• Title/Summary/Keyword: transmission line parameters

Search Result 289, Processing Time 0.025 seconds

Electrical Stress Analysis of High Voltage motor Winding by Switching Surge (스위칭 서지에 의한 고압유도전동기의 권선의 전기적 스트레스 해석)

  • Kim, Jong-Kyeom;Lee, Eun-Woong;Kim, Il-Jung
    • Proceedings of the KIEE Conference
    • /
    • 1993.07b
    • /
    • pp.990-992
    • /
    • 1993
  • Studies have been made to establish what coil design parameters have an important influence on the amplitude of interturn voltages developed in a machine winding subject to steep-fronted surges. The studies are based on a lattice-diagram model of multi conductor transmission line in a machine winding energised by a simple ramp function. Variations in interturn voltages produced by changes in insulation thickness, insulation permittivity, surge wave-front are examined and certain guidelines for avoiding high interturn voltages are evaluated.

  • PDF

A Study on the Characteristics of Coupling Loss factor Associated with Fluid Loading (접수 구조물의 연성손실계수 변화에 관한 연구)

  • 류정수
    • The Journal of the Acoustical Society of Korea
    • /
    • v.19 no.6
    • /
    • pp.17-22
    • /
    • 2000
  • Statistical Energy Analysis(SEA) is an efficient tool to predict the broadband noise and vibration for the huge and complex structures such as aircraft and ships. To estimate the noise and vibration by using SEA accurately, the characteristics of SEA parameters associated with fluid loading have to be investigated. In this report, the fluid loaded coupling loss factors were calculated for an 'L' and 'T' type line connections and compared to the ones without fluid loading. Then, the vibration levels for steel box model with 'L' and 'T' type line connection were computed using the fluid loaded and no fluid loaded coupling loss factors, respectively. As a result, the calculated vibration levels of the model using the fluid loaded coupling loss factors were lower than those without fluid loading. As a conclusion, it is necessary to use the fluid loaded coupling loss factors for increasing the prediction accuracy on the noise and vibration of immersed structures.

  • PDF

Underlayer Geometry Effects on Interconnect Line Characteristics and Signal Integrity (연결선 특성과 신호 무결성에 미치는 밑층 기하구조 효과들)

  • Wee, Jae-Kyung;Kim, Yong-Ju
    • Journal of the Institute of Electronics Engineers of Korea SD
    • /
    • v.39 no.9
    • /
    • pp.19-27
    • /
    • 2002
  • Characteristics of interconnect lines considering underlayer geometries of a silicon substrate and crossing metal lines are experimentally analyzed through elaborately devised patterns. In this work, test patterns for transmission lines having several kinds of underlayer geometries were devised, and the signal characteristics and responses are measured by S-parameter and time domain reflection meter (TDR). The patterns were designed and fabricated with a deep-submicron CMOS DRAM technology having 1 Tungsten and 2 Aluminum metals. From the analysis of measured results on the patterns, it is founded that the effects of underlayter line structures on line parameters (especially line capacitance and resistance) and signal distortions occurred from them cannot be negligible. The results provide useful and insightful understanding in the skew balance of package leads and global signal lines such as high-speed clock and data lines.

A hybrid model of regional path loss of wireless signals through the wall

  • Xi, Guangyong;Lin, Shizhen;Zou, Dongyao
    • KSII Transactions on Internet and Information Systems (TIIS)
    • /
    • v.16 no.9
    • /
    • pp.3194-3210
    • /
    • 2022
  • Wall obstruction is the main factor leading to the non-line of sight (NLoS) error of indoor localization based on received signal strength indicator (RSSI). Modeling and correcting the path loss of the signals through the wall will improve the accuracy of RSSI localization. Based on electromagnetic wave propagation theory, the reflection and transmission process of wireless signals propagation through the wall is analyzed. The path loss of signals through wall is deduced based on power loss and RSSI definition, and the theoretical model of path loss of signals through wall is proposed. In view of electromagnetic characteristic parameters of the theoretical model usually cannot be accurately obtained, the statistical model of NLoS error caused by the signals through the wall is presented based on the log-distance path loss model to solve the parameters. Combining the statistical model and theoretical model, a hybrid model of path loss of signals through wall is proposed. Based on the empirical values of electromagnetic characteristic parameters of the concrete wall, the effect of each electromagnetic characteristic parameters on path loss is analyzed, and the theoretical model of regional path loss of signals through the wall is established. The statistical model and hybrid model of regional path loss of signals through wall are established by RSSI observation experiments, respectively. The hybrid model can solve the problem of path loss when the material of wall is unknown. The results show that the hybrid model can better express the actual trend of the regional path loss and maintain the pass loss continuity of adjacent areas. The validity of the hybrid model is verified by inverse computation of the RSSI of the extended region, and the calculated RSSI is basically consistent with the measured RSSI. The hybrid model can be used to forecast regional path loss of signals through the wall.

