• Economic and Environmental Geology
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• v.34 no.2
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• pp.157-166
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• 2001

Numerous base-metal bearing hydrothermal quartz vein deposits occur in the Hunan province of southern China. The Tangguanpu lead-zinc-tin-silver mine is the major producer among these deposits. Lead-zinc-tin-silver mineralization occurs in a single stage of massive quartz veins which filled fractures in fault zones within Paleozoic metasedimentary rocks. Sphalerite, chalcopyrite, galena, pyrite, arsenopyrite and pyrrhotite are the principal sulphide minerals in the Tangguanpu lead-zinc ores with minor amounts of tin- and antimony-bearing sulphides (stannite, teallite, boulangerite and tetrahedrite). Based on the iron and zinc partitioning between coexisting stannite and sphalerite, the formation temperature for this mineral assemblage range from 300$^{\circ}$ to 330$^{\circ}$C, which relatively agree with the upper part of homogenization temperature of fluid inclusion in quartz (20T-358$^{\circ}$C). Fluid inclusion data show that main lead-zine-tin-silver mineralization occurred from $H_{2}O$-NaCl fluids with relatively low salinities (11.2-7.3 wl.% eg. NaCI) at temperatures between 207$^{\circ}$ and 358$^{\circ}$C. The relationship between homogenization temperature and salinity suggests a history of cooling and dilution followed by initial boiling. Evidence of initial fluid boiling may indicate the fluid trapping pressures of 180 bars. The ${\delta}^{34}S{{\Sigma}S}$ values of -5.0 to 1.1 %, indicate an igneous source of sulfur in the Tangguanpu lead-zinc-tin-silver hydrothermal fluids.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.1 s.38
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• pp.23-29
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• 2006

Ultrasonic soldering of Si-wafer to FR-4 PCB at ambient temperature was investigated. The UBM of Si-substrate was Cu/ Ni/ Al from top to bottom with thickness of $0.4{\mu}m,\;0.4{\mu}m$, and $0.3{\mu}m$ respectively. The pad on FR-4 PCB comprised of Au/ Ni/ Cu from top to bottom with thickness of $0.05{\mu}m,\;5{\mu}m$, and $18{\mu}m$ respectively. Sn-3.5wt%Ag foil rolled to $100{\mu}m$ was used for solder. The ultrasonic soldering time was varied from 0.5 s to 3.0 s and the ultrasonic power was 1,400 W. The experimental results show that a reliable bond by ultrasonic soldering at ambient temperature was obtained. The shear strength increased with soldering time up to a maximum of 65 N at 2.5 s. The strength decreased to 34 N at 3.0 s because cracks were generated along the intermetallic compound between Si-wafer and Sn-3.5wt%Ag solder. The Intermetallic compound produced by ultrasonic soldering between the Si-wafer and the solder was $(Cu,Ni)_{6}Sn_{5}$.

• Korean Journal of Heritage: History & Science
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• v.51 no.4
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• pp.224-233
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• 2018

Thirty-three Early Iron Age bronzes at the sites of Hoam-dong in Chungju and Cheongsong-ri in Buyeo were investigated in order to study the manufacturing technique and the provenance of lead. Chemical analysis using X-ray fluorescence showed that 33 bronzes consist of copper(Cu), tin(Sn) and lead(Pb) served as major elements. Major and minor elemental analyses by EPMA were performed on two mirrors and 2 weapons of the bronzes investigated. The results shows that bronze mirrors from Chungju and Buyeo were high-tin bronzes(> 30 wt%). And 20% of tin and 5% of lead were founded in bronze weapons. Iron, zinc, arsenic, silver, nickel, sulfur and cobalt detected in four bronzes as minor and trace elements. The four bronzes were alloyed considering their function and were not heat treated after casting due to their high tin content. Lead isotope analysis using TIMS indicates that thirty-three bronzes were distributed southern Korea peninsula except Zone 1. As a result, lead raw materials came from various regions in Korean Peninsula not from Gyeongsang-do regions. The manufacturing techniques of bronze ware generalized at this age, and bronze was produced in various sites using raw materials from various sources.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.182.2-182.2
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• 2015

최근 학계나 산업계에서 투명 전자 소자에 대하여 활발한 연구가 진행되면서, 투명 전 도성 산화물(TCO: transparent conductive oxide)에 대한 관심이 높아지고 있다. 대표적인 TCO 물질인 Indium Tin Oxide (ITO)는 가시 광 영역에서의 높은 투과 및 높은 도전성을 가져 전압을 인가하면 발열이 가능하므로 이를 투명 면상 발열체에 적용시키는 연구가 활발히 진행되고 있다. 하지만, ITO는 발열 테스트 결과 온도가 상승함에 따라 발열이 일부분에 집중되는 현상이 있으며, 전도성을 높이기 위하여 추가공정이 필요하다. 또한, 글라스의 곡면 부분에서 ITO를 사용하면 유연성이 부족하므로 크랙이 발생한다는 단점이 있다. 따라서, 최근 Silver nanowire (AgNW), Single-walled Carbon nanotube (SWCNT), ITO를 기반으로 한 AgNW에 ITO를 증착 하거나 SWCNT를 코팅하여 우수한 전기적, 광학적 특성을 지닌 하이브리드 전극이 투명 면상 발열체 재료로서 사용되고 있다. 하지만 대체된 재료들도 다양한 문제점을 가지고 있다. 예를 들어 고온에서 발열을 유지하지 못하고 끊어지거나 가시광영역의 투과율이 낮은 점 등이 있다. 이런 다양한 문제점들을 보완 할 수 있는 새로운 투명 면상 발열체에 적용한 연구가 요구되고 있다. 본 연구에서는 GZO/Ag/GZO 하이브리드 구조의 투명 면상 발열체를 제작하여 전기적, 광학적 특성을 비교하고 발열량, 온도 균일 성, 발열 유지 안정도를 확인하였다. 본 연구에서는 $50{\times}50mm$ 크기의 Non-alkali glass (삼성코닝 E2000) 기판 상에 DC마그네트론 스퍼터링 공정을 이용하여 상온에서 GZO, Ag, GZO 박막을 연속적으로 증착 하여 다층구조의 하이브리드형 투명 면상 발열체를 제조하였다. 박막 증착 파워는 DC (Ag) power 50 W, RF (GZO) power 200 W로 하였으며 GZO박막두께는 45 nm로 고정 시키고 Ag박막 두께는 5~20 nm로 변화를 주었다. 증착원은 3인치 GZO 세라믹 타깃 (2.27 wt. % Ga2O3) 과 Ag 금속 타깃 (순도 99.99%)을 사용하였으며, Ar을 40 sccm 주입 후 Working pressure는 고 순도 Ar을 사용하여 1.0 Pa로 고정하며 10분간 Pre-sputtering을하고 증착을 진행하였다. 앞선 실험을 통해 증착한 박막의 전기적, 광학적 특성은 각각 Hall-effect measurements system (ECOPIA, HMS3000), UV-Vis spectrophotometer (UV-1800, Shimadzu)를 사용해 측정 되었으며, 하이브리드 표면의 구조 및 형상은 FESEM으로 관찰하였다. 또한 표면온도 측정기infrared camera (IR camera)를 이용하여 4~12 V/cm의 전압을 인가 시 시간에 따른 투명 면상 발열체의 표면 온도변화를 관찰하였다.