• 제목/요약/키워드: tungsten effect

검색결과 320건 처리시간 0.028초

H2O2 산화제가 W/Ti 박막의 전기화학적 분극특성 및 CMP 성능에 미치는 영향 (Electrochemical Polarization Characteristics and Effect of the CMP Performances of Tungsten and Titanium Film by H2O2 Oxidizer)

  • 나은영;서용진;이우선
    • 한국전기전자재료학회논문지
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    • 제18권6호
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    • pp.515-520
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    • 2005
  • CMP(chemical mechanical polishing) process has been attracted as an essential technology of multi-level interconnection. Also CMP process got into key process for global planarization in the chip manufacturing process. In this study, potentiodynamic polarization was carried out to investigate the influences of $H_2O_2$ concentration and metal oxide formation through the passivation on tungsten and titanium. Fortunately, the electrochemical behaviors of tungsten and titanium are similar, an one may expect. As an experimental result, electrochemical corrosion of the $5\;vol\%\;H_2O_2$ concentration of tungsten and titanium films was higher than the other concentrations. According to the analysis, the oxidation state and microstructure of surface layer were strongly influenced by different oxidizer concentration. Moreover, the oxidation kinetics and resulting chemical state of oxide layer played critical roles in determining the overall CMP performance. Therefore, we conclude that the CMP characteristics tungsten and titanium metal layer including surface roughness were strongly dependent on the amounts of hydrogen peroxide oxidizer.

SiH$_4$를 이용한 텅스텐의 화학증착시 압력증가가 증착에 미치는 영향 (The Effect of Pressure Increase on the Deposition of Tungsten by CVD using SiH4)

  • 박재현;이정중;금동화
    • 한국표면공학회지
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    • 제26권1호
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    • pp.3-9
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    • 1993
  • Chemical vapor deposited tungsten films were formed in a cold wall reactor at pressures higher (10~120torr) than those conventionally employed (<1torr). SiH4, in addition to H2, was used as the reduction gas. The effects of pressure and reaction temperature on the deposition rate and morphology of the films were ex-amined under the above conditions. No encroachment or silicon consumption was observed in the tungsten de-posited specimens. A high deposition rate of tungsten and a good step coverage of the deposited films were ob-tained at 40~80 torr and at a temperature range of $360~380^{\circ}C$. The surface roughness and the resistivity of the deposited film increased with pressure. The deposition rate of tungsten increased with the total pressure in the reaction chamber when the pressure was below 40 torr, whereas it decreased when the total pressure ex-ceedeed 40 torr. The deposition rate also showed a maximum value at $360^{\circ}C$ regardless of the gas pressure in the chamber. The results suggest that the deposition mechanism varies with pressure and temperature, the surface reac-tion determines the overall reaction rate and (2) at higher pressures(>40 torr) or temperatures(>36$0^{\circ}C$), the rate is controlled by the dtransportation rate of reactive gas molecules. It was shown from XRD analysis that WSi2 and metastable $\beta$-W were also formed in addition to W by reactions between WF6 and SiH4.

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Microstructure and Tensile Properties of Tungsten Heavy Alloys

  • Islam, S.H.;Qu, X.H.;Akhtar, F.;Feng, P.Z.;Hea, X.B.
    • 한국분말야금학회:학술대회논문집
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    • 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
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    • pp.547-548
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    • 2006
  • The main object of this research was to examine the effect of sintering conditions on the microstructure of tungsten heavy alloys and how the resulting modification of the microstructure can be used to optimize their mechanical properties. Alloys composed of 88%, 93% and 95% wt. of tungsten and the balance is Ni: Fe in the ratio of 7:3 were sintered at different temperatures for different sintering holding times in hydrogen atmosphere. It was shown that the mechanical properties of the alloys, and especially their ductility, are harmed when tungsten grains are contiguous.

