• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 춘계학술대회 논문집 센서 박막재료 반도체재료 기술교육
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• pp.24-26
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• 2002

In this paper, we discuss the electrical properties of self-assembled (2'-amino-4,4-di(ethynylphenyl)-5'-nitro-l-(thioacetyl)benzene), which has been well known as a conducting molecule having possible application to molecular level NDR device. The phenomenon of negative differential resistance (NDR) is characterized by decreasing current through a junction at increasing voltage. also fabrication of MIM-type molecular electronic and the Molecular Level Using Scanning Tunneling Microscopy

• 대한전기학회:학술대회논문집
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• 대한전기학회 2002년도 하계학술대회 논문집 C
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• pp.1572-1574
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• 2002

In this paper, we discuss the electrical properties of self-assembled (2'-amino-4,4-di(ethynylp henyl)-5'-nitro-1-(thioacetyl)benzene), which has been well known as a conducting molecule having possible application to molecular level NDR device. The phenomenon of negative differential resi(NDR) is characterized by decreasing current th a junction at increasing voltage, also fabricatio MIM-type molecular electronic device and the Molecular Level Using Scanning Tunneling Microscopy.

• 반도체디스플레이기술학회지
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• 제19권3호
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• pp.82-87
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• 2020

The comprehensive and physics-based compact noise models for advanced CMOS devices were presented. The models incorporate important physical effects in nanoscale MOSFETs, such as the low frequency correlation effect between the drain and the gate, the trap-related phenomena, and QM (quantum mechanical) effects in the inversion layer. The drain current noise model was improved by including the tunneling assisted-thermally activated process, the realistic trap distribution, the parasitic resistance, and mobility degradation. The expression of correlation coefficient was analytically described, enabling the overall noise performance to be evaluated. With the consideration of QM effects, the comprehensive low frequency noise performance was simulated over the entire bias range.

• 한국안전학회지
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• 제16권4호
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• pp.14-21
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• 2001

SG-365 steel is an important material End used for manufacturing a pressure vessel and gas piping. In this investigation, the elastic plastic fracture toughness of this material is evaluated by the unloading compliance method according to the ASTM E8l3-97 and E1152-97 method on the smooth and side groove In specimens. The effect of smooth and side groove is studied on the elastic plastic fracture toughness. The side grooved specimen is very useful in estimation of the $J_{IC}$. Because it is much easier than the smooth specimen to the onset of the ductile tearing by the R curve method. Besides. it improves the accuracy of toughness values, decreases the scattering of them and crack tunneling effect and shear lip by the side groove.

• 한국자기학회:학술대회 개요집
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• 한국자기학회 2000년도 International Symposium on Magnetics The 2000 Fall Conference
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• pp.5-32
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• 2000

MRAM, High performance MRAM using MTJS demostrated, fully integrated MTJ MRAM with CMOS circuits, write time ~2.3 nsec; read time ~3 nsec, Thermally stable up to ~350 C, Switching field distibution controlled by size & shape. Magnetic Tunnel Junction Properties, Magnetoresistance: ~50% at room temperature, enhanced by thermal treatment, Negative and Positive MR by interface modification, Spin Polarization: >55% at 0.25K, Insensitive ot FM composition, Resistance $\times$ Area product, ranging from ~20 to 10$^{9}$ $\Omega$(${\mu}{\textrm}{m}$)$^{2}$, Spin valve transistor, Tunnel injected spin polarization for "hot" electrons, Decrease of MTJMR at high bias originates from anode.

• EDISON SW 활용 경진대회 논문집
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• 제5회(2016년)
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• pp.299-304
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• 2016

