• 제목/요약/키워드: ultra-high purity water

검색결과 7건 처리시간 0.019초

Isolation and Characterization of Biofouling Bacteria in Ultra-high Purity Water Used in the Semiconductor Manufacturing Process

  • Kim, In-Seop;Lee, Kye-Joon
    • Journal of Microbiology and Biotechnology
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    • 제10권4호
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    • pp.554-558
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    • 2000
  • Bacteria were isolated and identified from an advanced high-purity water system that supplies ultra-high purity water (UHPW) for 16-megabyte DRAM semiconductor manufacturing. Scanning electron microscopic and microbiological observations revealed that the primary source of the bacteria isolated from the UHPW was detached cells from biofilms developed on the pipe wall through which the UHPW, a man-made and extremely nutrient poor environment, was passing. About 63-65% of the bacteria isolated from the UHPW and the pipe wall were Gram-positive, whereas only 10% of the bacteria isolated from the feed water were Gram-positive. The of Gram-positive bacteria and seven genera of Gram-negative bacteria. Strains of the UHPW bacteria effectively adhered to and formed a biofilm on the surface of polyvinyl chloride (PVC) pipe.

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Monitoring and Characterization of Bacterial Contamination in a High-Purity Water System Used for Semiconductor Manufacturing

  • Kim, In -Seop;Lee, Geon-Hyoung;Lee, Kye-Joon
    • Journal of Microbiology
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    • 제38권2호
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    • pp.99-104
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    • 2000
  • Hydrogen peroxide has been used in cleaning the piping of an advanced high-purity water system that supplies ultra-high purity water (UHPW) for 16 megabyte DRAM semiconductor manufacturing. The level of hydrogen peroxide-resistant bacteria in UHPW water was monitored prior to and after disinfecting the piping with hydrogen peroxide. Most of the bacteria isolated after hydrogen peroxide disinfection were highly resistant to hydrogen peroxide. However, the percentage of resistant bacteria decreased with time. The hydrogen peroxide-resistant bacteria were identified as Micrococcus luteus, Bacillus cereus, Alcaligenes latus, Xanthomonas sp. and Flavobacterium indologenes. The susceptibility of the bacteria to hydrogen peroxide was tested as either planktonic cells or attached cells on glass. Attached bacteria as the biofilm on glass exhibited increased hydrogen peroxide resistnace, with the resistance increasing with respect to the age of the biofilm regrowth on piping after hydrogen peroxide treatment. In order to optimize the cleaning strategy for piping of the high-purity water system, the disinfecting effect of hydrogen preoxide and peracetic acid on the bacteria was evaluated. The combined use of hydrogen peroxide and peracetic acid was very effective in killing attached bacteria as well as planktonic bacteria.

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다중 원심분리법을 이용한 태양전지용 실리콘 폐 슬러지 재생 시스템 구현 (Implementation of a silicon sludge recycling system for solar cell using multiple centrifuge)

  • 김호운;최병진
    • 한국산업정보학회논문지
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    • 제17권1호
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    • pp.1-9
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    • 2012
  • 본 논문은 태양전지용 실리콘 잉곳 절삭시 발생하는 폐 슬러지에서 실리콘, 연마재를 분리 회수 재사용하는 시스템에 관한 것이다. 분리시스템의 기본 공정은 다중원심분리이고 분리 효율을 높이기 위해 초음파 교반, 알코올 물 가수, 가열처리를 하였다. 실리콘의 경우 2N의 경우 96% 회수율을 보였고, 4N의 경우 94%의 회수율을 보였다. 연마재인 SiC의 경우에는 약 80%의 회수율을 보였다. 4N의 고순도 Si 회수를 위해서는 진공열처리를 수행하여 잔류성분을 제거하였다.

