• Journal of Welding and Joining
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• v.24 no.6
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• pp.21-27
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• 2006

This study was focused on the evaluation of the thermo-mechanical board-level reliability of Pb-bearing and Pb-free surface mount assemblies. The composition of Pb-bearing solder was a typical Sn-37Pb and that of Pb-free solder used in this study was a representative Sn-3.0Ag-0.5Cu in mass %. Thermal shock test was chosen for the reliability evaluation of the solder joints. Typical $Cu_6Sn_5$ intermetallic compound (IMC) layer was formed between both solders and Cu lead frame at the as-reflowed state, while a layer of $Cu_3Sn$ was additionally formed between the $Cu_6Sn_5$ and Cu lead frame during the thermal shock testing. Thickness of the IMC layers increased with increasing thermal shock cycles, and this is very similar result with that of isothermal aging study of solder joints. Shear test of the multi layer ceramic capacitor(MLCC) joints was also performed to investigate the degradation of mechanical bonding strength of solder joints during the thermal shock testing. Failure mode of the joints after shear testing revealed that the degradation was mainly due to the excessive growth of the IMC layers during the thermal shock testing.

• Korean Journal of Materials Research
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• v.17 no.3
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• pp.152-159
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• 2007

When the electronics are tested with thermal shock for Pb-free solder joint reliability, there are temperature conditions with use environment but number of cycles for test don't clearly exist. To obtain the long term reliability data, electronic companies have spent the cost and times. Therefore this studies show the test method and number of thermal shock cycles for evaluating the solder joint reliability of electronic components and also research bonding strength variation with formation and growth of intermetallic compounds (IMC). SMD (surface mount device) 3216 chip resistor and 44 pin QFP (quad flat package) was utilized for experiments and each components were soldered with Sn-40Pb and Sn-3.0 Ag-0.5 Cu solder on the FR-4 PCB(printed circuit board) using by reflow soldering process. To reliability evaluation, thermal shock test was conducted between $-40^{\circ}C\;and\;+125^{\circ}C$ for 2,000 cycles, 10 minute dwell time, respectively. Also we analyzed the IMCs of solder joint using by SEM and EDX. To compare with bonding strength, resistor and QFP were tested shear strength and $45^{\circ}$ lead pull strength, respectively. From these results, optimized number of cycles was proposed with variation of bonding strength under thermal shock.

• Journal of Welding and Joining
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• v.28 no.3
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• pp.79-85
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• 2010

Hardfacing is one of the frequently applying method to increase surface hardness in hot forging die. Recently, hardfacing receives great attention due to it's repair availability and low cost. In hot forging die, crack resistance and thermal shock resistance have been considered as major properties, However there are few studies for the assessment of these properties. So, it is necessary to establish the assessment method for crack resistance and thermal shock resistance in hardfacing for hot forging die. In this study, flux cored arc welding was applied to make hardfacing welds. Three point bending test was carried out to assess hardfacing weld's crack resistance, and high temperature bending test using salt bath was developed for thermal shock resistance. Consequently, it was possible to assess crack resistance and thermal shock resistance of hardfacing welds for hot forging die quantitatively.

• The Bulletin of The Korean Astronomical Society
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• v.43 no.2
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• pp.42.2-43
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• 2018

When galaxy clusters interact, the intergalactic gas collides, forming shocks that are characterized by a low sonic Mach number (~3) but a comparatively high Alfvenic Mach number (~30). Such shocks behave differently from the more common astrophysical shocks, which tend to have higher sonic Mach numbers. We wish to determine whether these shocks, despite their low sonic Mach number, are capable of accelerating particles and thereby contributing to the cosmic ray spectrum. Using the PIC-MHD method, which separates the gas into a thermal and a non-thermal component to increase computational efficiency, and relying on existing PIC simulations to determine the rate at which non-thermal particles are injected in the shock, we investigate the evolution of galaxy cluster shocks and their ability to accelerate particles. Depending on the chosen injection fraction of non-thermal particles into the shock, we find that even low-Mach shocks are capable of accelerating particles. However, the interaction between supra-thermal particles and the local magnetic field triggers instabilities and turbulence in the magnetic field. This causes the shock to weaken, which in turn reduces the effectiveness of the supra-thermal particle injection. We investigate how this influences the shock evolution by reducing the particle injection rate and energy and find that a reduction of the particle injection fraction at this stage causes an immediate reduction of both upstream and downstream instabilities. This inhibits particle acceleration. Over time, as the instabilities fade, the shock surface straightens, allowing the shock to recover. Eventually, we would expect this to increase the efficiency of the particle injection and acceleration to previous levels, starting the same series of events in an ongoing cycle of increasing and decreasing particle acceleration.

