• 한국결정성장학회지
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• 제30권5호
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• pp.208-213
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• 2020

본 연구에서는 유한요소 해석과 PQRSM 알고리즘 기반의 최적설계 기법을 활용하여 IGZO 산화물 타겟과 구리백플레이트가 서로 접합되어 있는 타겟 모듈에서 IGZO 산화물의 열변형을 최소화할 수 있는 방법에 대해 고찰했다. 3차원 유한요소 해석 결과 고온에서 IGZO와 구리 백플레이트의 접합 이후 냉각될 때 IGZO 산화물의 열변형은 최대 0.161 mm로 예측되었다. 유한요소 해석을 연동한 최적설계기법을 적용하기 위해 타겟 모듈을 냉각할 때 사용하는 하부받침대와 상부고정대의 위치를 설계변수화하여 목적함수인 IGZO의 열변형이 최소화되도록 최적설계를 수행했고, 그 결과 IGZO 산화물의 열변형을 최대 42 % 감소시킬 수 있었다. 이는 타겟을 구성하는 주재료와 구조 변경 없이 공정 중에 사용되는 부재료의 위치 변경만으로도 산화물의 열변형을 감소시킬 수 있어 산업계에 유용할 것으로 사료된다.

• 한국기계가공학회지
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• 제15권3호
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• pp.130-134
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• 2016

Due to the need for advanced technologies in the automotive industry, the demand for lighter and safer vehicles has increased. Even though various nonferrous metals, like Aluminum, Magnesium and also Carbon Fiber Reinforced Plastic (CFRP), have been implemented in the automotive industry, a lot of technical research and development is still focused on ferrous metals. In particular, the market volume of High Strength Steel (HSS) parts and Ultra High Strength Steel (UHSS) by hot press forming parts has expanded significantly in all countries' automotive industries. A new tool steel, High Thermal-Conductivity Tool Steel (HTCS), for stamping punches and dies has been developed and introduced by Rovalma Company (Spain), and it is able to support better productivity and quality during hot press forming. The HTCS punches and dies could help to reduce cycle time due to their high thermal conductivity, one of the major factors in hot press forming operation. In this study, test dies were manufactured in order to verify the high thermal conductivity of HTCS material compared to SKD6. In addition, thermal deformation was inspected after the heating and cooling process of hot press forming. After heating and cooling, the test dies were measured by a 3D scanner and compared with the original geometry. The results showed that the thermal deformation and distortion were very small even though the cooling time was reduced by 2 seconds.

• 마이크로전자및패키징학회지
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• 제10권3호
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• pp.73-82
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• 2003

최근 인쇄회로기판(printed wiring board, PWB)은 마이크로 전자패키지분야에서 디자인 또는 제조측면에서 핵심기술로 인식되고 있다. PWB는 열적특성이 다른 여러 재료가 적층되어 있는 구조이고 제조공정을 지나는 동안에 각 층의 재료는 서로 다른 열팽창률을 나타나게 되어 워피지, 수축, 크기 등의 많은 불량을 발생시킨다. PWB의 열변형 특성은 제조공정 변수 중 솔더레지스트의 부피변화에 의하여 많은 영향을 받으므로 본 연구에서는 각각 2층, 4층 PBGA 및 CSP의 열변형 특성을 솔더레지스트 공정에 따라 분석하고자 하였다. 솔더레지스트의 부피분율이 30%이상일 경우, 2층 PWB의 열변형이 4층 PWB보다 최대 40%로 높게 측정되었다. 이와 같은 이유는 4L PWB는 고인성 특성을 지닌 프리프레그와 동박이 추가적으로 적층되어 있으므로 솔더레지스트의 열변형을 상쇄시키기 때문이다. 반면에 솔더레지스트의 부피분율이 30%이하일 경우, PWB의 층수 및 디자인에 관계없이 유사한 열변형 특성을 나타내었다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1140-1144
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• 2005

A plastic-based CE (capillary electrophoresis) microchip was fabricated by hot embossing process. A Si mold was made by wet etching process and a PMMA wafer was cut off from 1mm thick PMMA sheet. A micro-channel structure on PMMA substrate was produced by hot embossing process using the Si mold and the PMMA wafer. A vacuum assisted thermal bonding procedure was employed to seal an imprinted PMMA wafer and a blank PMMA wafer. The results of microscopic cross sectional images showed dimensions of channels were well preserved during thermal bonding process. In our procedure, the deformation amount of bonding process was below 1%. The entire fabrication process may be very useful for plastic based microchip systems.