Leaching Behavior of LD Slag

  • Kim, Hyung-Suek;Han, Ki-Hyun;M. S. Oh;Byeon, Tae-Bong
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2001년도 The 6th International Symposium of East Asian Resources Recycling Technology
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    • pp.526-531
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    • 2001
  • LD slag, that is, a by-product of steel making process, has been mainly used as land construction materials. Recently, the seashore application of LD slag was tried in Japan and Korea tut the reaction between LD slag and seawater was not studied yet. We tried to clarify the leaching reaction and/or mechanism of LD slag and the reaction between seawater and LD slag. We tried to apply these results to the decarbonization of seawater for seawater magnesia process. At first, LD slag was milled and classified into 5 grades, that is, (ⅰ)45${\mu}{\textrm}{m}$ under, (ⅱ)0.25~0.5mm (ⅲ)0.5~1mm(ⅳ)1~2mm, (ⅴ)2.36~3.35mm. These slags were leached in the distilled water. In case of 45${\mu}{\textrm}{m}$ under, the pH of the leached solution was over 12. The chemical analysis of leached solution showed that the $Ca^{+}$$^2$was main component and the S $i^{+}$$^4$was very low. On the other hand, the content of S $i^{+}$$^4$in leached solution was decreased with the increase of pH of this solution. The nearly pure calcium solution was made and the ultra high purity MgO could be made with this calcium solution. The leaching behavior of LD slag was different between the fine particle and coarse particle. The calcium was leached by bulk dissolution in the coarse particle and by surface controlled reaction in fine particle. The leaching rate was slow in coarse particle and fast in fine particle. Therefore, the high pH solution, that is, over 12, was obtained in fine particle.cle.e.

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기상의 $NH_3$를 침전체로 사용하는 $BaTiO_{3}$ 분말의 합성 (The synthesis of $NH_3$ powder using gaseous $NH_3$ as precipitator)

  • 현성호;김정환;허윤행
    • 환경위생공학
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    • 제12권1호
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    • pp.25-37
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    • 1997
  • The synthesis of high purity and ultra-fine $BaTiO_{3}$ by precipitation with gaseous $NH_{3}$ as precipitator was investigated to find an alternative process to solve various problems of present wet methods. This study consisted of two parts ; synthesis of $BaTiO_{3}$ precipitation with gaseous $NH_{3}$ and test of electrical property for the $La_{2}O_{3}$ doped $BaTiO_{3}$. The proper condition for the synthesis of $BaTiO_{3}$ by precipitation with gaseous $NH_{3}$ is as follows. The pH was 9.0. $H_{2}O_{2}$ mole ratio to $TiCl_{4}$ was 10. $NH_{3}$ gas follow rate did not influence the synthesis of $BaTiO_{3}$. The calcination temperature of $BaTiO_{3}$ was $300^{\circ}C$. Also, the synthesis of $La_{2}O_{3}$-doped $BaTiO_{3}$ was tested through the wet process. Under these condition, the shape of prepared $BaTiO_{3}$ powder was spherical type and the size of that was about $0.2{\mu}m$. After the powder was pressed, this green body was sintered at the $1300^{\circ}C$. Under these conditions, the water absorptance and the density of the obtained sintered body were below 0.04 %, 5.2 g/$cm^{3}$, respectively. Also the grain size of that was about $10{\mu}m$ and it was similar to commercial product.

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실리콘기판과 불소부식에 표면에서 금속불순물의 제거 (Removal of Metallic Impurity at Interface of Silicon Wafer and Fluorine Etchant)

  • 곽광수;연영흠;최성옥;정노희;남기대
    • 한국응용과학기술학회지
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    • 제16권1호
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    • pp.33-40
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    • 1999
  • We used Cu as a representative of metals to be directly adsorbed on the bare Si surface and studied its removal DHF, DHF-$H_2O_2$ and BHF solution. It has been found that Cu ion in DHF adheres on every Si wafer surface that we used in our study (n, p, n+, p+) especially on the n+-Si surface. The DHF-$H_2O_2$ solution is found to be effective in removing metals featuring high electronegativity such as Cu from the p-Si and n-Si wafers. Even when the DHF-$H_2O_2$ solution has Cu ions at the concentration of 1ppm, the solution is found effective in cleaning the wafer. In the case the n+-Si and p+-Si wafers, however, their surfaces get contaminated with Cu When Cu ion of 10ppb remains in the DHF-$H_2O_2$ solution. When BHF is used, Cu in BHF is more likely to contaminate the n+-Si wafer. It is also revealed that the surfactant added to BHF improve wettability onto p-Si, n-Si and p+-Si wafer surface. This effect of the surfactant, however, is not observed on the n+-Si wafer and is increased when it is immersed in the DHF-$H_2O_2$ solution for 10min. The rate of the metallic contamination on the n+-Si wafer is found to be much higher than on the other Si wafers. In order to suppress the metallic contamination on every type of Si surface below 1010atoms/cm2, the metallic concentration in ultra pure water and high-purity DHF which is employed at the final stage of the cleaning process must be lowered below the part per trillion level. The DHF-$H_2O_2$ solution, however, degrades surface roughness on the substrate with the n+ and p+ surfaces. In order to remove metallic impurities on these surfaces, there is no choice at present but to use the $NH_4OH-H_2O_2-H_2O$ and $HCl-H_2O_2-H_2O$ cleaning.

