• Composites Research
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• 제33권6호
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• pp.329-335
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• 2020

본 연구에서는 각각에 다른 연화점을 갖는 석유계 피치의 열 유변학적 특성을 연구하였으며, 이를 함침용 페놀수지에 석유계 피치를 첨가하여 B-stage 형태의 페놀수지/석유계 피치 혼합물을 제조하였다. 그 결과, 연화점이 다른 석유계 피치는 QI의 함량이 증가할수록 피치의 유동성이 감소하였고, 고체의 점탄성 특성을 나타내었다. 또한, 다른 연화점을 갖는 석유계 피치를 페놀수지에 첨가함으로써, 페놀수지의 경화거동과 열 유변학적 특성에 미치는 영향에 대해 고찰하였을 때, 다른 연화점의 석유계 피치를 첨가함에 따라 페놀수지의 경화속도 및 경화거동을 조절할 수 있었으며, 이 중 P-Pitch 2가 첨가된 페놀수지 혼합물의 경우 동일한 경화 온도조건에서 다른 혼합물에 비해 유동성이 높은 것을 확인할 수 있었다.

• Korea-Australia Rheology Journal
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• 제21권4호
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• pp.235-244
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• 2009

Miscible polymer blends still have heterogeneity in their component chain concentration in the segmental length scale because of the chain connectivity (that results in the self-concentration of the segments of respective chains) as well as the dynamic fluctuation over various length scales. As a result, the blend components feel different dynamic environments to exhibit different temperature dependence in their segmental relaxation rates. This type of dynamic heterogeneity often results in a broad glass transition (sometimes seen as two separate transitions), a broad distribution of the local (segmental) relaxation modes, and the thermo-rheological complexity of this distribution. Furthermore, the dynamic heterogeneity also affects the global dynamics in the miscible blends if the component chains therein have a large dynamic asymmetry. Thus, the superficially simple miscible blends exhibit interesting dynamic behavior. This article gives a brief summary of the features of the segmental and global dynamics in those blends.

• 마이크로전자및패키징학회지
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• 제10권3호
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• pp.9-17
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• 2003

In this paper, thermo-mechanical and rheological properties of NCPs (Non-Conductive Pastes) depending on silica filler contents and diluent contents were investigated. And then, thermal cycling (T/C) reliability of flip chip assembly using selected NCPs was verified. As the silica filler content increased, thermo-mechanical properties of NCPs were changed. The higher the silica filler content was added, glass transition temperature ($T_g$) and storage modulus at room temperature became higher. While, coefficient of thermal expansion (CTE) decreased. On the other hand, rheological properties of NCPs were significantly affected by diluent content. As the diluent content increased, viscosity of NCP decreased and thixotropic index increased. However, the addition of diluent deteriorated thermo-mechanical properties such as modulus, CTE, and $T_g$. Based on these results, three candidates of NCPs with various silica filler and diluent contents were selected as adhesives for reliability test of flip chip assemblies. T/C reliability test was performed by measuring changes of NCP bump connection resistance. Results showed that flip chip assembly using NCP with lower CTE and higher modulus exhibited better T/C reliability behavior because of reduced shear strain in NCP adhesive layer.

• Structural Engineering and Mechanics
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• 제47권1호
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• pp.27-44
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• 2013

A finite element computational procedure for the accurate analysis of quasistatic thermorheological complex structures response is developed. The geometrical nonlinearity, arising from large displacements and rotations (but small strains), is accounted for by the total Lagrangian description of motion. The Schapery's nonlinear single-integral viscoelastic constitutive model is modified for a time-stress-temperature-dependent behavior. The nonlinear thermo-viscoelastic constitutive equations are incrementalized leading to a recursive relationship and thereby the resulting finite element equations necessitate data storage from the previous time step only, and not the entire deformation history. The Newton-Raphson iterative scheme is employed to obtain a converged solution for the non-linear finite element equations. The developed numerical model is verified with the previously published works and a good agreement with them is found. The applicability of the developed model is demonstrated by analyzing two examples with different thermal/mechanical loading histories.