• Journal of Institute of Control, Robotics and Systems
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• v.4 no.6
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• pp.747-752
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• 1998

Ultrasonic sensors have been widely used to recognize the working environment for a mobile robot. However, their intrinsic problems, such as specular reflection, wide beam angle, and slow propagation velocity, require an excessive number of sensors to be integrated for achieving the sensing goal. This paper proposes a new measurement scheme which uses only two sets of ultrasonic sensors to determine the location and the type of a target surface. By measuring the time difference between the returned signals from the target surface, which are generated by two transmitters with 1 ㎳ difference, it classifies the type and determines the size of the target surface. Since the proposed sensor system uses only two sets of ultrasonic sensors to recognize and localize the target surface, it significantly simplifies the sensing system and reduces the signal processing time so that the working environment can be recognized in real time.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1608-1613
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• 2003

In the semiconductor and the optical industry, a new transport system which can replace the conventional sliding system is required. These systems are driven by the magnetic field and the conveyer belt. The magnetic field damages semiconductor and contact force scratches the optical lens. The ultrasonic wave driven system can solve these problems. In this paper, the object transport system using the excitation of ultrasonic wave is proposed. The experiments for finding the optimal excitation frequency, finding phasedifference between two ultrasonic wave generators are performed. The relationship of transporting speed according to the change of flexural beam shape is verified. In addition, the system performance for practical use is evaluated.

• 제어로봇시스템학회:학술대회논문집
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• 1987.10b
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• pp.631-636
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• 1987

The design of ultrasonic transducer energy processing systems requires highly reliable command featuring mechanical frequency tracking and constant velocity control of the ultrasonic transducer with an acoustic load. This paper presents a new conceptional instantaneous current resultant control base high-frequency inverter using self turn-off devices driving an electrostrictive ultrasonic transducer system and its optimum control technique, which is implemented by feed-back of the ultrasonic transducer applied voltage and instantaneous velocity of the transducer vibrating system through a Phase-Locked-Loop control scheme. The feedback voltage corresponding to instantaneous velocity is averaged over a half-period with respect to constant amplitude/constant velocity control strategy. Described are the theory of this signal detection technique and the experimental set-up.

• 제어로봇시스템학회:학술대회논문집
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• 1991.10a
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• pp.1209-1213
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• 1991

This paper describes a new method for performance improvement ultrasonic ranging system using V40 controller. Detectable range of ultrasonic ranging system depends on transducer frequency and bandwidth of the receiver, and damping of the transducer, etc. Conventional ranging systems are somewhat inaccurate because they do not have capability of compensating changes in medium condition. The novel ranging system overcomes this disadvantage by placing in the same medium a dummy sensor functioning as a standard calibrating instrument and by providing data processing capability using V40 controller.

• Smart Structures and Systems
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• v.1 no.1
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• pp.47-61
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• 2005

A ring-shaped lead zirconate titanate (PZT) piezoceramic sensor has been integrated with the Langevin-type piezoceramic driver of an ultrasonic wire-bonding transducer to form a smart transducer for in-situ measurement of three essential bonding parameters: namely, impact force, ultrasonic amplitude and bond time. This sensor has an inner diameter, an outer diameter and a thickness of 12.7 mm, 5.1 mm and 0.6 mm, respectively. It has a specifically designed electrode pattern on the two major surfaces perpendicular to its thickness along which polarization is induced. The process-test results have indicated that the sensor not only is sensitive to excessive impact forces exerted on the devices to be bonded but also can track changes in the ultrasonic amplitude proficiently during bonding. Good correlation between the sensor outputs and the bond quality has been established. This smart transducer has good potential to be used in automatic process-control systems for ultrasonic wire bonding.

• Journal of Institute of Control, Robotics and Systems
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• v.17 no.2
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• pp.149-156
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• 2011

This paper reveals a distance estimation algorithm based on multi-code ultrasonic and wireless sensor network. For measuring the distances among the sensor nodes, each ultrasonic transmitter transmits multi-code ultrasonic signal simultaneously. Receivers use cross correlation method to separate the coded signals. The information of measured distances is broadcasted to each sensor node by wireless sensor network. The wireless sensor network measures the distance among the sensor nodes using the received signal strength of the broadcasting. The multi-code ultrasonic have a limitation of measurable distance. And the received signal strength is affected from an environment. This paper measures a distance using ultrasonic and a received signal strength in short range. These measured data are applied to the least square estimation algorithm. By the expansion of the fitting curve, a distance measurement in long range using the received signal strength is compensated. The coupled system reduce the error to an acceptable level.

• The Journal of the Acoustical Society of Korea
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• v.16 no.2
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• pp.5-9
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• 1997

In this paper, when we use the chirp signal as input signal of ultrasonic signal system the technique for determining the bandwidth of the chirp signal that maximizes the amplitude of the compressed ultrasonic echo signal has been studied. In ultrasonic signal processing systems, the signal-to-noise ratio of the echo signal can be too low due to damping and scattering of the ultrasonic wave during transmission. Method of pulse compression using chirp signal is a means to increase the signal-to-noise ratio in ultrasonic pulse-echo systems. Simulation and experimental results showed that the output signal of ultrasonic system was increased by pulse width of chirp signal and the optimum-bandwidth of the chirp signal was 1.15 times larger than the bandwidth of the ultrasonic system.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.415-418
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• 2005

In the semiconductor and optical industry, a new transport system which can replace the conventional transport systems is required. The transport systems are driven by the magnetic field and conveyer belts. The magnetic field may damage semiconductor and the contact force may scratch the optical lens. The ultrasonic wave driven system can solve these problems. In this semiconductor and optical industry, the non-contact system is required fur reducing the damages. The ultrasonic transportation is the solution of the problem. In this paper, the ultrasonic levitation system fur levitating object are proposed. The 3D vibration profiles of the beam are measured by Laser scanning Vibrometer fur verifying the vibration characteristics of the system and the amplitudes of the beam and the levitation heights of object are measured for evaluating the performance.

• 제어로봇시스템학회:학술대회논문집
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• 1989.10a
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• pp.711-714
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• 1989

Autonomous mobile robot Yamabico and his newly developed ultrasonic range finding module(URF) are described. Yamabico is a self-contained autonomous robot for in-door environment. It has a modularized architecture, which consists of master module, ultrasonic range finding module, locomotion module, voice synthesizer module and console. Newly developed ultrasonic range finding module has a 68000 processor and Dual-port memory for communication. It controls the ultrasonic transmitters and receivers and calculate the range distances for 12-direction, simultaneously within every 60 milliseconds.

• Proceedings of the Acoustical Society of Korea Conference
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• 1994.06a
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• pp.824-829
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• 1994

High-frequency and complex vibration ultrasonic wire bonding systems are propsed and their welding characteristic are studied. Ultrasonic wire bonding is used widely for joining thin connecting wire of various electronic devices including IC or LSI. Conventional bonding systems use vibration frequency of 40 or 60 kHz and linear vibration welding tips. Complex vibration welding tip which vibrates in elliptical to circular or rectangular to square in the same or different frequency is effective to join welding specimens in shorter welding time and under smaller vibration amplitude, and furthermore high-frequency systems such as 90, 120, 190 kHz are also significantly effective. High-frequency and complex vibration welding system of 90, 120 and 190 kHz are designed. Welding characteristics of these systems are found very superior than a conventional system. Welding specimens of aluminum wire of 0.1mm diameter are successfully.