• Journal of the Microelectronics and Packaging Society
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• v.14 no.2 s.43
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• pp.35-40
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• 2007

The pull strength and fracture mechanism were investigated to evaluate the reliability and compatibility of Sn-8Zn-3Bi joints, the solder paste on lead and lead-free plating under thermal shock conditions. At the Sn-8Zn-3Bi solder joint, no crack initiation was observed during thermal shock test. After 1000 cycles, the strength of the solder joint decreased not sharply but reduced gradually compared with initial conditions. The decrement of strength was affected by ${\gamma}-Cu_5Zn_8$ IMC growth which caused the IMC fracture on the fracture surface and a change in fracture mode and initial crack point. Clearly, the Sn-8Zn-3Bi solder shows good reliability properties and compatibility with lead-free plated Cu LF under thermal shock temperatures between 248K and 423K.

• Journal of the Korean Ceramic Society
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• v.28 no.1
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• pp.11-18
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• 1991

A precipitation method, one of the most effective liquid phase reaction methods, was adopted in order to prepare high-tech Al2O3/ZrO2 composite ceramics, and the effects of stress-induced phase transformation of ZrO2 on thermal shock behavior of Al2O3-ZrO2 ceramics were investigated. Al2(SO4)3.18H2O, ZrOCl2.8H2O and YCl3.6H2O were used as starting materials and NH4OH as a precipitation agent. Metal hydroxides were obtained by single precipitation(process A) and co-precipitation(process B) method at the condition of pH=7, and the composition of Al2O3-ZrO2 composites was fixed as Al2O3-15v/o ZrO2(+3m/o Y2O3). Critical temperature difference showing rapid strength degradation by thermal shock showed higher value in Al2O3/ZrO2 composites(process A : 20$0^{\circ}C$, process B : 215$^{\circ}C$) than in Al2O3(175$^{\circ}C$). The improvement of thermal shock property for Al2O3/ZrO2 composites was mainly due to the increase of strength at room temperature by adding ZrO2. The strength degradation was more severe for the sample with higher strength at room temperature. Crack initiation energies by thermal shock showed higher values in Al2O3/ZrO2 composites than in Al2O3 ceramics due to increase of fracture toughness by ZrO2.

• Korean Journal of Metals and Materials
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• v.47 no.12
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• pp.842-851
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• 2009

The long-term reliability of Sn-0.3wt%Ag-0.7wt%Cu solder joints was evaluated and compared with Sn-3.0wt%Ag-0.5wt%Cu under thermal shock conditions. Test vehicles were prepared to use Sn-0.3Ag-0.7Cu and Sn-3.0Ag-0.5Cu solder alloys. To compare the shear strength of the solder joints, 0603, 1005, 1608, 2012, 3216 and 4232 multi-layer ceramic chip capacitors were used. A reflow soldering process was utilized in the preparation of the test vehicles involving a FR-4 material-based printed circuit board (PCB). To compare the shear strength degradation following the thermal shock cycles, a thermal shock test was conducted up to 2,000 cycles at temperatures ranging from $-40^{\circ}C$ to $85^{\circ}C$, with a dwell time of 30 min at each temperature. The shear strength of the solder joints of the chip capacitors was measured at every 500 cycles in each case. The intermetallic compounds (IMCs) of the solder joint interfaces werealso analyzed by scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS). The results showed that the reliability of Sn-0.3Ag-0.7Cu solder joints was very close to that of Sn-3.0Ag-0.5Cu. Consequently, it was confirmed that Sn-0.3Ag-0.7Cu solder alloy with a low silver content can be replaced with Sn-3.0Ag-0.5Cu.

• Korean Journal of Metals and Materials
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• v.47 no.8
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• pp.500-507
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• 2009

Pb-free solder has recently been used in electronics in efforts to meet environmental regulations, and a number of Pb-free solder alloy choices beyond the near-eutectic SnAgCu solder are now available. With increased demand for thin and portable electronics, the high cost of alloys containing significant amounts of silver and their poor mechanical shock performance have spurred the development of low Ag SnAgCu solder, which provides improved mechanical performance at a reasonable cost. Although low Ag SnAgCu solder exhibits significantly higher fracture resistance under high-strain rates, little thermal fatigue data exist for this solder. Therefore, it is necessary to investigate thermal fatigue reliability of low Ag SnAgCu solder under variation of thermal stress in order to allow its implementation in electronic products with high reliability requirements. In this study, the reliability of Sn0.3Ag0.7Cu(SAC0307), a low Ag solder alloy, is discussed and compared with that of Sn3Ag0.5Cu(SAC305). Three sample types and six samples size are evaluated. Mechanical properties and microstructure of the solder joint are investigated under thermal shock cycles. It was observed that the mechanical strength of SAC0307 dropped slightly with thermal cycling relative to that of SAC305. This reveals that the failure mode of SAC0307 is different from that SAC305 under this critical condition.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2011.11a
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• pp.178-181
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• 2011