시멘트 그라우트재에서 $Cr^{6+}$용출특성에 관한 연구 (A Study on Leaching Characteristics of $Cr^{6+}$ in Cement Grout Materials)

  • 김동우;이재영;천병식
    • 한국지하수토양환경학회지:지하수토양환경
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    • 제8권2호
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    • pp.62-69
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    • 2003
  • 그동안 고분자계열 약액에 비하여 상대적으로 독성이 약한 시멘트 계열 약액이 환경에 미치는 영향을 경미하게 다루어졌으나 최근 일본에서 시멘트계열 약액을 사용한 공사현장에서 발암물질인 6가 크롬의 용출로 일본 건설성에서는 이에 대한 규정을 발효하고 시행하여 엄격히 관리하고 있으나 우리나라에서는 상대적으로 이에 대한 연구가 부족한 실정이다 본 연구에서는 다양한 현장조건에서의 시멘트계 그라우트재에서의 6가 크롬 용출특성을 파악하기 위해, 현장 배합비를 기초로 하여 다양한 현장조건에 따른 용출실험을 통하여, 시멘트계 그라우트재의 6가 크롬 용출 특성을 파악하였다. 먼저 원재료인 시멘트의 6가 크롬 함유량 실험을 한 결과 보통 포틀랜트 시멘트에서 22.1 mg/kg으로 다른 재료에 비해 가장 많이 함유되어 있었으며, 호모겔 그리고 샌드겔에서의 용출실험 결과 폐기물 공정시험법에 의할 경우 규제기준인 1.5 kg/L를 대체적으로 만족하였으나, 토양오염공정시험법에 의할 경우 특히 보통 포틀랜트 시멘트가 4.85 mg/kg으로 ‘가’ 지역의 우려기준인 4 mg/kg보다 높은 값을 나타내었다. 모의 주입장치를 이용한 실험결과 물시멘트 비와 주입압이 증가함에 따라 몰드 밖으로 나오는 배출액 중의 6가 크롬의 용출량이 커지는 경향을 나타내었으며, 주입압이 4 이상일 경우 수질오염보전법상의 규정인 0.5 mg/L를 초과하여 검출되었다. 최근 pH4의 산성비 및 매립지의 산생성 단계에서 pH 5이하의 침출수에 의한 그라우트재에서의 6가 크롬의 용출특성을 알아보기 위한 pH에 따른 6가 크롬의 용출경향을 실험한 결과 강산성 및 강염기 상태에서 6가 크롬의 용출량이 급격히 증가하는 경향을 보여 그라우트재가 주입되는 환경에 따라 6가 크롬의 용출량이 증가할 수 있다는 것을 알 수 있었다. 또한 그라우트재가 해안 또는 매립지에 적용될 경우 해수와 침출수에 의한 강도의 변화를 살펴보기 위해 실험한 결과 초순수 중에서 양생 시켰을 때 보다 강도발현 현저히 저하되었으며, 시멘트 종에 따라서는 ‘보통포틀랜트 시멘트>마이크로 시멘트>슬래그’ 시멘트의 순으로 영향을 받는 것으로 나타났다. 이는 강도의 저하로 인한 오염물질의 누출 및 6가 크롬의 용출을 증가시킬 수 있다는 것을 짐작할 수 있다. 이와 같은 결과를 통하여, 그라우트재의 종류에 따라 6가 크롬의 용출량은 현재 규제치를 초과하여 용출되어 질 수 있는 가능성이 있으며, 과압 또는 과량의 주입이 6가 크롬의 용출량을 증가시킬 수 있다고 할 수 있었다. 또한 일반 현장과 다른 특수한 현장에서는 강도 및 pH에 따른 6가 크롬의 용출량을 고려한 재료 선택 및 배합비가 마련되어져야 할 것으로 판단되어진다.