• Journal of The Korean Astronomical Society
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• v.37 no.5
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• pp.299-305
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• 2004

We find evidence of a hard X-ray excess above the thermal emission in two cool clusters (Abell 1750 and IC 1262) and a soft excess in two hot clusters (Abell 754 and Abell 2163). Our modeling shows that the excess components in Abell 1750, IC 1262, and Abell 2163 are best fit by a steep power law indicative of a significant non-thermal component. In the case of Abell 754, the excess emission is thermal, 1 ke V emission. We analyze the dynamical state of each cluster and find evidence of an ongoing or recent merger in all four clusters. In the case of Abell 2163, the detected, steep spectrum, non-thermal X-ray emission is shown to be associated with the weak merger shock seen in the temperature map. However, this shock is not able to produce the flatter spectrum radio halo which we attribute to post-shock turbulence. In Abell 1750 and IC 1262, the shocked gas appears to be spatially correlated with non-thermal emission suggesting cosmic-ray acceleration at the shock front.

• Journal of the Korean Ceramic Society
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• v.50 no.2
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• pp.127-133
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• 2013

Porcelain with high thermal shock resistance was successfully fabricated by a lithium solution infiltration method with a lithium hydroxide solution. Lithium hydroxide solutions having various lithium concentrations were infiltrated into pre-sintered porcelain bodies. The porcelain sample infiltrated by the 9 wt% lithium solution and heat treated at $1250^{\circ}C$ for 1 h showed a low thermal expansion coefficient of $1.0{\times}10^{-6}/^{\circ}C$ with excellent thermal shock resistance. The highly thermally resistant porcelain had a well-developed ${\beta}$-spodumene phase with the general phases observed in porcelain. Furthermore, the porcelain showed a denser structure of $2.41g/cm^3$ sintering density and excellent whiteness in comparison with commercial thermally resistible porcelains. The lithium hydroxide in the samples readily reacted with moisture, and liquid phase reactants were formed during the fabrication process. In the case of an excess amount of lithium in the sample body, the lithium reactants were forced to the surface and re-crystallized at the surface, leaving large pores beneath the surface. These phenomena resulted in an irregular structure in the surface area and led to cracking in samples subjected to a thermal shock test.

• Journal of the Korea Institute of Military Science and Technology
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• v.14 no.3
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• pp.524-531
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• 2011

The cryogenic vessel, storing a liquified solutions as LOX and $LN_2$, consists of a external vessel, internal vessel, thermal insulator and internal support. The internal support should be satisfied with mechanical strength not only to support weight of internal tank but also to maintain uniform space between external and internal tank in spite of external mechanical shock. However, excessive structure design of internal supports is able to increase the amount of heat conduction and the rate of vaporization. The thermal insulator, filled with space between a external and internal vessel, reduces the rate of heat transfer and guarantees the standing time of cryogenic vessel. Especially powder type of insulator has low thermal conductivity and reduce the specification of structure design. In order to evaluate the effect of insulator on structure design, the experiment set-up simulated cryogenic vessel was tested in shock environment according to thermal insulator. As a result, the behavior of internal support under external shock was understood and the design criteria was able to be suggested.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.3
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• pp.152-158
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• 2016

The bonding characteristics of MLCCs (multi layer ceramic capacitor, C1608) lead-free solder (SAC305) joints were evaluated through thermal shock test ($-40^{\circ}C{\sim}125^{\circ}C$, total 1,800 cycle). After the test, IMCs( intermetallic compounds) growth and cracks were verified, also shear strengths were measured for degradation of solder joints. In addition, The thermal stress distributions at solder joints were analyzed to compare the solder joints changes before and after according to thermal shock test by FEA (finite elements analysis). We considered the effects of IMCs growth at solder joints. As results, the bonding characteristics degradation was occurred according to initial crack, crack propagations and thermal stress concentration at solder-IMCs interface, when the IMCs grown to solder inside.

• Structural Engineering and Mechanics
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• v.59 no.5
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• pp.841-852
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• 2016

The present paper is concerned with the investigation of propagation of thermoelastic media, the finite difference technique is used to obtain the solution for the uncoupled dynamic thermoelastic stress problem in a non-homogeneous orthrotropc thick cylindrical shell. In implementing the method, the linear dynamic thermoelasticity equations are used with the appropriate boundary and initial conditions. Thermal shock stress becomes of significant magnitude due to stress wave propagation which is initiated at the boundaries by sudden thermal loading. Numerical results have been given and illustrated graphically in each case considered. The presented results indicate that the effect of inhomogeneity is very pronounced.

• Journal of the Korean Ceramic Society
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• v.37 no.3
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• pp.201-204
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• 2000

Thermal shock resistance of 80Al2O3-20Al composite and monolithic alumina ceramics was compared. Fracture strength was measured by using a 4-pont bending test after quenching. Thermal stresses of the ceramics and ceramic-metal composites were calculated using a finite element analysis. The bending strength of the Al2O3 ceramics decreased catastropically after quenching from 20$0^{\circ}C$ to $0^{\circ}C$. The bending strength of the composite also decreased after quenching from 200~2$25^{\circ}C$, but the strength reduction was much smaller than for Al2O3. The maximum thermal stress occured in the monolithic alumina ceramics when exposed to a temperature difference of 20$0^{\circ}C$ was 0.758 GPa. The same amount of stress occured in the Al2O3-Al composite when the temperature difference of 205$^{\circ}C$ used.