• Journal of Powder Materials
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• v.5 no.4
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• pp.329-333
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• 1998

Copper-10 wt. % tungsten alloyed powder was obtained by co-reduction of mixed tungsten-trioxide and copper oxide powders at 973 K for 7.2 Ks. In the alloy obtained by pressure-assisted sintering of this co-reduced powder, ultra fine tungsten particles (about 100nm) were dispersed uniformly in the copper matrix. At room temperature, the hardness of this alloy was Hv151 and the electrical conductivity was 85% IACS. After annealing at 1173 K for 3.6 Ks, the hardness and electrical conductivity were Hv147 and 84% IACS, respectively, and were same as before annealing. It was confirmed that the hardness and electrical conductivity of this alloy were hardly influenced by annealing condition since the microstructure of this alloy is highly stabilized.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.511-512
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• 2006

Tungsten coatings with different interlayers onto the oxygen-free copper substrates were fabricated by atmosphere plasma spraying. The effects of different interlayers of NiCrAl, NiAl and W/Cu on bonding strength were studied. SEM, EDS and XRD were used to investigate the photographs and compositions of these coatings. The tungsten coatings with different initial particle sizes resulted in different microstructures. Oxidation was not detected in the tungsten coating, but in the interlayer, it was found by both XRD and EDS. The tungsten coating deposited directly onto the copper substrate presented higher bonding strength than those with different interlayers.

• Nuclear Engineering and Technology
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• v.55 no.6
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• pp.1994-1998
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• 2023

This study quantitatively evaluated the source term of a linear accelerator according to target thickness for a 6-20 MeV electron beam using MCNP6. The elements of the target were tungsten and copper, and a composite target and single target were simulated by setting different thickness parameters depending on energy. The accumulation of energy generated through interaction with the collided target was evaluated at 0.1-mm intervals, and F6 tally was used. The results indicated that less than 3% reference error was maintained according to the MCNP recommendations. At 6, 8, 10, 15, 18, and 20 MeV, the energy accumulation peaks identified for each target were 0.3 mm in tungsten, 1.3 mm in copper, 1.5 mm in copper, 0.5 mm in tungsten, 0.5 mm in tungsten, and 0.5 mm in tungsten. For 8 and 10 MeV in a single target consisting only of copper, the movement of electrons was confirmed at the end of the target, and the proportion of escaped electrons was 0.00011% and 0.00181%, respectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.2
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• pp.156-161
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• 2004

We investigated the effects of oxidizer additive on the performance of Cu-CMP process using commonly used tungsten slurry. In order to compare the removal rate and non-uniformity as a function of oxidizer contents, we used alumina-based tungsten slurry and copper blanket wafers deposited by DC sputtering method. According to the CMP removal rates and particle size distribution, and the microstructures of surface layer by SEM image as a function or oxidizer contents were greatly influenced by the slurry chemical composition of oxidizers. The difference in removal rate and roughness of copper surface are believed to cause by modification in the mechanical behavior of $Al_2$O$_3$abrasive particles in CMP slurry.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.761-762
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• 2006

W-Cu alloy was very useful material for a heat sink, high electric contact and EDM electrode. Powder injection molding (PIM) is the optimum manufacturing technology to provide W-Cu components with low-cost and high-volume. We used various compositions of tungsten coated copper powders (W-Cu with 10 to 80 wt-% of copper) to manufacture W-Cu components by PIM. The optimum mixing, injection molding, debinding and sintering conditions to provide the high performance W-Cu components were investigated. The thermal and mechanical properties of W-Cu parts by PIM were measured. Finally, we can verify the high performance of W-Cu components by PIM with the tungsten coated copper.

• Korean Journal of Materials Research
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• v.4 no.4
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• pp.393-400
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• 1994

A new process for uniform coating of copper to submicron tungsten powder has been developed. W-Cu alloy where copper can be uniformly distibuted has been made by the liquid phase sintering of thus prepared tungsten powder. It has been found that copper content can be lowered less than IOwt. % in our new process, maintaining the uniform distribution of copper in W-Cu alloy. Relative density above 96% was obtained after the liquid phase sintering when small amount of cobalt was added. It was revealed that the rapid increase of densification rate was due to the enhancement of wettability between tungsten particle and liquid copper.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.377-378
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• 2006

Thermal management technology is a critical element in all new chip generations, caused by a power multiplication combined with a size reduction. A heat sink, mounted on a base plate, requires the use of special materials possessing both high thermal conductivity (TC) and a coefficient of thermal expansion (CTE) that matches semiconductor materials as well as certain packaging ceramics. In this study, nano tungsten coated copper powder has been developed with a wide range of compositions, 90W-10Cu to 10W-90Cu. Powder technologies were used to make samples to evaluate density, TC, and CTE. Measured TC lies among theoretical values predicted by several existing models.

• Proceedings of the KIEE Conference
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• 1999.07d
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• pp.1934-1937
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• 1999

A copper-tungsten sintered alloy(Cu-W) has been friction-welded to a tough pitch copper (Cu) in order to investigate friction weldability. The tensile strength of the friction welded joint was increased up to 87% of the Cu base metal under the condition of friction time 1.0 see, friction pressure 40MPa and upset pressure 100MPa, upset time 5.0 sec. And it is related to upset pressure rather than friction time. Mixed layer was formed in the Cu adjacent weld interface and W particles which were included in mixed layer could induce fracture in the Cu adjacent to the weld interface. Thickness of mixed layer was reduced as upset pressure increase.

• Metals and materials international
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• v.24 no.6
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• pp.1275-1284
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• 2018

A rotating magnetic field (RMF) was applied in the solidification process of Cu-8Fe alloy. Focus on the mechanism of RMF on the solid solution Fe(Cu) atoms in Cu-8Fe alloy, the influences of RMF on solidification structure, solute distribution, and material properties were discussed. Results show that the solidification behavior of Cu-Fe alloy have influenced through the change of temperature and solute fields in the presence of an applied RMF. The Fe dendrites were refined and transformed to rosettes or spherical grains under forced convection. The solute distribution in Cu-rich phase and Fe-rich phase were changed because of the variation of the supercooling degree and the solidification rate. Further, the variation in solute distribution was impacted the strengthening mechanism and conductive mechanism of the material.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.144.1-144.1
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• 2015

The triggered vacuum switch(TVS) is a one of the important component in consisiting high power control systems(HPCS). The operating condition is depended on material, geometry, operating power and so on. Our research is focused on the effects of thses basic properties and ptimized condition, because these are critical conditons in understanding the TVS operation. Our experiment is accomplished with a copper electrode and a tungsten trigger pin after being assembled into a vacuum chamber. The operating voltage in our system is more than dozens of kV at the 5kV trigger pulse. Our goal is up to 300kJ, therefore the currents should be more optimized in additional experiments,