• Title/Summary/Keyword: thin film transistors(TFTs)

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Influence of Compositions on Sol-Gel Derived Amorphous In-Ga-Zn Oxide Semiconductor Transistors

  • Kim, Dong-Jo;Koo, Chang-Young;Song, Keun-Kyu;Jeong, Young-Min;Moon, Joo-Ho
    • 한국정보디스플레이학회:학술대회논문집
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    • 2009.10a
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    • pp.1586-1589
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    • 2009
  • We investigated the influence of chemical compositions of gallium and indium cations on the performance of solgel derived amorphous gallium indium zinc oxide (a-GIZO) based thin-film transistors (TFTs). Systematical composition study allows us to understand the solutionprocessed a-GIZO TFTs. Understanding of the compositional influence can be utilized for tailoring the solution processed amorphous oxide TFTs for the specific applications.

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Fabrication and Characterization of Zinc-Tin-Oxide Thin Film Transistors Prepared through RF-Sputtering

  • Do, Woori;Choi, Jeong-Wan;Ko, Myeong-Hee;Kim, Eui-Hyeon;Hwang, Jin-Ha
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.08a
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    • pp.207.2-207.2
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    • 2013
  • Oxide-based thin film transistors have been attempted as powerful candidates for driving circuits for active-matrix organic light-emitting diodes and transparent electronics. The oxide TFTs are based on the amorphous multi-component oxides involving zinc, indium, and/or tin elements as main cation sources. The current work employed RF sputtering in order to deposit zinc-tin oxide thin films applicable to transparent oxide thin film transistors. The deposited thin film was characterized and probed in terms of materials and devices. The physical/chemical characterizations were performed using X-ray diffraction, Atomic Force Microscopy, Spectroscopic Ellipsometry, and X-ray Photoelectron Spectroscopy. The thin film transistors were fabricated using a bottom-gated structure where thermally-grown silicon oxide layers were applied as gate-dielectric materials. The inherent properties of oxide thin films are combined with the corresponding device performances with the aim to fabricating the multi-component oxide thin films being optimized towards transparent electronics.

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Characterization of zinc tin oxide thin films by UHV RF magnetron co-sputter deposition

  • Hong, Seunghwan;Oh, Gyujin;Kim, Eun Kyu
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.307.1-307.1
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    • 2016
  • Amorphous zinc tin oxide (ZTO) thin films are being widely studied for a variety electronic applications such as the transparent conducting oxide (TCO) in the field of photoelectric elements and thin film transistors (TFTs). Thin film transistors (TFTs) with transparent amorphous oxide semiconductors (TAOS) represent a major advance in the field of thin film electronics. Examples of TAOS materials include zinc tin oxide (ZTO), indium gallium zinc oxide (IGZO), indium zinc oxide, and indium zinc tin oxide. Among them, ZTO has good optical and electrical properties (high transmittance and larger than 3eV band gap energy). Furthermore ZTO does not contain indium or gallium and is relatively inexpensive and non-toxic. In this study, ZTO thin films were formed by UHV RF magnetron co-sputter deposition on silicon substrates and sapphires. The films were deposited from ZnO and SnO2 target in an RF argon and oxygen plasma. The deposition condition of ZTO thin films were controlled by RF power and post anneal temperature using rapid thermal annealing (RTA). The deposited and annealed films were characterized by X-ray diffraction (XRD), atomic force microscope (AFM), ultraviolet and visible light (UV-VIS) spectrophotometer.

