• Title/Summary/Keyword: thermal factor

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A Numerical Study on Improving the Thermal Hydraulic Performance of Printed Circuit Heat Exchanger Using the Supercritical Carbon Dioxide (초임계 이산화탄소를 작동유체로 한 PCHE의 열수력 성능 향상을 위한 수치해석적 연구)

  • Park, Bo Guen;Kim, Dae Hyun;Chung, Jin Taek
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.39 no.10
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    • pp.779-786
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    • 2015
  • The objective of this study is to propose a new channel shape that improves thermal-hydraulic performance. The existing Zigzag channel has high pressure loss due to flow separation and reverse flow. To improve this disadvantage, partial straight channel is inserted into bended points. Also, the effects of straight channel's length change on heat transfer and pressure loss are analyzed. Thermal-hydraulic performance of the new shape and existing Zigzag channel are quantitatively compared in terms of Goodness Factor. Mass flow rate was changed from $1.41{\times}10^{-4}$ to $2.48{\times}10^{-4}kg/s$. The average volume goodness factor of 1mm straight channel shape was increased by 25% compared to the Zigzag channel.

Thermal Stress Intensity Factors for Rigid Inclusions of Cusp Crack Shape (커스프균열형 강체함유물의 열응력 세기계수에 관한 연구)

  • 이강용;최흥섭
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.12 no.3
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    • pp.497-504
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    • 1988
  • The steady state thermal stress intensity factors (TSIF's) are analyzed for hypocycloid, symmetric airfoil and symmetric lip type rigid inclusions embedded in infinite elastic solids, using Boganoff's complex variable approach in plane thermoplasticity. Two thermal conditions are considered, one with an uniform heat flow disturbed by an insulated rigid inclusion of cusp crack shape and the other with an uniform heat flow disturbed by a rigid inclusion of cusp crack shape with fixed boundary temperature. The tendencies of TSIF's for rigid inclusions of cusp crack shape are somewhat different from those of traction free cusp cracks. However, if k=-1, the non-dimensionalized TSIF's for rigid inclusions of cusp crack shape become those of traction free cusp cracks like the tendencies of the SIF's under mechanical loading conditions. The thermal stress and displacement components for a rigid circular inclusion of radius Ro are drived from the results of a hypocycloid crack type rigid inclusion.

NUMERICAL STUDY FOR THE FULL-SCALE ANALYSIS OF PLATE-TYPE HEAT EXCHANGER USING ONE-DIMENSIONAL FLOW NETWORK MODEL and ε-NTU METHOD (판형 열교환기 Full-scale 해석을 위한 1차원 유동 네트워크 모델 및 ε-NTU 모델의 수치적 연구)

  • Kim, Minsung;Min, June Kee;Ha, Man Yeong
    • Journal of computational fluids engineering
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    • v.19 no.1
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    • pp.47-56
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    • 2014
  • Since a typical plate heat exchanger is made up of a huge number of unitary cells, it may be impossible to predict the aero-thermal performance of the full scale heat exchanger through three-dimensional numerical simulation due to the enormous amount of computing resources and time required. In the present study, a simple flow-network model using the friction factor correlation and a thermal-network model based on the effectiveness-number of transfer units (${\varepsilon}$-NTU) method has been developed. The complicated flow pattern inside the cross-corrugated heat exchanger has been modeled into flow and thermal networks. Using this model, the heat transfer between neighboring streams can be considered, and the pressure drop and the heat transfer rate of full-scale heat exchanger matrix are calculated. In the calculation, the aero-thermal performance of each unitary cell of the heat exchanger matrix was evaluated using correlations of the Fanning friction factor f and the Nusselt number Nu, which were calculated by unitary-cell CFD model.

Thermoelectric properties and microstructures of Mg2Si0.6Sn0.4-based thermoelectric materials (Mg2Si0.6Sn0.4 열전재료의 열전특성과 미세조직)

