• Smart Structures and Systems
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• v.16 no.3
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• pp.555-577
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• 2015

In the work at hand, the development of a morphing flap, actuated through shape memory alloy load bearing elements, is described. Moving from aerodynamic specifications, prescribing the morphed shape enhancing the aerodynamic efficiency of the flap, a suitable actuation architecture was identified, able to affect the curvature. Each rib of the flap was split into three elastic elements, namely "cells", connected each others in serial way and providing the bending stiffness to the structure. The edges of each cell are linked to SMA elements, whose contraction induces rotation onto the cell itself with an increase of the local curvature of the flap airfoil. The cells are made of two metallic plates crossing each others to form a characteristic "X" configuration; a good flexibility and an acceptable stress concentration level was obtained non connecting the plates onto the crossing zone. After identifying the main design parameters of the structure (i.e. plates relative angle, thickness and depth, SMA length, cross section and connections to the cell) an optimization was performed, with the scope of enhancing the achievable rotation of the cell, its ability in absorbing the external aerodynamic loads and, at the same time, containing the stress level and the weight. The conceptual scheme of the architecture was then reinterpreted in view of a practical realization of the prototype. Implementation issues (SMA - cells connection and cells relative rotation to compensate the impressed inflection assuring the SMA pre-load) were considered. Through a detailed FE model the prototype morphing performance were investigated in presence of the most severe load conditions.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.6
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• pp.497-504
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• 2014

The digital signage display is actively researched as the next generation of large FPD. To commercialize those digital signage display, the manufacturing cost must be downed with printing method instead of conventional photolithography. Here, we demonstrate a reverse offset printed TFT electrodes for the digital signage display. For the fabricated source/drain and gate electrode, we used Ag ink, silicone blanket, Clich$\acute{e}$ and reverse offset printer. We printed uniform TFT electrode patterns with narrow line width(10 ${\mu}m$ range) and thin thickness(nm range). In the end the printing source/drain and gate electrode are successfully achieved by optimization of experimental conditions such as Clich$\acute{e}$ surface treatment, ink coating process, delay time, off/set process and curing temperature. Also, we checked that the printing align accuracy was within 5 ${\mu}m$.

• Transactions of Materials Processing
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• v.18 no.1
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• pp.67-72
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• 2009

This paper covers finite element simulations to evaluate tube bending process of auto chassis component i.e. trailing-arm product. The rear of the auto chassis structure is primarily composed of CTBA and trailing-arm. When a car rolls into a corner, the trailing arm reacts to roll in the same degree as the car body. During the bending process of trailing arm the tube undergoes significant deformation. Thus forming defects such as excessive thinning and flattening of the tube will be formed in the outside of the tube. In this paper, we analyzed the effect of process parameters in rotary draw bending process and searched the optimized combination of process parameters using orthogonal arrays method to minimize the forming defects. In this process we analyzed several parameters which are displacement of pressure die, boosting force, initial position of mandrel bar, dimensions of mandrel in regarding to the thinning and flattening of the tube.

• Current Photovoltaic Research
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• v.2 no.3
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• pp.110-114
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• 2014

We propose a low temperature sol-gel ZnO/Ag nanowire composite thin film to fulfill low temperature and low cost requirements, which are essential criteria in future flexible electronic devices. In this proposed thin film, Ag nanowire plays the role of electrical conduction, and sol-gel ZnO provides a structural medium with a high visible transmittance. Low temperature restriction in the sol-gel fabrication process prevents sufficient oxidation of Zn acetate precursors, which were solved by a post-coating treatment with ultraviolet light irradiation. Composite thin film formation was performed by spin coating methods with a mixed precursor solution or in a sequential manner. We obtained an average visible transmittance larger than 85% and a sheet resistance smaller than $50{\Omega}/sq$. After optimization in a fabricated composite transparent conductive thin film with the thickness around 100 nm. Similar experimental demonstration in a flexible substrate (polyethyleneterephthalate) was successful, which implies a promising application opportunity of this technology.

• JSTS:Journal of Semiconductor Technology and Science
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• v.8 no.3
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• pp.251-263
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• 2008

In this paper, we report an analytical modeling and 2-D Synopsys Sentaurus TCAD simulation of ion implanted silicon carbide MESFETs. The model has been developed to obtain the threshold voltage, drain-source current, intrinsic parameters such as, gate capacitance, drain-source resistance and transconductance considering different fabrication parameters such as ion dose, ion energy, ion range and annealing effect parameters. The model is useful in determining the ion implantation fabrication parameters from the optimization of the active implanted channel thickness for different ion doses resulting in the desired pinch off voltage needed for high drain current and high breakdown voltage. The drain current of approximately 10 A obtained from the analytical model agrees well with that of the Synopsys Sentaurus TCAD simulation and the breakdown voltage approximately 85 V obtained from the TCAD simulation agrees well with published experimental results. The gate-to-source capacitance and gate-to-drain capacitance, drain-source resistance and trans-conductance were studied to understand the device frequency response. Cut off and maximum frequencies of approximately 10 GHz and 29 GHz respectively were obtained from Sentaurus TCAD and verified by the Smith's chart.

