• Journal of Surface Science and Engineering
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• v.20 no.3
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• pp.106-117
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• 1987

The microhardness and the structural characteristics of the chemically vapor deposited TiN film on the 430 stainless steel substrate have been investigated with various deposition parameters such as the deposition time, the total flow rate, the flow rate ratio $(H_2/N_2)$, and the deposition temperature. The most important factor to affect the microhardness of the TiN film in this study was the denseness of the structure in connection with the degree of the lattice strain. The relationship between the lattice parameter changes and the grain size variation under all deposition conditions generally followed the grain boundary relaxation model. The (111) preferred orientation prevailed in the early stage of the deposition conditions, however, the (200) preferred orientation was developed in the later stage. The surface morphology at optimum conditions displayed a dense diamond shaped structure and the microhardness of the films was high (1700-2400Hv) regardless of the type of the substrates used.

• Journal of Surface Science and Engineering
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• v.15 no.3
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• pp.138-145
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• 1982

The effects of the simultaneous variations of the ratio of feed gases(H2/N2 Flow ratio), feed gas flow rate (H2/N2, total-flow rate) and partial pressures of TiCl4 (PTiCl41) as well as deposition time and cobalt content of the substrate on the deposition rate of the TiN Coated Cemented Tungsten Carbide Tools were investigated. Deposition was carried out in the temperature range of 930$^{\circ}C$-1080$^{\circ}C$ and an activation energy of 46.5 Kcal/mole can be calculated. Transverse rupture strength was noticeably reduced by the TiN coating on the virgin surfa-ce of Cemented Tungsten Carbide, the extent of which was decreased according to the coa-ting thickness. Microhardness value observed on the work was in the range of 1700∼2000kg/mm, which were in well agreement with the value of bult TiN. The wear resistance of TiN layers was performed by turning test and it was observed that crater and flank resistance remarkably enhanced by TiN coating.

• Journal of the Korean Vacuum Society
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• v.7 no.4
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• pp.314-319
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• 1998

TiN thin films were deposited on SKD 61 steel substrates by reactive sputtering under various deposition conditions, and subsequently their growth characteristics and properties were studied. Deposition rate was proportionally increased with total gas pressure as well as RF input power, while the increase of nitrogen in the reaction gas induced a significant suppression of deposition rate. The resulted films exhibited hillocks on the surface. The TiN film prepared using a typical deposition condition showed a (111) preferred orientation and maintained the stoichiometry of pure TiN.

• Journal of the Korean Ceramic Society
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• v.32 no.11
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• pp.1246-1254
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• 1995

A numerical model for fabrication and deposition of ultrafine SiO2 particles were proposed in the simplified horizontal MCVD apparatus using tube furnace reactor. The model equations such as energy and mass balance equations and the 0th, 1st and 2nd moment balance equations of aerosols were considered in the reactor. The phenomena of SiCl4 chemical reaction, SiO2 particle formation and coagulation, diffusion and thermophoresis of SiO2 particles were included in the aerosol dynamic equation. The profiles of gas temperature, SiCl4 concentration and SiO2 particle volume were calculated for standard conditions. The concentrations, sizes and deposition efficiencies of SiO2 particles were calculated, changing the process conditions such as tube furnace setting temperature, total gas flow rate and inlet SiCl4 concentration.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.5
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• pp.371-377
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• 1998

The plasma chemical vapor deposition is one of the most utilized techniques for the diamond growth. As the applications of diamond thin films prepared by plasma chemical vapor deposition(CVD) techniques become more demanding, improved fine-tuning and control of the process are required. The important parameters in diamond film deposition include the substrate temperature, $CO/H_2$gas flow ratio, total gas pressure, and gas excitation power. With the spectroscopic ellipsometry, the substrate temperature as well as the various parameters of the film can be determined without the physical contact and the destructiveness under the extreme environment associated with the diamond film deposition. Through this paper, the important parameters during the diamond film growth using $CO+H_2$are determined and it is shown that $sp^2$ C in the diamond film is greatly reduced.

• Journal of Surface Science and Engineering
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• v.22 no.3
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• pp.118-127
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• 1989

The rate of electrodeposition Zinc-nickel alloy on to electrolytic ione in sulface solution both under an inter and air atmospherss has studied by use of a rotating disc geometry. The kinetics shows 1st order reaction, and the rate constants are proportional to the square root of rpm, however, they are less than the valuse suggested by Levich. The rate constants of zinc deposition approach the total mass transfer rate constants with increasing potential and deviate with increasing rotaing speed, but those of nickel deposition are constant. Below $40^{\circ}C$ the activation engrgies of zinc deposition and nikel deposition were 4.4Kcal/mol and 6.3Kcal/mol respectively. There results show that overall reaction rate of zinc-nickel plaeting is controlled by mixed reaction and zinc deposotion is more affected by mass transfer reaction than nickel. The current density for the zinc-nickel plating was less in an air atmosphere than in a nitrogen atmosphere. The cathode efficiency increased with decreasing cathode rotating speeds, potentials, and increasing temperatures. Zzinc-nickel platings are more improved in microhardnss than zinc platings.