• Bulletin of the Korean Chemical Society
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• 제30권9호
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• pp.1985-1988
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• 2009

Poly (lactic-co-glycolic acid) (PLGA) nanoparticles loading paclitaxel have been deposited on coronary stents by self-assembling properties of colloidal particles. The layers of the nanoparticles were enhanced to a sufficient mechanical strength by a thermal process under the proper temperature and humidity conditions. In vitro release studies proved the controlled paclitaxel release of the nanoparticle layers. This technique gives rise to a new range of applications for nanoparticles and drug-eluting stents.

• 한국표면공학회지
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• 제28권2호
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• pp.67-76
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• 1995

The microstructure of 95wt.%Pb/5wt.%Sn and 63wt.%Sn/37wt.%Pb solders for flip chip bonding process has been characterized. Solders were deposited by thermal evaporation and reflowed in the conventional furnace or by rapid thermal annealing(RTA) process. As-deposited films show columnar structure. The microstructure of furnace cooled 63Sn/37Pb solder shows typical lamellar form, but that of RTA treated solder has the structure showing an uniform dispersion of Pb-rich phase in Sn matrix. The grain size of 95Pb/5Sn solder reflowed in the furnace is about $5\mu\textrm{m}$, but the grain size of RTA treated solder is too small to be observed. The microstructure in 63Sn/37Pb solder bump shows the segregation of Pb phase in the Sn rich matrix regardless of reflowing method. The 63Sn/37Pb solder bump formed by RTA process shows more uniform microstructure. These result are related to the heat dissipation in the solder bump.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2009년도 제40회 하계학술대회
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• pp.1362_1363
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• 2009

In this study, we predicted the thermal breakdown of high-voltage interrupter with the characteristics of thermal plasmas such as temperature, pressure and concentration of the ablated material by using a commercial CFD program. The results showed that the pressure build-up inside the chamber was proportional to the magnitude of arcing current because the quantities of heat energy and ablated mass also increase together with the current during the compression process. And during the decompression process, the reverse flow was not coincided with the magnitude of the applied current due to the compressibility of the gas through backflow channel. The present method is expected to be useful for the design of guideline and interruption capacity on the thermal breakdown of a PASB chamber.

• 한국마린엔지니어링학회:학술대회논문집
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• 한국마린엔지니어링학회 2000년도 춘계학술대회 논문집(Proceeding of the KOSME 2000 Spring Annual Meeting)
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• pp.100-104
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• 2000

This paper deals with finite element analyses of residual stresses causing popping up which are induced in micromachining processes of a mcroaccelerometers. After heating the tunnel gap up to 100 degree and get it through the cooling process and the additional bean up to 80 degree and get is through the cooling process. We learn the thermal internal stress of each shape and compare the results with each other after heating the tunnel gap up to 400 degree during the Pt deposition process. We want to seek after the real cause of this pop up phenomenon and diminish this by change manufacturing processes of microaccelerometer by electrostatic force.

• 한국지하수토양환경학회:학술대회논문집
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• 한국지하수토양환경학회 2001년도 추계학술발표회
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• pp.111-114
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• 2001

Thermal desorption process is valuable for the remediation of oil contaminated site. The system is physical separation process by volatizing oil contaminants from soil matrixes and is not designed to provide high levels of oil destruction. The process is not incineration, because the decomposition of oil materials is not the desired result, although some decomposition may occur. The physical and chemical properties that influence the design and operation of the system include boiling points, soil sorption characteristics, aqueous phase solubility, thermal stability, contaminating oil concentration, moisture contents, particle size distribution and etc.

• 소성∙가공
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• 제15권1호
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• pp.15-20
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• 2006

The rapid thermal response (RTR) molding is a novel process developed to raise the temperature of mold surface rapidly to the polymer melt temperature prior to the injection stage and then cool rapidly to the ejection temperature. The resulting filling process is achieved inside a hot mold cavity by prohibiting formation of frozen layer so as to enable thin wall injection molding without filling difficulty. The present work covers flow simulation of thin wall injection molding using the RTR molding process. In order to take into account the effects of thermal boundary conditions of the RTR mold, coupled analysis with transient heat transfer simulation is suggested and compared with conventional isothermal analysis. The proposed coupled simulation approach based on solid elements provides reliable thin wall flow estimation for both the conventional molding and the RTR molding processes.