• 제목/요약/키워드: ultrasonic wire bonder

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와이어 본딩용 트랜스듀서 혼의 진동 특성 (Vibration Characteristics of a Wire-Bonding Transducer Horn)

  • 임빛;한대웅;이승엽;안근식;강경완;김국환
    • 한국소음진동공학회:학술대회논문집
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    • 한국소음진동공학회 2007년도 추계학술대회논문집
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    • pp.583-588
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    • 2007
  • This paper investigates the vibration characteristics of a wire-bonding transducer horn for high speed welding devices. The sample wire-bonder uses the input frequency of 136 kHz. The ultrasonic excitation causes the various vibrations of transducer horn and capillary. The vibration modes and frequencies close to the exciting frequency are identified using ANSYS. The nodal lines and amplification ratio of the ultrasonic horn are also obtained in order to evaluate the bonding performance of the sample wire-bonder system. The FEM results and experimental results show that the sample wire-bonder system uses the bending mode of 136 kHz as principal motion for bonding. The major longitudinal mode exists at 119 kHz below the excitation frequency. It is recommeded that the sample system is to set the excitation frequency at 119 kHz to improve bonding performance.

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와이어 본딩시 본딩 패드 리프트 불량에 관한 연구 (Study on the Bonding Pad Lift Failure in Wire Bonding)

  • 김경섭;장의구;신영의
    • 한국전기전자재료학회논문지
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    • 제11권12호
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    • pp.1079-1083
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    • 1998
  • In this study, ultrasonic power of Aluminum wire bonder, bond time and bond force are investigated and valued in order to minimize failure of bonding pad lift. We also tried to control those 3 factors properly. We got the conclusion that if we turn down the ability of ultrasonic power or bond time, we can get a pad lift from a boundary between bond pad ad wire because pad metal and wire joining is unstable, but it is best condition when it ultrasonic power is 100∼130unit, bond time is 15∼20msec and bond force is 4∼6gf.

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Development of smart transducer with embedded sensor for automatic process control of ultrasonic wire bonding

  • Or, Siu Wing;Chan, Helen Lai Wa;Liu, Peter Chou Kee
    • Smart Structures and Systems
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    • 제1권1호
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    • pp.47-61
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    • 2005
  • A ring-shaped lead zirconate titanate (PZT) piezoceramic sensor has been integrated with the Langevin-type piezoceramic driver of an ultrasonic wire-bonding transducer to form a smart transducer for in-situ measurement of three essential bonding parameters: namely, impact force, ultrasonic amplitude and bond time. This sensor has an inner diameter, an outer diameter and a thickness of 12.7 mm, 5.1 mm and 0.6 mm, respectively. It has a specifically designed electrode pattern on the two major surfaces perpendicular to its thickness along which polarization is induced. The process-test results have indicated that the sensor not only is sensitive to excessive impact forces exerted on the devices to be bonded but also can track changes in the ultrasonic amplitude proficiently during bonding. Good correlation between the sensor outputs and the bond quality has been established. This smart transducer has good potential to be used in automatic process-control systems for ultrasonic wire bonding.

와이어 본딩용 초음파 혼의 진동 특성 (Vibration Characteristics of a Wire-Bonding Ultrasonic Horn)

  • 김영우;임빛;한대웅;이승엽
    • 대한기계학회논문집A
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    • 제38권2호
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    • pp.227-233
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    • 2014
  • 본 논문은 상용화된 와이어 본딩용 초음파 혼 시스템에서 발생하는 와이어 본딩 불량의 원인을 진동해석을 통하여 파악하고자 한다. 먼저 링 형상의 압전 구동기와 초음파 혼 그리고 캐필러리 등 각 부품의 진동 특성과 136kH의 가진 주파수 근처에서 발생하는 전체 초음파 혼 시스템의 주요 진동 모드들을 유한요소해석을 이용하여 구하였다. 136kHz에서 공진되는 전체 트랜스듀서 시스템의 진동 모드가 종진동 모드가 아닌 굽힘 진동 모드임을 조화 가진 해석과 실험으로 확인하였다. 136kHz에서 발생하는 굽힘 진동 모드는 캐필러리 끝단의 움직임이 종방향 뿐만 아니라 좌우 횡방향으로도 큰 변위가 발생하기 때문에 정밀 작업 시 본딩 불량의 원인이 될 수 있다. 가진 주파수 대역 근처인 119kHz에서 발생하는 종진동 모드는 캐필러리의 횡방향 진동이 감소하기 때문에 본딩 성능의 향상을 위해서 이러한 종진동 모드를 이용하도록 설계 변경이 필요함을 제시하였다.

와이어 본딩용 압전 액츄에이터의 진동 특성 (Vibration Characteristics of a Wire-Bonding Piezoelectric Actuator)

  • 김영우;김경업;이승엽
    • 한국소음진동공학회:학술대회논문집
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    • 한국소음진동공학회 2007년도 추계학술대회논문집
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    • pp.578-582
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    • 2007
  • In this paper, vibration modes and frequencies of a ring-type stacked piezoelectric actuator for a wire bonding transducer system are analyzed using FEM simulations. We implement experiments using a commercial product model of the actuator PZT module which consists of 6 layer ring-type PZT and 7 electrodes, combined bolts, nut and tinut. There are two main results: One is that FEM analysis should consider the effect the harmonic voltage input in order to meet the experimental results. The other is that the current wire bonder using exciting frequency of 136 kHz should be modified in order to improve the actuator and bonding performance because the actuator module has the main longitudinal mode of 145 kHz.

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와이어 본더용 Horn-Holder Assembly의 접촉 해석 (Contact Analysis on a Born-Holder Assembly for Wire Bonding)

  • 장창수;안근식;김영준;곽동옥;부성운
    • 대한기계학회논문집A
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    • 제26권10호
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    • pp.2008-2017
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    • 2002
  • Joint structure of a transducer horn-holder assembly fur a wire bonder was examined through FEM contact analysis. A three dimensional modeling and analysis was carried out to survey the internal physics of this structure and to prove the accuracy of a computation compared to a measurement. After validation, a simple two dimensional model was built fur various parametric study considering the efficiency and speed of the computation. Several factors such as boundary conditions, a modeling boundary, mesh density and so on, were considered to obtain consistency with three dimensional analysis. An arc angle and a position of each holder boss were chosen as design parameters. A design of experiment was applied to find out an optimized design of the holder geometry. As a result, a guideline for holder boss design was suggested and main factors and their influence on stress concentration in the transducer horn were surveyed.