• Journal of Korean Society of Environmental Engineers
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• v.22 no.3
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• pp.575-585
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• 2000

Mass and elemental dry deposition fluxes and ambient particle size distributions were measured using dry deposition plates, a cascade impactor. and a CPS(Coarse Particle Sampler), from July to November 1998 in Seoul. Korea. Primarily anthropogenic elemental fluxes (Cu, Mn, Ni, Pb, Zn) were on average one to two orders of magnitude lower than primarily crustal elements (Al, Ca). Complete total and elemental particle size distributions showed trimodal size distributions due to the peak in particles larger than $10{\mu}m$ in diameter. A multi-step model and the Sehmel-Hodgson model were used to calculate total and cumulative deposition fluxes. The result indicated that dry deposition fluxes were extremely sensitive to the mass of particles larger than $10{\mu}m$ in diameter due to their high dry deposition velocities. The result showed that particles larger than $10{\mu}m$ in diameter dominated atmospheric dry deposition. The modeled fluxes calculated using the measured atmospheric particle size distributions and modeled deposition velocities were compared to measured ones. In general, the measured mass and elemental fluxes agreed well with the modeled ones.

• Journal of the Korean GEO-environmental Society
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• v.22 no.2
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• pp.25-33
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• 2021

This study was conducted to understand the deposition characteristics of debris flow and to analyze the reduction effect of debris flow damage by installing a berm. Flume experiments were performed in consideration of various channel slope and volumetric sediment concontration. In order to analyze the reduction effect of debris flow damage by installing a berm, the cases of not installing a berm and the cases of installing a berm were compared. In this study, the runout distance, total travel distance, and mobility ratio were analyzed among the deposition characteristics of debris flow. First, the deposition characteristics of debris flow according to the change of the channel slope were analyzed, and the deposition characteristics of debris flow due to the change of volumetric sediment concentration were analyzed. In addition, the change rate of debris flow deposition characteristics when a berm was installed was calculated based on the case when a berm was not installed. As a result of the experiments, it was confirmed that the channel slope and volumetric sediment concentration had a significant effect on the deposition characteristics of debris flow. In addition, when a berm is installed on the slope, the runout distance and mobility ratio of debris flow are greatly decreased, and the total travel distance is increased. This means that installing a berm delays the movement of debris flow and reduces the potential mobility of debris flow. The results of this study will provide useful information for understanding the deposition characteristics of debris flow. Furthermore, it is expected to help in the design of a berm.

• Korean Journal of Materials Research
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• v.4 no.8
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• pp.861-869
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• 1994

Chemical vapor deposition using titanium tetra isopropoxide(TTIP) was employed to investigate effects of process parameters on the uniformity of $TiO_{2}$this films deposited on Indium Tin Oxide (ITO)coated glass. Deposition experiments were carried out at temperatures ranging from $300^{\circ}C$ to $400^{\circ}C$ under the pressure of 0.5~2 torrin a cold wall reactor which can handle 200mm substrate. It was found that the growth rate of $TiO_{2}$was closely related to the reaction temperature and the ractant gas compositions. Apparent activation energy for the deposition rate was 62.7lkJ/mol in the absence of $O_{2}$ and 100.4kj/mol in the presence of $O_{2}$, respectively. Homogeneous reactions in the gas phase were promoted when the total pressure of the reactor was increased. Variance in the film thickness was less than a few percent, but at high deposition rates film thickness was less uniform. Effects of reaction temperature on $TiO_{2}$ thin film characteristic was investigated with SEM, XRD and AES.

• Particle and aerosol research
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• v.5 no.4
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• pp.179-188
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• 2009

The dry deposition fluxes of particulate polychlorinated biphenyls (PCBs) were measured along with their mass size distributions at Seoul and Incheon in fall in 1999. The dry deposition fluxes of PCBs were in the range of $16.7{\sim}62.2ng/m^2/day$. The ambient concentrations of particulate PCBs were in the range of 0.07 to $0.20ng/m^3$. Generally, the mass size distribution of particulate PCBs shows bi-modal distribution. The mass fraction of PCBs in the fine particle fraction ($D_p<2.1 {\mu}m$) was over than 55% of the total PCBs concentrations. It was found that Seoul and Incheon were not the major source of PCBs emissions in Korea. Based on the comparison with the measurement data in summer, 1999, it is likely that both the dry deposition fluxes and ambient particulate PCBs concentrations were not site-specific.