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자전연소 합성법을 이용한 W-B 화합물 합성 및 조건 변수의 영향 (Synthesis of Tungsten Boride using SHS(Self-propagating High-temperature Synthesis) and Effect of Its Parameters)

  • 최상훈;;원창환
    • 한국재료학회지
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    • 제24권5호
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    • pp.249-254
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    • 2014
  • Due to their unique properties, tungsten borides are good candidates for the industrial applications where certain features such as high hardness, chemical inertness, resistance to high temperatures, thermal shock and corrosion. In this study, conditions were investigated for producing tungsten boride powder from tungsten oxide($WO_3$) by self-propagating high-temperature synthesis (SHS) followed by HCl leaching techniques. In the first stage of the study, the exothermicity of the $WO_3$-Mg reaction was investigated by computer simulation. Based on the simulation experimental study was conducted and the SHS products consisting of borides and other compounds were obtained starting with different initial molar ratios of $WO_3$, Mg and $B_2O_3$. It was found that $WO_3$, Mg and $B_2O_3$ reaction system produced high combustion temperature and radical reaction so that diffusion between W and B was not properly occurred. Addition of NaCl and replacement of $B_2O_3$ with B successfully solved the diffusion problem. From the optimum condition tungsten boride($W_2B$ and WB) powders which has 0.1~0.9 um particle size were synthesized.

초경합금에 FVAS로 코팅한 DLC 박막의 특성 (Characteristic of DLC Thin Film Fabricated by FVAS Method on Tungsten Carbide)

  • 천민우;박용필;김태곤;이호식
    • 한국전기전자재료학회논문지
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    • 제24권10호
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    • pp.812-816
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    • 2011
  • An optical lens is usually produced in the manner of high temperature compression molding with tungsten carbide alloy molding cores, it is necessary to develop and study technology for super-precision processing of molding cores and coating the core surface. As main methods used in surface improvement technologies using thin film, DLC present high hardness, chemical stability, and outstanding durability of abrasion to be extensively applied in various industrial fields. In this study, the effect of DLC coating of a thin film by means of the FVAS (filtered vacuum arc source) analyzed the characteristics of thin film. Surface roughness before and after DLC coating was measured and the result showed that the surface roughness was improved after coating as compared to before coating. In conclusion, it was observed that DLC coating of the ultra hard alloy core surface for molding had an effect on improving the surface roughness and shape of the core surface. It is considered that this will have an effect on improving abrasion resistance and the service life of the core surface.

음이온교환 수지를 이용한 바나듐/텅스텐 혼합용액으로부터 바나듐/텅스텐 분리회수에 관한 연구 (Separation of Vanadium and Tungsten from Simulated Leach Solutions using Anion Exchange Resins)

  • 전종혁;김홍인;이진영;라제쉬 쿠마
    • 자원리싸이클링
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    • 제31권6호
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    • pp.25-35
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    • 2022
  • 본 연구는 겔 타입의 음이온교환 수지를 이용하여 바나듐과 텅스텐 이온의 흡·탈착 거동과 분리조건을 규명하였다. 용액의 초기산도에 따른 흡착실험에서 바나듐은 강산성 및 강염기성에서 흡착률이 현저히 낮아지며, 텅스텐은 강염기성에서 흡착률이 낮게 나타났다. 반응온도의 상승은 흡착반응속도 및 최대흡착량의 증가에 영향을 주었으며, 텅스텐은 최대흡착량에 미치는 영향이 미미하였다. 이온교환 수지에 대한 바나듐과 텅스텐의 흡착등온실험은 두 이온 모두 Langmuir 흡착등온식에 적합하였으며, 텅스텐의 경우 폴리옥소메탈레이트화 되어 이온 간의 결합이 이루어져 다분자층 흡착의 형태가 나타나 Freundlich 흡착등온식에도 적합한 것으로 나타났다. 두 이온교환 수지 모두 유사 2차 반응속도모델에서 잘 모사되었으며, 탈착용액의 종류에 따른 바나듐과 텅스텐의 탈착특성에서 바나듐은 HCl 수용액 및 NaOH 수용액 모두 탈착이 이루어 졌으며, 텅스텐은 HCl 수용액에서 탈착이 전혀 이루어지지 않아 탈착공정을 통한 두 이온의 분리가 가능하였다. 탈착반응은 반응 개시 후 30분 이내에 평형에 도달하였으며, 90% 이상 회수가 가능하였다.