• Journal of Ocean Engineering and Technology
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• v.27 no.2
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• pp.27-32
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• 2013

A valve is a marine structure that is subjected to multiple seawater loads. Therefore, it is necessary to define the kind of loads applied to it to confirm whether the structure has sufficient strength. In this research, we aimed to find the optimal solution for the stress and deformation of valves under various loads. We first selected design variables and implement a finite element analysis according to changes in the thickness of each component of a valve based on a central composite design. Next we developed a regression model of the response surface. Using this model, we calculated the optimal objective value based on NSGA-II. Finally, to confirm the correspondence between the optimal objective value and the real FEM value, we compared the optimal result and structural analysis result to verify the performance of NSGA-II.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.39C no.3
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• pp.234-238
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• 2014

Multichip packaging was achieved the best solution to significantly reduce thermal resistance at the same time, to increase luminance intensity in LEDs packaging application. For the packaging, thermal spreading resistance is an important parameter to get influence the total thermal performance of LEDs. In this study, silicon-based multichip light emitting diodes (LEDs) packaged module has been examined for thermal characteristics in several parameters. Compared to the general conventional single LED packaged chip module, multichip LED packaged module has many advantages of low cost, low density, small size, and low thermal resistance. This analyzed module is comprised of multichip LED array, which consists of 32 LED packaged chips with supplement power of 0.2 W at every single chip. To realize the extent of thermal distribution, the computer-aided design model of 6.4 W Si-based multichip LED module was designed and was performed by the simulation basis of actual fabrication flow. The impact of thermal distribution is analyzed in alternative ways both optimizing numbers of fins and the thickness of that heatsink. In addition, a thermal resistance model was designed and derived from analytical theory. The optimum simulation results satisfies the expectations of the design goal and the measurement of IR camera results. tart after striking space key 2 times.

• Electrical & Electronic Materials
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• v.8 no.5
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• pp.558-563
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• 1995

Dynamic characteristics of TbFeCo magneto-optical recording media at 680nm wavelength region were studied by means of computer simulation of disc structure and optimization of process variables during sputter deposition. With the slightly reduced Kerr rotation angle due to the reduced wavelength of optical laser source, the improved recording density in TbFeCo magneto optical media showing the CNR greater than 50dB could be achieved by only adjusting the thickness of dielectric and the recording layers when the wavelength of light source is changed from 780nm to 680nm. In addition, the recording power margin of 5mW and the 2mW minimum recording power was realized, It was shown from the present study that the increase in laser power density demonstrated feasibility of low cost and low power laser diode with the reduced optimum recording power.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.28 no.7
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• pp.19-25
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• 2014

In the LED lighting applications, because LED packages are the origin of heat generation, there are thermal design problem on heat sinks. In the thermal design, it is important to consider the total volume and the total weight of heat sink simultaneously. In this study, an Al 6063 heat sink was optimized using Computational Fluid Dynamics(CFD) simulation tool for the cooling of 30W LED module, and then the cooling performance and the total weight of heat sinks with Al 6063 and Thermal Conductive Polycarbonate(TCP) were compared under the same conditions. As the result of simulation, an Al 6063 heat sink was optimized with 22 ea. of fins and 1.6 mm of fin thickness. LED Junction Temperature of the TCP Heat Sink was $5.6^{\circ}C$ higher, but total weight of it was 47 % less than the Al 6063.

• Journal of the Korea Institute of Military Science and Technology
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• v.7 no.1
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• pp.34-46
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• 2004

Copper films were prepared by using ECR-MOCVD(Electron Cyclotron Resonance Metal Organic Chemical Vapor Deposition) coupled with a DC bias system. The DC bias is connected to the electrode which placed 1∼3cm above the polymer substrate. The pulse electrical field around the electrode attracts the positive charged copper ions generated from the dissociation of copper precursor, $Cu(hfac)_2$, under ECR plasma. Condensation of supersaturated copper ions in the space between the electrode and substrate, makes it possible to deposit copper film on the polymer substrate even at room temperature. In this study, optimization of the electrode configuration was carried out in order to obtain the uniform films. The uniformity of the deposited films were closely related to the parameters of electrode geometry such as electrode shape, thickness, grid size and the spacing between electrodes. The most uniform copper film was observed with the electrode that enabled uniform electrical field distribution across the whole dimension of electrode.