• Journal of Microbiology and Biotechnology
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• v.10 no.4
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• pp.554-558
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• 2000

Bacteria were isolated and identified from an advanced high-purity water system that supplies ultra-high purity water (UHPW) for 16-megabyte DRAM semiconductor manufacturing. Scanning electron microscopic and microbiological observations revealed that the primary source of the bacteria isolated from the UHPW was detached cells from biofilms developed on the pipe wall through which the UHPW, a man-made and extremely nutrient poor environment, was passing. About 63-65% of the bacteria isolated from the UHPW and the pipe wall were Gram-positive, whereas only 10% of the bacteria isolated from the feed water were Gram-positive. The of Gram-positive bacteria and seven genera of Gram-negative bacteria. Strains of the UHPW bacteria effectively adhered to and formed a biofilm on the surface of polyvinyl chloride (PVC) pipe.

• Journal of Microbiology
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• v.38 no.2
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• pp.99-104
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• 2000

Hydrogen peroxide has been used in cleaning the piping of an advanced high-purity water system that supplies ultra-high purity water (UHPW) for 16 megabyte DRAM semiconductor manufacturing. The level of hydrogen peroxide-resistant bacteria in UHPW water was monitored prior to and after disinfecting the piping with hydrogen peroxide. Most of the bacteria isolated after hydrogen peroxide disinfection were highly resistant to hydrogen peroxide. However, the percentage of resistant bacteria decreased with time. The hydrogen peroxide-resistant bacteria were identified as Micrococcus luteus, Bacillus cereus, Alcaligenes latus, Xanthomonas sp. and Flavobacterium indologenes. The susceptibility of the bacteria to hydrogen peroxide was tested as either planktonic cells or attached cells on glass. Attached bacteria as the biofilm on glass exhibited increased hydrogen peroxide resistnace, with the resistance increasing with respect to the age of the biofilm regrowth on piping after hydrogen peroxide treatment. In order to optimize the cleaning strategy for piping of the high-purity water system, the disinfecting effect of hydrogen preoxide and peracetic acid on the bacteria was evaluated. The combined use of hydrogen peroxide and peracetic acid was very effective in killing attached bacteria as well as planktonic bacteria.

• Journal of Korea Society of Industrial Information Systems
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• v.17 no.1
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• pp.1-9
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• 2012

This paper explained about the sludge recycling system which retrieved the silicon and abrasive from solar cell wafer slicing. The basic process of the recycling system was multiple centrifuge and secondary processes of ultra sonic agitation, addition of alcohol-water solution and heating sludge was added for raising separation efficiency. The recycling rate was about 96% and 94% for 2N, 4N silicon respectively. The SiC abrasive recycling rate was about 80%. To retrieve the high purity of 4N silicon, the heat process in vacuum furnace was added to remove remaining impurity components.

• Proceedings of the IEEK Conference
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• 2001.10a
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• pp.526-531
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• 2001

LD slag, that is, a by-product of steel making process, has been mainly used as land construction materials. Recently, the seashore application of LD slag was tried in Japan and Korea tut the reaction between LD slag and seawater was not studied yet. We tried to clarify the leaching reaction and/or mechanism of LD slag and the reaction between seawater and LD slag. We tried to apply these results to the decarbonization of seawater for seawater magnesia process. At first, LD slag was milled and classified into 5 grades, that is, (ⅰ)45${\mu}{\textrm}{m}$ under, (ⅱ)0.25~0.5mm (ⅲ)0.5~1mm(ⅳ)1~2mm, (ⅴ)2.36~3.35mm. These slags were leached in the distilled water. In case of 45${\mu}{\textrm}{m}$ under, the pH of the leached solution was over 12. The chemical analysis of leached solution showed that the $Ca^{+}$$^2$was main component and the S $i^{+}$$^4$was very low. On the other hand, the content of S $i^{+}$$^4$in leached solution was decreased with the increase of pH of this solution. The nearly pure calcium solution was made and the ultra high purity MgO could be made with this calcium solution. The leaching behavior of LD slag was different between the fine particle and coarse particle. The calcium was leached by bulk dissolution in the coarse particle and by surface controlled reaction in fine particle. The leaching rate was slow in coarse particle and fast in fine particle. Therefore, the high pH solution, that is, over 12, was obtained in fine particle.cle.e.