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Electrical Characteristics of Solution Processed In-Ga-ZnO Thin Film Transistors (IGZO TFTs) with Various Ratio of Materials

  • Lee, Na-Yeong;Choe, Byeong-Deok
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.293.2-293.2
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    • 2016
  • The In this paper, we have fabricated the solution processed In-Ga-ZnO thin film transistors (IGZO TFTs) by varying indium and gallium ratio. The indium ratio of IGZO TFTs was changed from 1 to 5 at fixed gallium and zinc oxide atomic percent of 1:1 and gallium ratio was varied from 1 to 5 at fixed indium and zinc oxide atomic percent of 1:1. When the indium ratio was increased at fixed gallium and zinc oxide ratio of 1:1, threshold voltage was negatively shifted from 1.03 to -6.18 V and also mobility was increased from 0.018 to $0.076cm2/V{\cdot}sec$. It means that the number of carriers in IGZO TFTs were increased due to great formation of the oxygen vacancies which generate electrons. In contrast, when the gallium ratio was increased in IGZO TFTs with indium and zinc oxide ration of 1:1, the on/off current ratio was increased from $1.88{\times}104$ to $2.22{\times}105$. It is because gallium have stronger chemical bonds with oxygen than that with the zinc and indium ions that lead to the decreased in electron concentration.

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Simple Route to High-performance and Solution-processed ZnO Thin Film Transistors Using Alkali Metal Doping

  • Kim, Yeon-Sang;Park, Si-Yun;Kim, Gyeong-Jun;Im, Geon-Hui
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.187-187
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    • 2012
  • Solution-processed metal-alloy oxides such as indium zinc oxide (IZO), indium gallium zinc oxide (IGZO) has been extensively researched due to their high electron mobility, environmental stability, optical transparency, and solution-processibility. In spite of their excellent material properties, however, there remains a challenging problem for utilizing IZO or IGZO in electronic devices: the supply shortage of indium (In). The cost of indium is high, what is more, indium is becoming more expensive and scarce and thus strategically important. Therefore, developing an alternative route to improve carrier mobility of solution-processable ZnO is critical and essential. Here, we introduce a simple route to achieve high-performance and low-temperature solution-processed ZnO thin film transistors (TFTs) by employing alkali-metal doping such as Li, Na, K or Rb. Li-doped ZnO TFTs exhibited excellent device performance with a field-effect mobility of $7.3cm^2{\cdot}V-1{\cdot}s-1$ and an on/off current ratio of more than 107. Also, in case of higher drain voltage operation (VD=60V), the field effect mobility increased up to $11.45cm^2{\cdot}V-1{\cdot}s-1$. These all alkali metal doped ZnO TFTs were fabricated at maximum process temperature as low as $300^{\circ}C$. Moreover, low-voltage operating ZnO TFTs was fabricated with the ion gel gate dielectrics. The ultra high capacitance of the ion gel gate dielectrics allowed high on-current operation at low voltage. These devices also showed excellent operational stability.

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Improvement in Characteristics of Thin Film Transistors by High Pressure Steam Annealing

  • Nagasawa, Y.;Yamamoto, N.;Chishina, H.;Ogawa, H.;Kawasaki, Y.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2006.08a
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    • pp.333-336
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    • 2006
  • High Pressure Annealing System was developed to improve the characteristics of low-temperature poly-silicon thin film transistors.. (TFTs). The high-pressure steam annealing was applied to the poly-silicon film made by rapid thermal annealing method. The carrier lifetime was investigated by Microwave detection of the Photo-Conductive Decay and the increase of carrier lifetime which indicates the reduction of the defect was observed by high-pressure steam annealing of 1MPa 600C 1hour.

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Stability Enhancement of Polysilicon Thin-Film Transistors with A Source-tied-to-body

  • Choi, B.D.;Choi, D.C.;Jung, J.Y.;Park, H.H.;Chung, H.K.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2005.07a
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    • pp.293-293
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    • 2005
  • The differences between floating and grounded body effects in polycrystalline silicon thin-film transistors (polysilicon TFTs) are investigated by making a body contact. The floating body effects such as kink effect, subthreshold slope change, and body current characteristics are explained and modeled by impact ionization, which causes source body turn on, and activates the parasitic bipolar junction transistors (BJTs). These effects become crucial for channel lengths of 4㎛ or shorter. Our data show that making a body contact reduces kink effects significantly and identifies impact ionization mechanism in polysilicon TFTs.