Recently, micro shock tube is being extensively used in various fields of engineering applications. The flow characteristics occurring in the micro shock tube may be significantly different from that of conventional macro shock tube due to very low Reynolds number and Knudsen number effects which are, in general, manifested in such flows of rarefied gas, solid-gas two-phase, etc. In these situations, Navier-Stokes equations cannot properly predict the micro shock tube flow. In the present study, a two-dimensional CFD method has been applied to simulate the micro shock tube, with slip velocity and temperature jump boundary conditions. The effects of wall thermal conditions on the unsteady flow in the micro shock tube were also investigated. The unsteady behaviors of shock wave and contact discontinuity were, in detail, analyzed. The results obtained show much more attenuation of shock wave, compared with macro-shock tubes.

• Journal of the Korean Ceramic Society
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• v.56 no.2
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• pp.184-190
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• 2019

To improve resistance in thermal shock of zirconia setter which is frequently and repeatedly exposed to high temperature, high degree of porosity and control of thermal expansion are needed for which the fused CSZ (CaO stabilized zirconia) is used to produce the zirconia setter. In the present study, the effects of sintering temperature, cool down condition, addition of CaO stabilizer, and addition of other additives on phase transition and thermal expansion behavior of the fabrication process of zirconia setter, were examined. The zirconia setter, fabricated with fused CSZ at 1550℃, exhibited 20.4 MPa of flexural strength, 6.8% of absorbance, and 27.9% of apparent porosity. The rapid change in thermal expansion of zirconia setter is observed at temperature around 800℃, and it was reduced by low firing temperature, slowed cooled down, and addition of CaO.

• Proceedings of the Korean Nuclear Society Conference
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• 1998.05a
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• pp.635-640
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• 1998

Thermal fluid mixing behavior during a postulated medium-size hot leg break loss of coolant accident is analyzed for the international comparative assessment study on pressurized thermal shock (PTS-ICAS) proposed by OECD-NEA. The applicability of RELAP5 code to analyze thermal fluid mixing behavior is evaluated through a simple modeling relevant to the problem constraints. Based on the calculation result, the onset of Thermal stratification is investigated using Theofanous's empirical correlation. Sensitivity calculations using a fine node model and crossflow model are also performed to evaluate the modeling capability on multi-dimensional characteristics related to thermal fluid mixing.

• Transactions of the Korean Society of Automotive Engineers
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• v.15 no.1
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• pp.139-145
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• 2007

This paper presents the low cycle thermal fatigue of the engine exhaust manifold subject to thermomechanical cyclic loadings. The analysis includes the FE model of the exhaust system, temperature dependent material properties, and thermal loadings. The result shows that at an elevated temperature, large compressive plastic deformations are generated, and at a cold condition, tensile stresses are remained in several critical zones of the exhaust manifold. From the repetitions of thermal shock cycles, plastic strain ranges could be estimated by the stabilized stress-strain hysteresis loops. The method was applied to assess the low cycle thermal fatigue for the engine exhaust manifold. It shows a good agreement between numerical and experimental results.

• Journal of Welding and Joining
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• v.7 no.2
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• pp.25-34
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• 1989

The purpose of this work is to coat ZrO$_{2}$ - 8Y$_{2}$O$_{3}$ ceramic on the Al cast alloy(AC-8A) by using the plasma spray method. Two types of coatings which were composed of two and three layer coating were examined. Each coating powder was analyzed for shape and size distribution and X-ray diffraction pattern. For the coated layers, microstructural analysis and performance estimation which was composed of static thermal test, thermal cyclic test and thermal shock test were conducted.

• Journal of The Korean Astronomical Society
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• v.37 no.5
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• pp.477-482
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• 2004

Shock waves form in the intergalactic space as an ubiquitous consequence of cosmic structure formation. Using N-body/hydrodynamic simulation data of a ACDM universe, we examined the properties of cosmological shock waves including their morphological distribution. Adopting a diffusive shock acceleration model, we then calculated the amount of cosmic ray energy as well as that of gas thermal energy dissipated at the shocks. Finally, the dynamical consequence of those cosmic rays on cluster properties is discussed.