2차원 반도체 소재의 경우 물질종류마다 내포하고 있는 고유결함에 의해서 Fermi-Level Pinning 이 발생하여 이로 인한 Schottky Barrier transistor로 동작을 하게 되며, 이는 접합부에 Carrier Injection 정도와 Schottky Barrier을 통과하는 Tunneling 정도에 의해서 소자의 특성이 결정 된다. 본 연구에서는 시뮬레이션을 통하여 2차원 반도체인 $MoS_2$소자를 설계하고, S/D Doping에 따라 접촉 저항 개선 효과와 소자의 동작특성이 어떠한 영향을 미치는지 연구하여 최대 $250cm^2/V{\cdot}sec$의 field effect mobility 의 결과를 얻었다. 또한 S/D doping 에 따라 각 저항 성분의 영향을 분석하였으며 면저항 및 접촉 저항 둘 다 doping 농도가 증가함에 따라 감소하는 결과를 나타내며, S/D doping의 영향은 접촉저항에서 더 크게 나타났다. 더불어 2차원 반도체의 Resistance network model 을 제안하여 subthreshold 영역에서는 $R_{ic}$, saturation 영역에서는 $R_{ish}$ 가 전체저항에서 주요한 변수로 전체저항식에 포함되어야 한다는 것을 시뮬레이션을 통해서 검증하였다.

• 한국자기학회지
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• 제8권1호
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• pp.27-33
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• 1998

스파터링법으로 Si(001) 기판 위에 증착된 Fe(1000 $\AA$)/Al2O3(t$\AA$)/Co(1000$\AA$) 자기 삼층 접합들의 터널링 자기저항 성질을 연구하였다. 두께 t=50~200$\AA$의 Al2O3층을 반응성 rf 스파터링법으로 바닥 자성층위에 직접 증착하였다. 비교응 위해, Pt/Al2O3/Pt 터널링 접합을 제조하여 상온에서 전류.전압(I.V)특성을 측정한 결과, 확인한 비선형 nonmhic 거동을 나타내었다. 이로부터 반응성 스파터링된 Al2O3가 상온에서도 phnhole이 없는 휼룔한 절연 터널링 장벽을 형성함을 확인할 수 있었다. Fe/Al2O3/Co 자기 터널링 접합즐은 Pt/Al2O3/Pt 접합들에 비해 상당한 접합저항의 열화를 보였으며, 상온에서 대략 0.1%의 터널링 자기저항비를 나타내었다. Fe를 꼭대기 전극으로 하는 전극으로 하는 접합들에 비해, Co을 꼭대기 전극으로 하는 대부분의 자기 터널링 접합들이 보다 안정된 I.V 및 터널링 자기저항 특성을 보였다. 이러한 실험결과들을 자기 터널링 접합들의 계면구조와 관련지어,Pt/Al2O3/Ptwjq합과 비교하여 논의하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 1999년도 제17회 학술발표회 논문개요집
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• pp.120-120
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• 1999

III-nitride계 물질들은 blue와 UV 영역의 LED, LD와 같은 광소자뿐만 아니라 HBT, FET와 같은 전자소자로도 널리 응용되고 있다. 이와 같은 물질을 이용한 소자를 제작할 수 있는 낮은 저항의 ohmic contact은 필수적이다. Al이나 Ti와 같은 물질을 기초로 한 n-GaN의 경우는 이미 많은 연구결과가 발표되어 전기적 광학적 소자를 동작하는데 충분히 낮은 ohmic contact저항( )을 었다. 그러나 p-GaN의 ohmic contact은 아직까지 많은 문제점을 내포하고 있다. 그 중의 하나는 높은 doping 농도( )의 p-GaN 박막을 성장하기가 어렵다는 것이며, 또 하나는 낮은 접촉 비저항을 얻기 위해선 7.5eV이상의 큰 재가 function을 지닌 금속을 선택해야 한다. 그러나 5.5eV 이상의 재가 function을 갖는 금속은 존재하지 않는다. 위와 같은 문제점들은 p-GaN의 접촉 비저항이 이상의 높은 값을 갖게 만들고 있으며, 이에 대한 해경방안으로는 고온의 열처리를 통하여 p-GaN와 금속 사이에서 화학적 반응을 일으킴으로써 표면 근처에서 캐리어농도를 증가시키고, 캐리어 수송의 형태가 tunneling 형태로 일어날 수 있도록 하는 tunneling current mechanism을 이용하는 것이다. 이로 인해 결국 낮은 접촉 비저항을 얻을 수 있게되며, 일반적으로 p-GaN에서는 Nidl 좋은 물질로 알려져 있다. 그러나 Ni은 50$0^{\circ}C$이상의 열처리에서 쉽게 산화되는 특성 때문에 높은 캐리어를 얻는데 어려운 문제점이 있다. 이에 본 연구에서는 MBE로 성장된 p-GaN박막을 Mg의 activation을 더욱 증가시키기 위해 N2 분위기에서 15분간 90$0^{\circ}C$에서 annealing을 하였으며, ohmic 접촉을 위한 금속으로 높은 재가 function과 좋은 adhesion 그리고 낮은 자체저항을 가지고 있는 Ni/Au를 ohmic metal로 하여 contact한 후에 90$0^{\circ}C$에서 10초간 rapid thermal annealing (RTA)처리를 했다. 성장된 박막의 광학적 성질은 PL로써 측정하였으며, photoconductivity 실험을 통해 impurity의 life time을 분석하였고, persistent photoconductivity를 통해 dark current를 측정하였다. 또한 contact resistance를 계산하기 위해 circular-TLM method을 이용하여 I-V 특성을 조사하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.448-448
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• 2010

