• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.30-34
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• 2008

The transfer assembly (or transfer printing) technique is a promising method for fabricating multi-scale structures on various substrates including semiconductors and polymers, and has been applied to fabrication of flexible devices with superior performance to conventional organic flexible devices. The mechanical behaviors of the structures fabricated by the transfer assembly is a very important information for design and reliability evaluation purpose, but the measurement of the behaviors is difficult since their critical-dimensions are very tiny. In this study, Au films with nano-scale thickness were fabricated on a silicon substrate and their mechanical properties were measured using micro-tensile test. The Au films on the silicon substrate were then transferred to a PDMS substrate using the transfer assembly technique. Self-assembled monolayer (SAM) with a thiol group was used to enhance the transfer of Au films, and the mechanical behaviors were characterized using wrinkle-based test. The test results from micro-tensile and wrinkle-based test are compared to each other, and their implication to the transfer assembly technique is discussed.

• Journal of Welding and Joining
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• 제15권6호
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• pp.105-115
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• 1997

A numerical study is performed to predict the thermal response of a detailed card assembly during infrared reflow soldering. The card assembly is exposed to discontinuous infrared panel heater temperature distributions and high radiative/convective heating and cooling rates at the inlet and exit of the oven. The convective, radiative and conduction heat transfer within the reflow oven as well as within the card assembly are simulated and the predictions illustrate the detailed thermal responses. The predictions show that mixed convection plays an important role with relatively high frequency effects attributed to buoyancy forces, however the thermal response of the card assembly is dominated by radiation. The predictions of the detailed card assembly thermal response can be used to select the oven operating conditions to ensure proper solder melting and minimization of thermally induced card assembly tresses and warpage.

• Journal of Mechanical Science and Technology
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• 제20권9호
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• pp.1514-1524
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• 2006

This work presents the three-dimensional analysis of flow and heat transfer performed for a wire-wrapped fuel assembly of liquid metal reactor using Reynolds-averaged Wavier-Stokes analysis in conjunction with 557 model as a turbulence closure. The whole fuel assembly has been analyzed for one period of the wire-spacer using periodic boundary conditions at inlet and outlet of the calculation domain. Three different assemblies, two 7-pin wire-spacer fuel assemblies and one bare rod bundle, apart from the pressure drop calculations for a 19-pin case, have been analyzed. Individual as well as a comparative analysis of the flow field and heat transfer have been discussed. Also, discussed is the position of hot spots observed in the wire-spacer fuel assembly. The flow field in the subchannels of a bare rod bundle and a wire-spacer fuel assembly is found to be different. A directional temperature gradient is found to exist in the subchannels of a wire-spacer fuel assembly Local Nusselt number in the subchannels of wire-spacer fuel assemblies is found to vary according to the wire-wrap position while in case of bare rod bundle, it's found to be constant.

• 산업경영시스템학회지
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• 제19권39호
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• pp.63-73
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• 1996

With the success of flexible manufacturing systems (FMSs), flexible assembly systems (FASs) have been developed to automate factories further. As in a cellular FMS, a cellular FAS is considered as the most flexible and feasible assembly system configuration Because of the differences between manufacturing and assembly operation, the logic of cell formation and cell layout between a FMS and a FAS is not the same. Since the time for assembly operation is usually relatively short, the transfer time is thus very crucial for the performance of assembly systems. Therefore in assembly systems it is important to reduce the transfer time by sequencing operations efficiently and arranging machines like the sequences. The network-type layout is not only feasible for the machine arrangement based on operation sequences, but it has also layout flexibility. Therefore it is a reasonable layout configuration for cellular FASs. This paper presents a method for the cell layout based on the network-type layout in a cellular FAS design.

• 오토저널
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• 제6권1호
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• pp.36-45
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• 1984

The conventional heat transfer analysis methods based on the one-dimensional theory are not adequate to be applied for the purpose of finned surface design because the two-dimensional effects in fact are induced within the supporting wall by the presence of the finnes. In this study, the two-dimensional heat transfer of a straight fin assembly is analyzed by using the integral method. It is shown that all the effects of the system parameters i.e., the heat transfer parameters and geometrical parameters, on both the total heat transfer rate and the surface temperature effectiveness can be seen from the present analysis. The optimum combinations of these parameters for the design of finned surfaces may be estimated.

• Current Optics and Photonics
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• 제7권4호
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• pp.398-407
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• 2023

We explored a method to evaluate imaging performance for the optimal assembly of an endoscopic miniature lens and a sensor constituting an imaging module at the distal end of gastrointestinal endoscopy. For the assembly of the imaging module, the image sensor was precisely located at the focal plane when collimated light passed through the endoscopic lens. As another method, the distance between the lens and sensor was adjusted to obtain the highest focus index from images measured the star chart of the International Organization for Standardization (ISO) standard at various positions. We analyzed the slanted-edge modulation transfer function (MTF), corresponding depth of field, and number of line pairs for MTF 50% and 20% at each working distance within the range of 5-100 mm for imaging modules assembled in different ways. Assembly conditions of the imaging module with better MTF performance were defined for each working distance range of 5-30 mm and 30-100 mm, respectively. In addition to the MTF performance, the focus index of each assembled module was also compared. In summary, we examined the performance of imaging modules assembled with different methods within the suggested working distance and tried to establish the optimal assembly protocol.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.381-382
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• 2010

• Nuclear Engineering and Technology
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• 제53권10호
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• pp.3207-3216
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• 2021

Three-dimensional structures of a vortical flow field and heat transfer characteristics in a partially blocked 7-pin fuel assembly mock-up of sodium-cooled fast reactor have been investigated through a numerical analysis using a commercial computational fluid dynamics code, ANSYS CFX. The simulation with the SST turbulence model agrees well with the experimental data of outlet and cladding wall temperatures. From the analysis on the limiting streamline at the wall, multi-scale vortexes developed in axial direction were found around the blockage. The vortex core has a high cladding wall temperature, and the attachment line has a low cladding wall temperature. The small-scale vortex structures significantly enhance the convective heat transfer because it increases the turbulent mixing and the turbulence kinetic energy. The large-scale vortex structures supply thermal energy near the heated cladding wall surface. It is expected that control of the vortex structures in the fuel assembly plays a significant role in the convective heat transfer enhancement. Furthermore, the blockage plate and grid spacer increase the pressure drop to about 36% compared to the bare case.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 추계학술대회
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• pp.1063-1068
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• 2004

A numerical study is performed to predict the effect of operating conditions on the thermal response of electronic assemblies during infrared reflow soldering. The multimode heat transfer within the reflow oven as well as within the electronic assembly is simulated, and the predictions illustrate the detailed thermal responses. Parametric study is performed to determine the thermal response of electronic assemblies to various conditions such as conveyor speed, exhaust velocity, and component emissivity. The predictions of the detailed electronic assembly thermal response can be used in selecting the oven operating conditions to ensure proper soldering and minimization of thermally-induced electronic assembly stresses.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2007년도 춘계학술대회
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• pp.169-171
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• 2007

A breaking layer was introduced to conventional decal transfer method in membrane electrolyte assembly fabrication for high catalyst transfer ratio. In this study, the modified decal transfer method with high catalyst transfer ratio was introduced and its performance is studied. The structural features of electrodes made by decal method were investigated using scanning electron microscopy and current-voltage polarization measurement.