• Korean Journal of Materials Research
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• v.16 no.12
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• pp.743-746
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• 2006

ZTA tubes were prepared by centrifugal casting and sintered at $1600^{\circ}C$ for 2 hrs. The ZTA tubes were machined into specimens of $3{\times}4{\times}40$ mm. Molten Soda lime glass (SLG) was penetrated into the surface of ZTA at an optimized condition of $1500^{\circ}C$ for the holding time of 5 h and furnace cooled. The extra glass on the surface was removed using a resin bonded diamond wheel. The glass penetrated samples were tested for their flexural strength using four point bend test. Vickers Indentation cracks were made on the glass penetrated surface at different loads of 9.8 N, 49 N, 98 N and 196 N. The residual compression on the surface enhanced the flexural strength and crack arrest behaviour remarkably. This was attributed to the thermoelastic mismatch between the glass and ZTA matrix during cooling.

• Korean Journal of Materials Research
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• v.8 no.8
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• pp.744-750
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• 1998

Unlike common device, MEMS(micro-electro-mechanical system) device consists of very small mechanical structures which determine the performance of the device. Because of its small mechanical structure inside. MEMS device is very sensitive to thermal stress caused by CTE(coefficient of thermal expansion) mismatch between its components. Therefore, its characteristics are affected by material properties. process temperature. and dimensions of each layer such as chip, adhesive and substrate. In this study. we investigated the change of the thermal stress in the chip attached to a substrate. With computer-aided finite element method (FEM), the computer simulation of the thermal stress was conducted on variables such as bonding material, process temperature, bonding layer thickness and die size. The commercial simulation program, ABAQUS ver5.6, was used. Subsequently 3-layer test samples were fabricated, and their degree of bending were measured by 3-D coordinate measuring machine. The experimental results were in good agreement with the simulation results. This study shows that the bonding layer could be the source of stress or act as the buffer layer for stress according to its elastic modulus and CTE. Solder adhesive layer was the source of stress due to its high elastic modulus, therefore high compressive stress was developed in the chip. And the maximum tensile stress was developed in the adhesive layer. On the other hand, polymer adhesive layer with low elastic modulus acted as buffer layer, and resulted in lower compressive stress. The maximum tensile stress was developed in the substrate.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.4 s.33
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• pp.13-22
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• 2004

In MEMS devices, packaging induced stress or stress induced structure deformation become increasing concerns since it directly affects the performance of the device. In this paper, deformation behavior of MEMS gyroscope package subjected to temperature change is investigated using high-sensitivity moire interferometry. Using the real-time moire setup, fringe patterns are recorded and analyzed at several temperatures. Temperature dependent analyses of warpages and extensions/contractions of the package are presented. Linear elastic behavior is documented in the temperature region of room temperature to $125^{\circ}C$. Analysis of the package reveals that global bending occurs due to the mismatch of thermal expansion coefficient between the chip, the molding compound and the PCB. Detailed global and local deformations of the package by temperature change are investigated, concerning the variation of natural frequency of MEMS gyro chip.