  • Jang, Jeong-In;Ryu, Byeong-Gi;Lee, Ji-Eun;Park, Su-Dong;Lee, Ho-Seong
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2018.06a
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    • pp.53-53
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    • 2018
  • Thermoelectric materials can convert directly waste heat to electricity and vice versa. The improvement of the thermoelectric efficiency strongly depends on the dimensionless figure of merit, $ZT=S^2{\sigma}T/{\kappa}$, where S is the Seebeck coefficient, ${\sigma}$ is the electrical conductivity, T is the absolute temperature, and ${\kappa}$ is the thermal conductivity. The thermal conductivity consists of the electronic contribution (${\kappa}_e$) and phonon contribution (${\kappa}_{ph}$). It is very challenge to increase the power factor, $S^2{\sigma}$ and to reduce the thermal conductivity simultaneously because the power factor and electronic thermal conductivity are coupled. One strategy is to decrease the phonon thermal conductivity. The phonon thermal conductivity can be decreased by controlling the grain size and structural defects such as dislocations and twinning. In order to achieve enhancements in thermoelectric efficiency, microstructures that can form numerous interfaces have been investigated intensively for controlling the transport of charge carriers and heat carrying phonons. In this presentation, we report the heterogeneous microstructure of $Mg_2Si_{0.6}Sn_{0.4}$ thermoelectric materials and investigation of its influence on thermoelectric properties.

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Analysis on Living Factor and Present Condition of Indoor Thermal Environment in Apartment Units during Winter (아파트의 겨울철 실내온열환경 실태와 생활요인 분석)

  • Choi, Yoon-Jung;Jeong, Youn-Hong
    • Proceeding of Spring/Autumn Annual Conference of KHA
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    • 2008.04a
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    • pp.281-284
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    • 2008
  • The purposes of this study were to make clear the present condition of indoor thermal environment in apartment units and to analyze the relation of the living factors with indoor thermal elements. The field surveys consisted of measurements on physical elements and observations on living factors and interview on resident's subjective responses were carried out in 20 apartment units. The field surveys were carried out during the $January{\sim}March$ 2007. Measuring elements were air temperature, globe temperature, and relative humidity. As results, the averages of indoor temperature each houses were $21.2{\sim}27.2^{\circ}C$, the number of houses exceed the comfort zone were 4. The averages of globe temperature each houses were $21.3{\sim}27.5^{\circ}C$, 6 houses exceeded the comfort zone. The means of relative humidity were $19.5{\sim}58.8%$, relatively dry condition. The clothing value of residents were $0.39{\sim}0.89$ clo(average 0.68 clo). The average of thermal sensation ratings each room were $4.2{\sim}4.8$, 'neutral'$\sim$'slightly warm'. The results of regression analysis on relations of living factors with the thermal elements are as follow; ventilation time(outdoor air exchange), door opening time with balcony, and gas cooker use time had significant effect on indoor temperature.

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An Experimental Measurement on Transient Thermal Response in a PI-Controlled VAV System

  • Kim, Seo-Young;Moon, Jeong-Woo;Kim, Won-Nyun
    • International Journal of Air-Conditioning and Refrigeration
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    • v.11 no.1
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    • pp.10-16
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    • 2003
  • The present study performs an experimental measurement on transient thermal response of an air-conditioned space by a variable air volume (VAV) system with a PI(pro-portional-integral) control logic. A thermal chamber with a PI controlled VAV unit is constructed to verify the previously suggested stratified multi-zone model. The effects of thermal parameters and control parameters such as supply air temperature and PI control factor are investigated by implementing the thermal chamber test. The experimental results obtained show that transient behavior of the air-conditioned space-temperature is in good accordance with the simulation results of the stratified thermal model.

Electric Degradation of Failure Mode of Solar Cell by Thermal Shock Test (열충격 시험 후 태양전지 파괴 모드에 따른 전기적 특성변화)

  • Kang, Min-Soo;Jeon, Yu-Jae;Shin, Young-Eui
    • Journal of Energy Engineering
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    • v.22 no.4
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    • pp.327-332
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    • 2013
  • 일본 연구에서는 열충격 시험을 통한 태양전지의 파괴모드에 따른 전기적 특성을 분석하였다. 시편은 Photovoltaic Module을 만들기 전 3 line Ribbon을 Tabbing한 단결정 Solar Cell을 제작하였다. 열충격 시험 Test 1의 온도조건은 저온 $-40^{\circ}C$, 고온 $85^{\circ}C$, Test 2는 저온 $-40^{\circ}C$, 고온 $120^{\circ}C$에서 Ramping Time을 포함하여 각각 15분씩, 총 30분을 1사이클로 500사이클을 각각의 조건으로 수행하였다. 열충격 시험 후 Test 1에서는 4.0%의 효율 감소율과 1.5%의 Fill Factor 감소율을 확인하였으며, Test 2에서는 24.5%의 효율 감소율과 11.8%의 Fill Factor 감소율을 확인하였다. EL(Electroluminescence)촬영 및 단면을 분석한 결과, Test 1과 Test 2 시편 모두 Cell 표면 및 내부에서의 Crack이 발견되었다. 하지만, Test 2의 시험이 Test 1보다 가혹한 온도조건의 시험으로 인해 Test 1에서 나타나지 않았던, Cell 파괴를 Test 2에서 확인하였다. 결국, Test 1에서 효율의 직접적인 감소 원인은 Cell 내부에서의 Crack이며, Test 2에서는 Cell 내부에서의 Crack 및 Cell 파괴로 인한 Cell 자체의 성능저하로 효율이 크게 감소한다는 것을 본 실험을 통하여 규명하였다.