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Schottky barrier Thin-Film-Transistors crystallized by Excimer laser annealing and solid phase crystallization method (ELA 결정화와 SPC 결정화를 이용한 쇼트키 장벽 다결정 실리콘 박막 트랜지스터)

  • Shin, Jin-Wook;Choi, Chel-Jong;Cho, Won-Ju
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.129-130
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    • 2008
  • Polycrystalline silicon (poly-Si) Schottky barrier thin film transistors (SB-TFT) are fabricated by erbium silicided source/drain for n-type SB-TFT. High quality poly-Si film were obtained by crystallizing the amorphous Si film with excimer laser annealing (ELA) or solid phase crystallization (SPC) method. The fabricated poly-Si SB-TFTs have a large on/off current ratio with a low leakage current. Moreover, the electrical characteristics of poly-Si SB TFTs are significantly improved by the additional forming gas annealing in 2 % $H_2/N_2$, because the interface trap states at the poly-Si grain boundaries and at the gate oxide/poly-Si channel decreased.

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Effect of Thin-Film Thickness on Electrical Performance of Indium-Zinc-Oxide Transistors Fabricated by Solution Process (용액 공정을 이용한 IZO 트랜지스터의 전기적 성능에 대한 박막 두께의 영향)

  • Kim, Han-Sang;Kyung, Dong-Gu;Kim, Sung-Jin
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.30 no.8
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    • pp.469-473
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    • 2017
  • We investigated the effect of different thin-film thicknesses (25, 30, and 40 nm) on the electrical performance of solution-processed indium-zinc-oxide (IZO) thin-film transistors (TFTs). The structural properties of the IZO thin films were investigated by atomic force microscopy (AFM). AFM images revealed that the IZO thin films with thicknesses of 25 and 40 nm exhibit an uneven distribution of grains, which deforms the thin film and degrades the performance of the IZO TFT. Further, the IZO thin film with a thickness of 30 nm exhibits a homogeneous and smooth surface with a low RMS roughness of 1.88 nm. The IZO TFTs with the 30-nm-thick IZO film exhibit excellent results, with a field-effect mobility of $3.0({\pm}0.2)cm^2/Vs$, high Ion/Ioff ratio of $1.1{\times}10^7$, threshold voltage of $0.4({\pm}0.1)V$, and subthreshold swing of $0.7({\pm}0.01)V/dec$. The optimization of oxide semiconductor thickness through analysis of the surface morphologies can thus contribute to the development of oxide TFT manufacturing technology.

Improved Performance and Suppressed Short-Channel Effects of Polycrystalline Silicon Thin Film Transistors with Electron Cyclotron Resonance $N_2$O-Plasma Gate Oxide (Electron Cyclotron Resonance $N_2$O-플라즈마 게이트 산화막을 사용한 다결정 실리콘 박막 트랜지스터의 성능 향상 및 단채널 효과 억제)

  • 이진우;이내인;한철희
    • Journal of the Korean Institute of Telematics and Electronics D
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    • v.35D no.12
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    • pp.68-74
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    • 1998
  • Improved performance and suppressed short-channel effects of polysilicon thin film transistors (poly-Si TFTs) with very thin electron cyclotron resonance (ECR) $N_2$O-plasma gate oxide have been investigated. Poly-Si TFTs with ECR $N_2$O-plasma oxide ($N_2$O-TFTs) show better performance as well as suppressed short-channel effects than those with conventional thermal oxide. The fabricated $N_2$O-TFTs do not show threshold voltage reduction until the gate length is reduced to 3 ${\mu}{\textrm}{m}$ for n-channel and 1 ${\mu}{\textrm}{m}$ for p-channel, respectively. The improvements are due to the smooth interface, passivation effects, and strong Si ≡ N bonds.

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