• 한국주조공학회지
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• 제39권6호
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• pp.103-109
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• 2019

Cu-added SKD11 was manufactured through the casting process and the effects of Cu addition with different contents (0, 1, 2 and 3 wt%) and aging treatment on microstructure, mechanical characteristics such as tensile strength and hardness, and thermal conductivity were investigated. The microstructure was analyzed by FE-SEM and XRD, the mechanical characteristics by Rockwell hardness tester and Tensile tester, and the thermal conductivity by Laser flash. As a result, SKD11 containing Cu had higher hardness than as-received SKD11. The hardness of as-cast SKD11 containing 1 wt% Cu was 42.4 HRC, whereas the hardness of asreceived SKD11 cast alloy was 19.5 HRC, indicating that the hardness was greatly improved when Cu was added. In the case of tensile strength, Cu-added SKD11 cast alloy had lower tensile strength than as-received SKD11, and the tensile strength tended to increase as Cu content increased. After heat treatment, however, tensile strength of as-received SKD11 was significantly increased, whereas in the case of Cu-added SKD11, as the Cu contents increased, the tensile strength increased less and even reduced at 3 wt% Cu. The thermal conductivity of Cu-added SKD11 cast alloy was about 13 W m^-1 K^-1, which was lower than that of the asreceived SKD11 cast alloy (28 W m^-1 K^-1). After the heat treatment, however, the thermal conductivity of as-received SKD11 was reduced, while the thermal conductivity of the SKD11 added with Cu was increased. Thermal conductivity was generally larger with less Cu content, and this tendency became more pronounced after heat treatment.

• 한국세라믹학회지
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• 제40권3호
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• pp.317-321
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• 2003

The grain-boundary microcracking materials in the system A1$_2$Ti $O_{5}$ -ZrTi $O_4$(ZAT) is influenced by the thermal expansion anisotropy. The range of ZAT compositions investigated had showed very low thermal expansions of 0.3~1.3$\times$10$^{-6}$K compared to 8.29$\times$10$^{-6}$K of pure ZrTi $O_4$and 0.68$\times$10$^{-6}$K of polycrystalline A1$_2$Ti $O_{5}$ , respectively, compared with the theoretical thermal expansion coefficient for a single crystal of A1$_2$Ti $O_{5}$ , 9.70$\times$10$^{-6}$K. The low thermal expansion and microcraking temperature are apparently due to a combination of thermal contraction and expansion caused by the large thermal expansion anisotropy of the crystal axes of the A1$_2$Ti $O_{5}$ phase.

• Journal of Ceramic Processing Research
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• 제19권6호
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• pp.504-508
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• 2018

Diopside is a ceramic material with excellent physical and chemical properties. However, when it is applied as an LED packaging material, heat dissipation of the LED element is not sufficient due to its relatively lower thermal conductivity, which may cause degradation of the LED function. In this study, glass-ceramics based on a $ZrO_2-CaO-MgO-SiO_2$ system, in which diopside is the main crystal phase, were prepared by heat-treating the glass, which was composed of zircon ($ZrO_2-SiO_2$) powders and diopside ($CaO-MgO-2SiO_2$) powders. The possibility of using the glass-ceramics as a packaging material for LEDs was then investigated by analyzing the density, shrinkage, thermal conductivity, and phases generated according to the amount of zircon powder added. The density and shrinkage of specimens decreased slightly and then increased again with the amount of $ZrO_2-SiO_2$ added within a range of 0~0.38 mol. Even though the crystal phase of zircon does not appear in the $ZrO_2-CaO-MgO-SiO_2$ system, the glass containing 0.38 mol zircon powder showed the highest thermal conductivity, 1.85 W/mK, among the specimens fabricated in this study: this value was about 23% higher than that of pure diopside. It was found that the thermal conductivity of the glass-ceramics based on a $ZrO_2-CaO-MgO-SiO_2$ system was closely related to the density, but not to the phase type. Zirconia ($ZrO_2$), a component oxide of zircon, plays an important role in increasing the density of the specimen. Furthermore the thermal conductivity of glass-ceramics based on a $ZrO_2-CaO-MgO-SiO_2$ system showed a nearly linear relationship with thermal diffusivity.

• 한국주조공학회지
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• 제33권1호
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• pp.22-31
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• 2013

In order to develop an aluminum alloy, that can combine high thermal conductivity and good castability and anodizability, aluminum alloys with low Si content, such as Al-(0.5~1.5)Mg-1Fe-0.5Si and Al-(1.0~1.5)Si-1Fe-1Zn, were designed. The developed aluminum alloys exhibited 170~190% thermal conductivity (160~180 W/mK), 60~85% fluidity, and equal or higher ultimate tensile strength compared with those of the ADC12 alloy. In each developed alloy system, the thermal conductivity decreased and the strength increased with the increment of Mg and Si, which are the significant alloying elements. The fluidity was in reverse proportion to the Mg content and in proportion to the Si content. The Al-(0.5~1.5)Mg-1Fe-0.5Si alloys exhibited better fluidity in thick-wall castings, while the Al-(1.0~1.5)Si-1Fe-1Zn alloys were better in thin-wall castability due to their lower surface energies. The fluidity behavior was complexly affected by the heat release for the solidification, viscosity, solidification range, and the type, quantity, and formation juncture of the main secondary phase.