Analysis of the Warm Shrink Fitting Process for Assembling the Part(Shaft and Output Gear) (단품(축/OUTPUT 기어)조립을 위한 온간압입공정 해석)

  • Kim, Tae-Jin;Kang, Hee-Jun;Kim, Chul;Chu, Suck-Jae;Kim, Ho-Yun
    • Journal of the Korean Society for Precision Engineering
    • /
    • v.25 no.6
    • /
    • pp.47-54
    • /
    • 2008
  • Fitting process carried out in the automobile transmission assembly line is classified into three classes; heat fitting, press fitting, and their combined fitting. Heat fitting is a method that heats gear to a suitable range under the tempering temperature and squeezes it toward the outer diameter of shaft. Its stress depends on the yield strength of gear. Press fitting is a method that generally squeezes gear toward that of shaft at room temperature by a press. Another method heats warmly gear and safely squeezes it toward that of shaft. Warm shrink fitting process for the automobile transmission part is now gradually increased, but the parts (shaft/gear) assembled by this process produced dimensional changes in both the outer diameter and profile of the gear. So that it may cause noise and vibration between gears. In order to solve these problems, we need an analysis of warm shrink fitting process, in which design parameters are involved; contact pressure according to fitting interference between outer diameter of shaft and inner diameter of gear, fitting temperature, and profile tolerance of gear. In this study, an closed form equation to predict contact pressure and fitting load was proposed in order to develop an optimization technique of the warm shrink fitting process and verified its reliability through the experimental results measured in the field and FEM, that is, thermal-structural coupled field analysis. Actual loads measured in the field was in good agreements with the results obtained by the theoretical and finite element analysis.

Study on the Current Spreading Effect of Blue GaN/InGaN LED using 3-Dimensional Circuit Modeling (3차원의 회로 모델링을 이용한 청색 GaN/InGaN LED의 전류 확산 효과에 관한 연구)

  • Hwang, Sung-Min;Shim, Jong-In
    • Korean Journal of Optics and Photonics
    • /
    • v.18 no.2
    • /
    • pp.155-161
    • /
    • 2007
  • A new and simple method of 3-dimensional circuit modeling and analysis is proposed and verified experimentally for the first time by determining 3-dimensional current flow and 2-dimensional light distribution in blue InGaN/GaN multi-quantum well (MQW) light emitting diode (LED) devices. Circuit parameters of the LED consist of the resistance of the metallic film and epitaxial layer, and the intrinsic diode which represents the active region emitting the light. The circuit parameters are extracted from the transmission line model (TLM) and current-voltage relation. We applied the >> proposed method and extracted circuit parameters to obtain the light emission pattern in a top-surface emitting-type LED. The current spreading effect is analyzed theoretically and quantitatively with a variation of the resistance of metallic and epitaxial layers. The emitting-light distribution of the fabricated blue LED showed a good agreement with the analyzed result, which shows the dark emission intensity at the corner of the p-electrode.

Design of Ultra Wide Band MMIC Digital Attenuator with High Attenuation Accuracy (높은 감쇠 정확도를 가지는 초광대역 MMIC 디지털 감쇠기 설계)

  • Ju Inkwon;Yom In-Bok
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
    • /
    • v.17 no.2 s.105
    • /
    • pp.101-109
    • /
    • 2006
  • A broadband, DC to 40 GHz 5-bit MMIC digital attenuator has been developed. The ultra broadband attenuator has been achieved by adding transmission lines in the conventional Switched-T attenuator and optimizing the transmission line parameters. Momentum simulation was performed in design for accurate performance prediction at high frequencies and Monte Carlo analysis was applied to verify the performance stability against the MMIC process variation. The attenuator has been fabricated with $0.15\;{\mu}m$ GaAs pHEMT process. This attenuator has 1 dB resolution and 23 dB dynamic ranges. High attenuation accuracy has been achieved over all attenuation ranges and 40 GHz bandwidth with the reference state insertion loss of less than 6 dB at 20 GHz. The input and output return losses of the attenuator are better than 14 dB over all attenuation states and frequencies. The measured IIP3 of the attenuator is 33 dBm.