Magnetic random access memory (MRAM) has made a prominent progress in memory performance and has brought a bright prospect for the next generation nonvolatile memory technologies due to its excellent advantages. Dry etching process of magnetic thin films is one of the important issues for the magnetic devices such as magnetic tunneling junctions (MTJs) based MRAM. CoFeB is a well-known soft ferromagnetic material, of particular interest for magnetic tunnel junctions (MTJs) and other devices based on tunneling magneto-resistance (TMR), such as spin-transfer-torque MRAM. One particular example is the CoFeB - MgO - CoFeB system, which has already been integrated in MRAM. In all of these applications, knowledge of control over the etching properties of CoFeB is crucial. Recently, transferring the pattern by using milling is a commonly used, although the redeposition of back-sputtered etch products on the sidewalls and the low etch rate of this method are main disadvantages. So the other method which has reported about much higher etch rates of >$50{\AA}/s$ for magnetic multi-layer structures using $Cl_2$/Ar plasmas is proposed. However, the chlorinated etch residues on the sidewalls of the etched features tend to severely corrode the magnetic material. Besides avoiding corrosion, during etching facets format the sidewalls of the mask due to physical sputtering of the mask material. Therefore, in this work, magnetic material such as CoFeB was etched in an ICP etching system using the gases which can be expected to form volatile metallo-organic compounds. As the gases, carbon monoxide (CO) and ammonia ($NH_3$) were used as etching gases to form carbonyl volatiles, and the etched features of CoFeB thin films under by Ta masking material were observed with electron microscopy to confirm etched resolution. And the etch conditions such as bias power, gas combination flow, process pressure, and source power were varied to find out and control the properties of magnetic layer during the process.

• Geomechanics and Engineering
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• 제17권1호
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• pp.57-67
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• 2019

Water-induced strength reduction is one of the most critical causes for rock deformation and failure. Understanding the effects of water on the strength, toughness and deformability of rocks are of a great importance in rock fracture mechanics and design of structures in rock. However, only a few studies have been conducted to understand the effects of water on fracture properties such as fracture toughness, crack propagation velocity, consumed energy, and microstructural damage. Thus, in this study, we focused on the understanding of how microscale damages induced by water saturation affect mesoscale mechanical and fracture properties compared with oven dried specimens along three notch orientations-divider, arrester, and short transverse. The mechanical properties of calcite-cemented sandstone were examined using standard uniaxial compressive strength (UCS) and Brazilian tensile strength (BTS) tests. In addition, fracture properties such as fracture toughness, consumed energy and crack propagation velocity were examined with cracked chevron notched Brazilian disk (CCNBD) tests. Digital Image Correlation (DIC), a non-contact optical measurement technique, was used for both strain and crack propagation velocity measurements along the bedding plane orientations. Finally, environmental scanning electron microscope (ESEM) was employed to investigate the microstructural damages produced in calcite-cemented sandstone specimens before and after CCNBD tests. As results, both mechanical and fracture properties reduced significantly when specimens were saturated. The effects of water on fracture properties (fracture toughness and consumed energy) were predominant in divider specimens when compared with arrester and short transverse specimens. Whereas crack propagation velocity was faster in short transverse and slower in arrester, and intermediate in divider specimens. Based on ESEM data, water in the calcite-cemented sandstone induced microstructural damages (microcracks and voids) and increased the strength disparity between cement/matrix and rock forming mineral grains, which in turn reduced the crack propagation resistance of the rock, leading to lower both consumed energy and fracture toughness ($K_{IC}$).