• Journal of Power Electronics
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• 제16권2호
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• pp.685-694
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• 2016

This paper presents a reliability assessment model for the power semiconductors used in wind turbine power converters. In this study, the thermal loadings at different timescales of wind speed are considered. First, in order to address the influence of long-term thermal cycling caused by variations in wind speed, the power converter operation state is partitioned into different phases in terms of average wind speed and wind turbulence. Therefore, the contributions can be considered separately. Then, in regards to the reliability assessment caused by short-term thermal cycling, the wind profile is converted to a wind speed distribution, and the contribution of different wind speeds to the final failure rate is accumulated. Finally, the reliability of an actual power converter semiconductor for a 2.5 MW wind turbine is assessed, and the failure rates induced by different timescale thermal behavior patterns are compared. The effects of various parameters such as cut-in, rated, cut-out wind speed on the failure rate of power devices are also analyzed based on the proposed model.

• 소성∙가공
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• 제33권3호
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• pp.200-207
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• 2024

In this study, we developed a semi-analytical approach for the numerical analysis of residual stress in oxide scales formed on hot-rolled steels. The oxide scale, formed during the hot rolling process, experiences complex interactions due to thermal and mechanical influences, significantly affecting the material's integrity and performance. Our research focuses on integrating various stress components such as thermal stress, growth stress, and creep behavior to predict the residual stress within the oxide layer. The semi-analytical method combines analytical expressions for each stress component with numerical integration to account for their cumulative effects. Validation through instrumented indentation tests confirms the reliability of our model, which considers thermal expansion coefficient (CTE) differences, scale growth, and creep-induced stress relaxation. Our findings indicate that thermal stress resulting from CTE differences significantly impacts the overall residual stress, with growth stress contributing a compressive component during cooling, and creep behavior playing a minor role in stress relaxation. This comprehensive approach enhances the accuracy of residual stress prediction, facilitating the optimization of material design and processing conditions for hot-rolled steel products.

• 소성∙가공
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• 제20권1호
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• pp.29-35
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• 2011

In the design of the injection molding process, various parameters including mold design parameters and molding conditions should be investigated to improve part quality. The mold temperature is one of important processing parameters that affect the flow characteristics, surface appearance, part deformation, mechanical properties, etc. Numerical analyses have been used to predict the temperature distribution of the mold under the given cooling or heating conditions. However, conventional analyses have been performed by assuming that the mold material is a single solid even though a number of plates are assembled to construct an injection mold. In the present study, a numerical approach considering the thermal contact resistance is proposed to provide more reliable prediction of the mold temperature distribution by reflecting the heat-resistance between assembled mold plates.

• Macromolecular Research
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• 제13권2호
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• pp.102-106
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• 2005

Poly(methyl methacrylate) (PMMA)/sodium montmorillonite (Na-MMT) nanocomposites were prepared with a novel method utilizing a macroazoinitiator (MAI). To induce the intergallery polymerization of methyl methacrylate (MMA), the MAI containing a po1y(ethylene glycol) (PEG) segment was intercalated between the lamellae of Na-MMT and swelled with water to enhance the diffusion of MMA into the gallery. The structure of the nanocomposite was examined using X-ray diffraction and transmission electron microscopy, and the thermal properties were examined using differential scanning calorimetry and thermogravimetry. The PMMA/Na-MMT nanocomposite prepared by intergallery polymerization showed a distinct enhancement of its thermal properties; an approximately $30^{\circ}C$ increase in its glass transition temperature and an $80\sim100^{\circ}C$ increase in its thermal decomposition temperature for a $10\%$ weight loss.

• 한국레이저가공학회지
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• 제16권2호
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• pp.7-11
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• 2013

Recently advanced laser processing is widely introduced to improve the efficiency of micro part production and to reduce the rate of inferior goods. In this paper the trend of delamination of single layer with both thin copper and polyimide according to the variation of copper thickness was investigated using the coupled thermal-structural analysis of ANSYS. From these analyses results, some conclusions were obtained. Firstly, the maximum temperature was increasing with respect to decrease of copper thickness. Secondly the maximum strain which was in general estimation the main effect of the delamination was observed in case of the copper thickness of $5{\mu}m$. Finally the trend of the delamination was decreasing with increasing the thickness of copper layer.

• 전자공학회논문지A
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• 제32A권3호
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• pp.124-133
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• 1995

A theoretical self-consistent thermoelectric model has been developed for optimal thermal design in the self-signal processing infraed detectors. The model is achived by employing the coupled thermoelectric equation which allows which allows the simultaneous investigation of the termal and electrical aspects of device behavior. The thermal limitation of detectivity and responsivity are determined by the enegy gap, carrier concentration, lifetime, and mobility as a function of the temperature. The calculated results indicate that the detectivity is decreased at bias fields above about 50 V/cm, because the performence is limiting by temperature when the bias voltage reached the level associated with Joule heating. It has been also found that the improvement in the mid-band modulation transfer function(MTF) may be restricted by increasing the bias fields. Further, the important paramerers in the thermal optimization of SPIR detector, such as temperature in the device, ambipolar velocity, element thickness and length, are also considered. The analytical study provides a mathematical basis for optimal design of such a photoconductive IR detector and the agreement between the experimental and theoretical results are seen to be good.