Nano-scale Power Splitters by using Plasmonic Multimode Interference Couplers (플라즈마 다중모드 간섭 결합기를 사용한 나노 크기의 전력분배기)

  • Ho, Kwang-Chun
    • The Journal of the Institute of Internet, Broadcasting and Communication
    • /
    • v.11 no.4
    • /
    • pp.47-52
    • /
    • 2011
  • Nano-scale power splitter based on Si plasmonic waveguides are designed by utilizing the multimode interference (MMI) coupler. Effective dielectric method and longitudinal modal transmission-line theory are used for simulating the light propagation and optimizing the structural parameters at 3-D guiding geometry. The designed $1{\times}2$ 50:50 MMI power splitter has a nano-scale size of only $800nm{\times}850nm$. In order to achieve a variable power splitting ratio, a $2{\times}2$ MMI coupler is designed and the corresponding power splitting ratio can be tuned in the range of 78.5%:15.5%~5.5%:86.6%. Also, it is shown that it has a large bandwidth of $1.5{\mu}m{\sim}1.7{\mu}m$. In this range, the transmission is over 0.8.

High Performance RF Passive Integration on a Si Smart Substrate for Wireless Applications

  • Kim, Dong-Wook;Jeong, In-Ho;Lee, Jung-Soo;Kwon, Young-Se
    • ETRI Journal
    • /
    • v.25 no.2
    • /
    • pp.65-72
    • /
    • 2003
  • To achieve cost and size reductions, we developed a low cost manufacturing technology for RF substrates and a high performance passive process technology for RF integrated passive devices (IPDs). The fabricated substrate is a conventional 6" Si wafer with a 25${\mu}m$ thick $SiO_2$ surface. This substrate showed a very good insertion loss of 0.03 dB/mm at 4 GHz, including the conductive metal loss, with a 50 ${\Omega}$ coplanar transmission line (W=50${\mu}m$, G=20${\mu}m$). Using benzo cyclo butene (BCB) interlayers and a 10 ${\mu}m$ Cu plating process, we made high Q rectangular and circular spiral inductors on Si that had record maximum quality factors of more than 100. The fabricated inductor library showed a maximum quality factor range of 30-120, depending on geometrical parameters and inductance values of 0.35-35 nH. We also fabricated small RF IPDs on a thick oxide Si substrate for use in handheld phone applications, such as antenna switch modules or front end modules, and high-speed wireless LAN applications. The chip sizes of the wafer-level-packaged RF IPDs and wire-bondable RF IPDs were 1.0-1.5$mm^2$ and 0.8-1.0$mm^2$, respectively. They showed very good insertion loss and RF performances. These substrate and passive process technologies will be widely utilized in hand-held RF modules and systems requiring low cost solutions and strict volumetric efficiencies.

  • PDF

Coupling Efficiency of Optical Directional Coupler with Rib-Type (Rib형 광 방향성 결합기의 결합효율)

  • Lee, Won-Seock;Ho, Kwang-Chun;Kim, Yung-Kwon
    • Journal of IKEEE
    • /
    • v.3 no.1 s.4
    • /
    • pp.86-92
    • /
    • 1999
  • A rigorous modal transmission-line theory (MTLT) based on effective dielectric method (EDM) is introduced and developed for the design of optical directional couplers with rib-type. This approach provides a rigorous numerical algorithm that takes all the possible guided components into consideration, and thus may serve as an appropriate reference to access the accuracy of such simplified methods as effective index method (EIM) and perturbation theory. Consequently, to search the optical parameters for maximum power coupling of the optical couplers, we evaluate the operating wavelength, the interval S between rib guides and the thickness t of a cladding layer.

  • PDF