\circ}C$로 하였으며 Cr하지층과 CoCrMo층의 두께는 각각 $1000-2500\AA$, $300-800\AA$이었다. CoCrMo층의 두께가 $500{\AA}-800{\AA}$ 증가함에 따라 결정립은 미세화 되었으며 균일한 조직을 나타냈다. 보자력은 기판의 온도, CoCrMo자성층, Cr하지층의 두께 를 증가시켰을때 향상되었다. 기판온도가 $250^{\circ}C$, 자성층의 두께가 $700\AA$, Cr 하지층의 두께가 $1000\AA$일때 880 Oe의 보자력을 나타냈다.

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투수성해안구조물과 불규칙파의 상호작용에 관한 수치모델 연구 (A Study of the Numerical Model on the Interaction between Irregular Waves and Permeable Coastal Structures)

  • 김종욱;남인식;윤한삼;류청로
    • 한국해양공학회:학술대회논문집
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    • 한국해양공학회 2001년도 춘계학술대회 논문집
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    • pp.186-195
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    • 2001
  • The purpose of this study is to develop the time-dependent, one-dimensional numerical model on the interaction between irregular waves and two-layer permeable coastal structures, by extending and modifying the numerical model PBREAK(Wurjanto and Kobayashi, 1992) which is applicable only to one-layer permeable coastal structures. The two-layer permeable coastal structure consists of two permeable underlayers with different permeable media resting on an impermeable slope and an armor layer covering the permeable underlayer. The numerical model of this study simulates the wave over rough permeable underlayer of arbitrary geometry as well as the waves inside two-permeable underlayers of arbitrary thickness for specified normally-incident irregular waves. The utility of the numerical model is founded from comparing with PBREAK and the four hydraulic model tests under irregular waves. The sensitivities of computed results according to typical parameters(porosity, stone diameter, horizontal width of the permeable underlayer) and major factors(friction factor of primary armor layer etc.) discussed.

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$SiH_4$ Soak Effects for Optimization of Tungsten Plug Deposition on TiN Barrier Metal

  • Kim, Sang-Yang;Seo, Yong-Jin;Lee, Woo-Sun;Chung, Hun-Sang;Kim, Chang-Il;Chang, Eui-Goo;Chung, Yong-Ho
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2001년도 춘계학술대회 논문집 반도체재료
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    • pp.54-56
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    • 2001
  • The $SiH_4$ soak step is widely used during the CVD Tungsten(W) plug deposition process on the Ti/TiN barrier metal to prevent the $WF_6$ attack to the underlayer metal. We tried to reduce or skip the time of $SiH_4$ soak process to optimize W-plug deposition process on Via. The electrical characteristics including Via resistance and the structure of W film are affected according to $SiH_4$ soak time. The elimination possibility of $SiH_4$ soak process was confirmed in the case of that the CVD W film grows on the stable Ti/TiN underlayer.

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CoCr(-Ta)/Si 이층막의 c-축 우선 배향성에 관한 연구 (A Study on the c-axis preferred orientation of CoCr(-Ta)/Si doublelayer)

  • 김용진;박원효;신성권;손인환;최형욱;김경환
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2001년도 하계학술대회 논문집 C
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    • pp.1475-1477
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    • 2001
  • In odor to set high saturation magnetization and coercivity, it had need to orient axis of easy magnetization of CoCr-based thin film perpendicular direction(c-axis) to the substrate plane. It was known that crystalline orientation of CoCr-based thin film was improved by introducing underlayer like Ti, Ge. We prepared singlelayer and double layer with Si underlayer by Facing Targets Sputtering System. As a result, intensity and c-axis dispersion angle ${\Delta}{\theta}_{50}$ of singlelayer were improved with increasing film thickness. Also, it was found that CoCr/Si and CoCrTa/Si double layer showed good c-axis dispersion angle due to introducing Si.

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텡스텐 플러그 CVD 공정에서 SiH4 Soak의 영향 (SiH4 Soak Effects in the W plug CVD Process)

  • 이우선;서용진;김상용;박진성
    • 한국전기전자재료학회논문지
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    • 제16권1호
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    • pp.1-4
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    • 2003
  • The SiH$_4$soak step is widely used to prevent the WF$_{6}$ attack to the underlayer metal using the chemical vapor deposition (CVD) method. Reduction or skipping of the SiH$_4$soak process time if lead to optimizing W-plug deposition process on via. The electrical characteristics including via resistance and the structure of W-film are affected by the time of SiH$_4$soak process. The possibility of elimination of SiH$_4$soak process is confirmed In the case of W- film grown on the stable Ti/TiN underlayer.