• Title/Summary/Keyword: thermoelectric properties

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Synthesis of Bi-Sb-Te-based Thermoelectric Powder by an Oxide-reduction Process (산화물 환원공정에 의한 Bi-Sb-Te계 열전분말 합성)

  • Lee, Gil-Geun;Kim, Sung-Hyun;Ha, Gook-Hyun;Kim, Kyung-Tae
    • Journal of Powder Materials
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    • v.17 no.4
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    • pp.336-341
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    • 2010
  • The present study focused on the synthesis of Bi-Sb-Te-based thermoelectric powder by an oxidereduction process. The phase structure, particle size of the synthesized powders were analyzed using XRD and SEM. The synthesized powder was sintered by the spark plasma sintering method. The thermoelectric property of the sintered body was evaluated by measuring the Seebeck coefficient and specific electric resistivity. The $Bi_{0.5}Sb_{1.5}Te_3$ powder had been synthesized by a combination of mechanical milling, calcination and reduction processes using mixture of $Bi_2O_3$, $Sb_2O_3$ and $TeO_2$ powders. The sintered body of the $Bi_{0.5}Sb_{1.5}Te_3$ powder synthesized by an oxide-reduction process showed p-type thermoelectric characteristics, even though it had lower thermoelectric properties than the sintered body of the $Bi_{0.5}Sb_{1.5}Te_3$ thermoelectric powder synthesized by the conventional melting-crushing method.

Effect of Hydrogen Reduction Treatment on Room-Temperature Thermoelectric Performance of p-type Thermoelectric Powders (P형 열전분말의 수소환원처리가 상온열전특성에 미치는 영향)

  • Kim, Kyung-Tae;Jang, Kyeong-Mi;Ha, Gook-Hyun
    • Journal of Powder Materials
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    • v.17 no.2
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    • pp.136-141
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    • 2010
  • Bismuth-telluride based $(Bi_{0.2}Sb_{0.8})_2Te_3$ thermoelectric powders were fabricated by two-step planetary milling process which produces bimodal size distribution ranging $400\;nm\;{\sim}\;2\;{\mu}m$. The powders were reduced in hydrogen atmosphere to minimize oxygen contents which cause degradation of thermoelectric performance by decreasing electrical conductivity. Oxygen contents were decreased from 0.48% to 0.25% by the reduction process. In this study, both the as-synthesized and the reduced powders were consolidated by the spark plasma sintering process at $350^{\circ}C$ for 10 min at the heating rate of $100^{\circ}C/min$ and then their thermoelectric properties were investigated. The sintered samples using the reduced p-type thermoelectric powders show 15% lower specific electrical resistivity ($0.8\;m{\Omega}{\cdot}cm$) than those of the as-synthesized powders while Seebeck coefficient and thermal conductivity do not change a lot. The results confirmed that ZT value of thermoelectric performance at room temperature was improved by 15% due to high electric conductivity caused by the controlled oxygen contents present at bismuth telluride materials.

Microstructural Effects on the Thermoelectric Prooperties of PbTe (PbTe계의 열전특성에 대한 미세구조의 영향)

  • 송병덕;김문규
    • Journal of the Korean Ceramic Society
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    • v.27 no.4
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    • pp.481-486
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    • 1990
  • Microstructure of polycrystalline Lead Telluride was controlled by the change of sintering conditions. Three properties which determine the thermoelectric figure of merit of the material were measured in the temperature range of 300-650K in order to investigate the effect of each sintering condition on the thermoelectric efficiency. Based on the observed experimental results, defect structure is concluded to be more important than microstructure though both can be controlled by processing variables.

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Effect of n-type Dopants on CoSb3 Skutterudite Thermoelectrics Sintered by Spark Plasma Sintering (Spark Plasma Sintering 법으로 제조한 CoSb3 Skutterudite계 열전소재의 n형 첨가제 효과)

  • Lee, Jae-Ki;Choi, Soon-Mok;Lee, Hong-Lim;Seo, Won-Seon
    • Korean Journal of Materials Research
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    • v.20 no.6
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    • pp.326-330
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    • 2010
  • $CoSb_3$ Skutterudites materials have high potential for thermoelectric application at mid-temperature range because of their superior thermoelectric properties via control of charge carrier density and substitution of foreign atoms. Improvement of thermoelectric properties is expected for the ternary solid solution developed by substitution of foreign atoms having different valances into the $CoSb_3$ matrix. In this study, ternary solid solutions with a stoichiometry of $Co_{1-x}Ni_xSb_3$ x = 0.01, 0.05, 0.1, 0.2, $CoSb_{3-y}Te_y$, y = 0.1, 0.2, 0.3 were prepared by the Spark Plasma Sintering (SPS) system. Before the SPS synthesis, the ingots were synthesized by vacuum induction melting and followed by annealing. For phase analysis X-ray powder diffraction patterns were checked. All the samples were confirmed as single phase; however, with samples that were more doped than the solubility limit some secondary phases were detected. All the samples doped with Ni and Te atoms showed a negative Seebeck coefficient and their electrical conductivities increased with the doping amount up to the solubility limit. For the samples prepared by SPS the maximum value for dimensionless figure of merit reached 0.26, 0.42 for $Co_{0.9}Ni_{0.1}Sb_3$, $CoSb_{2.8}Te_{0.2}$ at 690 K, respectively. These results show that the SPS method is effective in this system and Ni/Te dopants are also effective for increasing thermoelectric properties of this system.

Multi-physics analysis for the design and development of micro-thermoelectric coolers

  • Han, Seung-Woo;Hasan, MD Anwarul;Kim, Jung-Yup;Lee, Hyun-Woo;Lee, Kong-Hoon;Kim, Oo-Joong
    • 제어로봇시스템학회:학술대회논문집
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    • 2005.06a
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    • pp.139-144
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    • 2005
  • A rigorous research is underway in our team, for the design and development of high figure of merits (ZT= 1.5${\sim}$2.0) micro-thermoelectric coolers. This paper discusses the fabrication process that we are using for developing the $Sb_2Te_3-Bi_2Te_3$ micro-thermoelectric cooling modules. It describes how to obtain the mechanical properties of the thin film TEC elements and reports the results of an equation-based multiphysics modeling of the micro-TEC modules. In this study the thermoelectric thin films were deposited on Si substrates using co-sputtering method. The physical mechanical properties of the prepared films were measured by nanoindentation testing method while the thermal and electrical properties required for modeling were obtained from existing literature. A finite element model was developed using an equation-based multiphysics modeling by the commercial finite element code FEMLAB. The model was solved for different operating conditions. The temperature and the stress distributions in the P and N elements of the TEC as well as in the metal connector were obtained. The temperature distributions of the system obtained from simulation results showed good agreement with the analytical results existing in literature. In addition, it was found that the maximum stress in the system occurs at the bonding part of the TEC i.e. between the metal connectors and TE elements of the module.

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