• Title/Summary/Keyword: thermal processing

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Advanced Materials Delivery Successes in CVD Processing

  • Loan, James F.
    • Journal of the Korean Vacuum Society
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    • v.4 no.S1
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    • pp.40-68
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    • 1995
  • As silicon divice geometrics become smaller and aspect ratios larger, processing technoloty is moving from PVD into the area of CVD and OMCVD. Many new source materials are in the research and development stage, and have placed challenging demands on materials delivery technology. This paper will describe the many successes achieved with various delivery methods including thermal, bubblers, pressure-based and Direct Liquid Injection.

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A Study of the Arcing History in a Thermal Puffer Plasma Chamber with a Coupled Simulation (연성해석을 통한 열파퍼 플라즈마 챔버의 아크현상 이력에 관한 연구)

  • Lee, Jong-Chul;Heo, Joong-Sik;Kim, Youn-Jea
    • Proceedings of the KSME Conference
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    • 2007.05b
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    • pp.2506-2511
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    • 2007
  • The coupled simulation is performed to find out the interaction of arc plasmas with surrounding materials in a thermal puffer plasma chamber. In order to be more realistic, PTFE nozzle ablation and Cu electrode evaporation, which are caused by high temperature of arc plasmas, are considered together. Pressure rise and temperature inside the chamber generated during the whole arcing history are investigated with the applied currents. It is very important to define how thermal flow and mass transfer are processing between the arc plasma and surrounding materials for further understanding complex physics inside the chamber. It is concluded that the result might be very useful to understand the mechanism happened inside and to design thermal puffer plasma chambers, but further experimental studies are required to verify the results for the more practical applications.

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Electronic Processor Design for Thermal Imager with Serial/Parallel Scan type (직병렬 주사방식 일정장비의 신호처리기 설계 연구)

  • 송인섭;유위경;윤은석;홍영철;홍석민
    • Journal of the Korean Institute of Telematics and Electronics B
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    • v.31B no.1
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    • pp.49-56
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    • 1994
  • This paper describes the design principles and methods of electronic processor for thermal imager with the SPRITE detector, operating in the 8-12 micron band. The thermal imager consists of a optical scanner containing the detector and an electrical signal processor. The optical scanner utilizing rotating polygon and oscillating mirror, is 2-dimensional serial/parallel scan type using 5 elements of the detector. And the electronic processor has pre-processing of 5 chnanel's thermal signal from the detector, and performs digital scan conversion to reform the parallel data stream into serial analog data compatible with conventional RS-170 video. Through the designed electronic processor, we have acquired a satisfactory thermal image. And the MRTD (Minimum Resolvable Temperature Difference) is 0.5$^{\circ}$K at 7.5 cycles/mm.

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Detection and Quantification of Defects in Composite Material by Using Thermal Wave Method

  • Ranjit, Shrestha;Kim, Wontae
    • Journal of the Korean Society for Nondestructive Testing
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    • v.35 no.6
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    • pp.398-406
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    • 2015
  • This paper explored the results of experimental investigation on carbon fiber reinforced polymer (CFRP) composite sample with thermal wave technique. The thermal wave technique combines the advantages of both conventional thermal wave measurement and thermography using a commercial Infrared camera. The sample comprises the artificial inclusions of foreign material to simulate defects of different shape and size at different depths. Lock-in thermography is employed for the detection of defects. The temperature field of the front surface of sample was observed and analysed at several excitation frequencies ranging from 0.562 Hz down to 0.032 Hz. Four-point methodology was applied to extract the amplitude and phase of thermal wave's harmonic component. The phase images are analyzed to find qualitative and quantitative information about the defects.

Evaluation System of the Thermal Properties of the Exothermic & Insulating Materials (발열 보온재의 특성평가 시스템 구축)

  • Shin, D.Y.;Kim, D.J.;Jun, B.H.;You, B.D.;Kim, N.S.;Oh, S.H.
    • Transactions of Materials Processing
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    • v.17 no.5
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    • pp.356-363
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    • 2008
  • An evaluation system of the thermal properties of exothermic & insulating materials was developed. By measuring the power supply of the induction furnace, the thermal property of exothermic & insulating materials could be evaluated with high reproducibility at elevated temperature of molten steel. The thermal properties of exothermic & insulating materials were affected by mixing condition of raw materials. The effect of main components of exothermic & insulating materials such as metallic aluminum and $Fe_2O_3$ powder on the exothermic and insulating properties was examined. It could be expected to design and develop various exothermic & insulating materials by means of the evaluation system of the thermal properties.

Effect of Mixing Condition of Raw Materials on the Thermal Properties of the Exothermic & Insulating (원료 배합조건에 따른 발열보온재의 열적 특성)

  • Kim, D.J.;Shin, D.Y.;Byun, S.Y.;Wi, C.H.;Hong, S.H.;You, B.D.;Oh, S.H.
    • Transactions of Materials Processing
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    • v.18 no.5
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    • pp.401-409
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    • 2009
  • The change of the thermal properties of exothermic and insulating materials with the mixing condition of raw materials which is the most important factor for exothermic & insulating materials was investigated by using the evaluation system of the thermal properties of exothermic and insulating materials. In this study, the effect of the thermal properties of the exothermic & insulating materials such as exothermic properties, endothermic properties, insulating properties, maximum temperature of molten metal, ignition time of exothermic & insulating materials and temperature recovery time on the mixing ratio of reductant and oxidant, types of reductant, and particle sizes of reductants was examined. It could be expected to design the mixing condition of raw materials for various exothermic and insulating materials.

Performance of Tilting Pad Journal Bearings with Different Thermal Boundary Conditions (열 경계 조건이 다른 틸팅패드저널베어링의 성능)

  • Suh, Junho;Hwang, Cheolho
    • Tribology and Lubricants
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    • v.37 no.1
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    • pp.14-24
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    • 2021
  • This study shows the effect of the thermal boundary condition around the tilting pad journal bearing on the static and dynamic characteristics of the bearing through a high-precision numerical model. In many cases, it is very difficult to predict or measure the exact thermal boundary conditions around bearings at the operating site of a turbomachine, not even in a laboratory. The purpose of this study is not to predict the thermal boundary conditions around the bearing, but to find out how the performance of the bearing changes under different thermal boundary conditions. Lubricating oil, bearing pads and shafts were modeled in three dimensions using the finite element method, and the heat transfer between these three elements and the resulting thermal deformation were considered. The Generalized Reynolds equation and three-dimensional energy equation that can take into account the viscosity change in the direction of the film thickness are connected and analyzed by the relationship between viscosity and temperature. The numerical model was written in in-house code using MATLAB, and a parallel processing algorithm was used to improve the analysis speed. Constant temperature and convection temperature conditions are used as the thermal boundary conditions. Notably, the conditions around the bearing pad, rather than the temperature boundary conditions around the shaft, have a greater influence on the performance changes of the bearing.