• 대한기계학회논문집A
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• 제29권4호
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• pp.624-631
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• 2005

A note-book PC has become thinner in recent years, which requires the optical disc drives with small height and high memory capacity. Therefore the actuator of optical disc drives must be thinner and have disc tilt compensation function for high density memory. In this paper, the actuator with hybrid type is investigated for 3-axis ultra-slim actuator. A 3-axis ultra-slim actuator is designed by using the modal analysis of the actuator and the electromagnetic analysis of magnetic circuit to achieve dynamic characteristics. Also, magnetic force between tilt magnet and tilt yoke is investigated to and the influence on the DC sensitivity in the focus and track directions.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2003년도 추계학술대회논문집
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• pp.208-213
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• 2003

A note-book PC has become thinner in recent years. And optical disc drives are required to have high memory capacity. Therefore, the actuator of optical disc drives must be thinner and have disc tilt compensation function for high density memory. In this paper, the hybrid type actuator is investigated for 3-axis ultra-slim actuator. A 3-axis ultra-slim actuator is designed by using the modal analysis of the actuator and the electromagnetic analysis of magnetic circuit to achieve dynamic characteristics and magnetic flux density for high sensitivity, respectively. Also, magnetic force between tilt magnet and tilt yoke is investigated to find the influence on the DC sensitivity in the focus and track directions.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2003년도 춘계학술대회논문집
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• pp.770-774
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• 2003

We propose the re-design method of modal parameters to depress the 2nd resonance peak of the ultra-slim-height optical pick-up actuator. With the addition of tile counter mode near the 2nd resonance frequency, we can achieve the gain margin which is sufficient to meet the system requirement. It would alleviate the burden of the additional filter for a high-speed drive.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2007년도 춘계학술대회 논문집
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• pp.60-65
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• 2007

According to the customers' demands, cellular phones are getting thinner and thinner in spite that their functions are getting more complex and flexible. Based on this trend, we are willing to propose new design of ultra slim cellular phone with multi-hinges which can provide thinner feature and wider active area than the current merchandised one. To make it come true, smaller and stronger mechanical parts would be necessary and more researches would be carried out in the near future. Moreover, the new frame of ultra slim cellular phone has the problem in heat propagation due to its thin feature and multi function. In this paper, slim heat-spreader would be proposed as a candidate to resolve the problem of heat transfer in the new cellular phone. To investigate the applicability of heat-spreader to cellular phones, prototypes were fabricated and verified.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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• pp.107-107
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• 2004

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.214-217
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• 2008

We present an ultra-slim LCD module for 40-inch FHD TV. By employing edge-lit backlight system, module thickness of 10mm is achieved. To satisfy the luminance spec of 450 nits in FHD resolution, it is critical to adopt high efficient LED and optical components.

• 전력전자학회논문지
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• 제16권3호
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• pp.274-282
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• 2011

일반도로에서 주행 가능한 온라인전기자동차(On-Line Electric Vehicles)에 적용하기 위해 자기유도 전력전달 방식의 초박형 급전코일과 집전코일을 개발하였다. 이러한 구조의 초박형 급집전코일은 코어비용을 대폭 절감하고 공극간격을 크게 해주며 차량 좌우편차를 크게 하여, OLEV의 성능을 탁월하게 하고 경제적이게 하였다. 그 결과 양산단가 3억원/km 이하이면서도 공극간격 17 cm 이상, 효율 83 %이상, 출력 60 kW이상을 보여 실용화에 근접했다는 평가를 받고 있다. 본 논문에서는 U형과 W형 급집전코일을 설계하고 자장 시뮬레이션을 통해 검증하여 실험결과와 비교하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.432-432
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• 2007

We studied optical simulation method for ultra slim backlight system. We designed 0.7mm thickness light guide plate and combined 48 white color LEDs for 12 inch wide size TFT-LCD. We designed flat shape PMMA light guide plate with both side patterned. It have vertical prism shape on upper side and ellipse dot pattern on the other side. We targeted 4500 nit brightness and uniform emission characteristic without hot spot or dark area. At first, we designed uniform emission area with more high brightness in center area and then, debugged light entering hot spot zone and direction of outgoing light flux. Although it was designing step, we obtained good result with reverse prism optical sheet and it had good repeatability because it was based on the stamper method in injection process without laser engraving or micro groove engraving method.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2002년도 International Meeting on Information Display
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• pp.347-350
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• 2002

Transposed scan is an innovation that paves the road to ultra-slim CRTs with deflection angles up to 135$^{\circ}C$ We discuss the integration of video transposition with the other video processing functions in the television set. An in-place transposition algorithm which minimizes the amount of frame memory is proposed as a low-cost solution for transposed scan conversion. The difference in visual perception of transposed scan and normal scan depends on the frame rate and the line density of the video format. We found that for high frame rates and high line densities, no difference was perceived for both scan modes.

• 마이크로전자및패키징학회지
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• 제15권1호
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• pp.7-18
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• 2008

This paper reviews the current development of an ultra-slim SiP for Radio Frequency (RF) application, in which three flip chips, additional passive components and Surface Acoustic Wave (SAW) filters are integrated side-by-side. A systematic investigation is carried out for the design optimization, process and reliability improvement of the package, which comprises several aspects: a design study based on the 3D thermo-mechanical finite element analysis of the packaging, the determination of stress, warpage distribution, critical failure zones, and the figuration of the effects of material properties, process conditions on the reliability of package. The optimized material sets for manufacturing process were determined which can reduce the number of testing samples from 75 to 2. In addition the molded underfilling (MUF) process is proposed which not only saves one manufacturing process, but also improves the thermo-mechanical performance of the package compared with conventional epoxy underfilling process. In the end, JEDEC's moisture sensitivity test, thermal cycle test and pressure cooker tests have also been carried out for reliability evaluation. The test results show that the optimized ultra-slim SiP has a good reliability performance.