Simplified estimations of elastic-plastic fracture mechanics parameters under combined primary and secondary loadings (1차 및 2차 복합 하중을 받는 구조물의 탄소성 파괴역학 매개변수 예측기법)

  • Oh, Chang-Kyun;Kim, Yun-Jae;Park, Jin-Moo;Kim, Jong-Sung;Jin, Tae-Eun
    • Proceedings of the KSME Conference
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    • 2004.11a
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    • pp.43-48
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    • 2004
  • When structures are loaded by a combination of primary and secondary stresses, plasticity effects occur which cannot be evaluated by a simple linear addition of the effects resulting from the two independent stress systems. Thermal stress due to temperature gradient is classified as secondary stress. It is known that secondary stress is released as increase of plastic zone. In this paper, two and three dimensional elastic-plastic finite element analyses are performed for the cracked plates and pipes under combined thermal and mechanical loading. And V-factor is introduced to account for plasticity effect. The present results provide that V-factor is function of thermal factor and loading and is consistent regardless of geometry. We developed the prediction method of elastic-plastic fracture mechanics parameter under combined primary and secondary loading from the present results.

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Electrical Properties and Temperature Effects of PET Films with Interface Layers

  • Dong-Shick kim;Lee, Kwan-Woo;Park, Dae-Hee;Lee, Jong-Bok;Seun Hwangbo
    • Transactions on Electrical and Electronic Materials
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    • v.1 no.4
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    • pp.25-29
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    • 2000
  • In this paper, PET(Ployethylene Terephthalate) films with semiconducting and interface layers were investigated, The electrical properties, such as volume resistivity, tan$\delta$(dissipation factor) and breakdown strength at various temperatures were measured. Thermal analysis of PET and semiconducting films were measured and compared by differential scanning calorimeter(DSC) of each film. It is found that the volume resistivity of films(dependence on semiconducting interface layers)and electrical properties of PET films are changed ,Breakdown strength and dissipation factor of PET films with semiconducting layer (PET/S/PET) are decreased more greatly than PET and PET/PET films, due to the increase of charge density of charges at two contacted interfaces between PET and semiconductor, The dissipation factor of each films in increased with temperature,. For PET/S/PET film, is depended on temperature more than PET of PET/PET. However, the breakdown strength is increased up to 85$\^{C}$ and then decreased over 100$\^{C}$The electrical properties of PET films with semiconducting/interface layer are worse than without it It is due to a result of temperature dependency, which deeply affects thermal resistance property of PET film more than semiconducting/interface layers.

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Analysis of Supply Airflow Control by a Stratified Thermal Model in a VAV System

  • Kim, Seo-Young;Moon, Jeong-Woo;Cho, Hyung-Hee
    • International Journal of Air-Conditioning and Refrigeration
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    • v.9 no.3
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    • pp.46-56
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    • 2001
  • The present study concerns the numerical simulation of a supply airflow control in a variable air volume (VAY) system. A stratified thermal model (multi-zone model) is suggested to predict a local thermal response of an air-conditioned space. The effects of various thermal parameters such as the cooling system capacity, the thermal mass of an air-conditioned space, the time delay of thermal effect, and the building envelope heat transmission are investigated. Further, the influence of control parameters such as the supply air temperature, the PI control factor and the thermostat location on a VAV system is quantitatively delineated. The results obtained show that the previous homogeneous lumped thermal model (single zone model) may overestimate the time taken to the set point temperature. It is also found that there exist the appropriate ranges of the control parameters for the optimal airflow control of the VAV system.

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