Brain CT검사 시 3D프린터 필라멘트에 따른 수정체 차폐 연구 (A Study on the Shielding of Orbit by 3D Printed Filament in Brain CT)

  • 최우전;김동현
    • 한국방사선학회논문지
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    • 제15권2호
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    • pp.101-108
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    • 2021
  • CT는 인체 내 장기의 해부학적 구조를 정확하게 나타낼 수 있으며, 영상의 분해능이 우수하다. Brain CT 검사 시 수정체의 방사선 감수성이 높아서 피폭의 영향을 많이 받는다. 본 연구는 수정체에 피폭선량을 감소하기 위해 비스무스와 텅스텐 필라멘트 차폐물질을 사용하여 Non-shield와 Shield에 대한 피폭선량의 변화와 차폐율을 비교 하고자 한다. 본 연구에서는 3D printing으로 제작한 비스무스, 텅스텐 필라멘트 차폐물질을 사용하여, 차폐물질 두께와 slice에 따라 피폭되는 선량을 측정하였다. 헤드팬텀을 고정시켜 안구에 Magicmax universal 선량계를 위치시켜 차폐 물질을 놓지 않았을 경우와 그 위에 차폐 물질을 놓았을 때 차폐율을 각각 비교하기 위해 두 물질을 1mm ~ 5mm 두께로 각각 측정하였다. 1 mm 두께의 필라멘트에서 비스무스 필라멘트는 26.8 %, 텅스텐 필라멘트는 43.1 % 차폐율이 나타났다. 따라서 비스무스 필라멘트보다 텅스텐 필라멘트에서 더 큰 차폐효과가 나타났다. 차폐체의 종류, 두께, 슬라이스 간격에 따라 선량을 측정한 결과, 비스무스 필라멘트 보다 텅스텐 필라멘트가 더 큰 차폐효과가 나타났다.

Effect of surface quality on hydrogen/helium irradiation behavior in tungsten

  • Chen, Hongyu;Xu, Qiu;Wang, Jiahuan;Li, Peng;Yuan, Julong;Lyu, Binghai;Wang, Jinhu;Tokunaga, Kazutoshi;Yao, Gang;Luo, Laima;Wu, Yucheng
    • Nuclear Engineering and Technology
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    • 제54권6호
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    • pp.1947-1953
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    • 2022
  • As the plasma facing material in the nuclear fusion reactor, tungsten has to bear the irradiation impact of high energy particles. The surface quality of tungsten may affect its irradiation resistance, and even affect the service life of fusion reactor. In this paper, tungsten samples with different surface quality were polished by mechanical processing, subsequently conducted by D2+ implantation and thermal desorption. D2+ implantation was performed at room temperature (RT) with the irradiation dose of 1 × 1021 D2+/m2 by 5 keV D2+ ions, and thermal desorption spectroscopy measurements were done from RT to 900 K. In addition, He irradiation was also performed by 50 eV He+ ions energy with the fluxes of 5.5 × 1021 m-2s-1 and 1.5 × 1022 m-2s-1, respectively. Results reveal that the hydrogen/helium irradiation behavior are both related to surface quality. Samples with high surface quality has superior D2+ retention behavior with less D2 retained after implantation. However, such samples are more likely to generate fuzzes on the surface after helium irradiation. Different morphologies (smooth, wavy, pyramids) after helium irradiation also demonstrates that the surface morphology is related to tungsten crystallographic orientation.

텅스텐 폴리사이드 게이트 구조에서의 열처리 효과 (Effect of Heat Treatments on Tungsten Polycide Gate Structures)

  • 고재석;천희곤;조동율;구경완;홍봉식
    • 한국진공학회지
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    • 제1권3호
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    • pp.376-381
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    • 1992
  • Tungsten silicide films were deposited on the highly phosphorus-doped poly Si/SiO2/Si substrates by Low Pressure Chemical Vapor Deposition. They were heat treated in different conditions. XTEM, SIMS and high frequency C-V analysis were conducted for characterization. It can be concluded that outdiffusion of phosphours impurity throught the silicide films lead to its depletion in the poly-Si gate region near the gate oxide, resulting in loss of capacitance and increase of effective gate oxide thickness.

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