• Journal of environmental and Sanitary engineering
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• v.12 no.1
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• pp.25-37
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• 1997

The synthesis of high purity and ultra-fine $BaTiO_{3}$ by precipitation with gaseous $NH_{3}$ as precipitator was investigated to find an alternative process to solve various problems of present wet methods. This study consisted of two parts ; synthesis of $BaTiO_{3}$ precipitation with gaseous $NH_{3}$ and test of electrical property for the $La_{2}O_{3}$ doped $BaTiO_{3}$. The proper condition for the synthesis of $BaTiO_{3}$ by precipitation with gaseous $NH_{3}$ is as follows. The pH was 9.0. $H_{2}O_{2}$ mole ratio to $TiCl_{4}$ was 10. $NH_{3}$ gas follow rate did not influence the synthesis of $BaTiO_{3}$. The calcination temperature of $BaTiO_{3}$ was $300^{\circ}C$. Also, the synthesis of $La_{2}O_{3}$-doped $BaTiO_{3}$ was tested through the wet process. Under these condition, the shape of prepared $BaTiO_{3}$ powder was spherical type and the size of that was about $0.2{\mu}m$. After the powder was pressed, this green body was sintered at the $1300^{\circ}C$. Under these conditions, the water absorptance and the density of the obtained sintered body were below 0.04 %, 5.2 g/$cm^{3}$, respectively. Also the grain size of that was about $10{\mu}m$ and it was similar to commercial product.

• Journal of the Korean Applied Science and Technology
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• v.16 no.1
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• pp.33-40
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• 1999

We used Cu as a representative of metals to be directly adsorbed on the bare Si surface and studied its removal DHF, DHF-$H_2O_2$ and BHF solution. It has been found that Cu ion in DHF adheres on every Si wafer surface that we used in our study (n, p, n+, p+) especially on the n+-Si surface. The DHF-$H_2O_2$ solution is found to be effective in removing metals featuring high electronegativity such as Cu from the p-Si and n-Si wafers. Even when the DHF-$H_2O_2$ solution has Cu ions at the concentration of 1ppm, the solution is found effective in cleaning the wafer. In the case the n+-Si and p+-Si wafers, however, their surfaces get contaminated with Cu When Cu ion of 10ppb remains in the DHF-$H_2O_2$ solution. When BHF is used, Cu in BHF is more likely to contaminate the n+-Si wafer. It is also revealed that the surfactant added to BHF improve wettability onto p-Si, n-Si and p+-Si wafer surface. This effect of the surfactant, however, is not observed on the n+-Si wafer and is increased when it is immersed in the DHF-$H_2O_2$ solution for 10min. The rate of the metallic contamination on the n+-Si wafer is found to be much higher than on the other Si wafers. In order to suppress the metallic contamination on every type of Si surface below 1010atoms/cm2, the metallic concentration in ultra pure water and high-purity DHF which is employed at the final stage of the cleaning process must be lowered below the part per trillion level. The DHF-$H_2O_2$ solution, however, degrades surface roughness on the substrate with the n+ and p+ surfaces. In order to remove metallic impurities on these surfaces, there is no choice at present but to use the $NH_4OH-H_2O_2-H_2O$ and $HCl-H_2O_2-H_2O$ cleaning.

• Journal of Soil and Groundwater Environment
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• v.8 no.2
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• pp.62-69
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• 2003

The aim of research is the evaluation of the $Cr^{6+}$ emission features of the liquid injection through emission experiments in varying conditions, based on a field-mixing ratio. The results showed that the content of $Cr^{6+}$ content in cement measured had an Ordinary Potland Cement (OPC) of 25.3 mg/kg, which constitute the largest portion among the other materials. Likewise, the emission experiment of homo-gel and sand-gel generally satisfied the standard of KSLT (Korea Standard Leaching Test) in waste of 1.5 mg/L, but in case of the standard of KSLT in soil the emission of OPC $Cr^{6+}$ of 4.85 mg/kg. These conditions is a little exceeded the criteria in the ‘Ga’ area in terms of Korea Soil Environmental Preservation Law. In addition, results generated by the mock-up injection facilities revealed that $Cr^{6+}$ emission increased as Water/Cement and injection pressure increased. At injection pressure higher than 4 kg/㎤, $Cr^{6+}$ emission exceeded the water preservation standard of 0.5 mg/L. Similarly, a pattern experiment of C $r^{6+}$ emission according to pH was conducted, in order to evaluate the $Cr^{6+}$ emission features of grout materials in leachate below pH 5 such as pH 4 acid rain or landfill. Results show that $Cr^{6+}$ emission dramatically increased in high acidic or basic state. It indicates that $Cr^{6+}$ emission will probably increase in an environment where grout materials are injected. On the other hand, concentration of leachate was determined in areas where grout materials are used. The results show that the concentration of emission in an ultra purity condition does not manifest intensity, and is affected in the OPC>MC>SC order. It means that the pollutants or $Cr^{6+}$ emission increases with decreasing concentration. As such, $Cr^{6+}$ emission will probably exceed the countermeasure criteria according to the types of gout materials. Similarly, high pressure or injection will cause increased $Cr^{6+}$ emission. Therefore, the selection of materials or mixing ratio should be considered in general as well as according to specific industries, based on the strength and pH of $Cr^{6+}$ emission.