• Journal of Electrical Engineering and Technology
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• v.10 no.6
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• pp.2256-2261
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• 2015

In the power plant using high temperature fuel cells such as Molten Carbonate Fuel Cell(MCFC), and Solid Oxide Fuel Cell(SOFC), the generated electric power per area of power generation facilities is much higher than any other renewable energy sources. - High temperature fuel cell systems are capable of operating at MW rated power output. - It also has a feature that is short for length of the line for connecting the interior of the generation facilities. In normal condition, these points are advantages for voltage drops or power losses. However, in abnormal condition such as fault occurrence in electrical system, the fault currents are increased, because of the small impedance of the short length of power cable. Commonly, to minimize the thermal-mechanical stresses on the stack and increase the systems reliability, we divided the power plant configuration to several banks for parallel operation. However, when a fault occurs in the parallel operation system of power main transformer, the fault currents might exceed the interruption capacity of protective devices. In fact, although the internal voltage level of the fuel cell power plant is the voltage level of distribution systems, we should install the circuit breakers for transmission systems due to fault current. To resolve these problems, the SFCL has been studied as one of the noticeable devices. Therefore, we analyzed the effect of application of the SFCL on bus tie in a fuel cell power plants system using PSCAD/EMTDC.

• Journal of Biomedical Engineering Research
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• v.37 no.5
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• pp.168-177
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• 2016

In this paper we present an implantable pressure sensor to measure real-time blood pressure by monitoring mechanical movement of artery. Sensor is composed of inductors (L) and capacitors (C) which are formed by microfabrication and direct bonding on two biocompatible substrates (quartz). When electrical potential is applied to the sensor, the inductors and capacitors generates a LC resonance circuit and produce characteristic resonant frequencies. Real-time variation of the resonant frequency is monitored by an external measurement system using inductive coupling. Structural and electrical simulation was performed by Computer Aided Engineering (CAE) programs, ANSYS and HFSS, to optimize geometry of sensor. Ultrafast laser (femto-second) cutting and MEMS process were executed as sensor fabrication methods with consideration of brittleness of the substrate and small radial artery size. After whole fabrication processes, we got sensors of $3mm{\times}15mm{\times}0.5mm$. Resonant frequency of the sensor was around 90 MHz at atmosphere (760 mmHg), and the sensor has good linearity without any hysteresis. Longterm (5 years) stability of the sensor was verified by thermal acceleration testing with Arrhenius model. Moreover, in-vitro cytotoxicity test was done to show biocompatiblity of the sensor and validation of real-time blood pressure measurement was verified with animal test by implant of the sensor. By integration with development of external interrogation system, the proposed sensor system will be a promising method to measure real-time blood pressure.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.19 no.7
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• pp.81-86
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• 2005

Proposed induction-heated system is innovative system which applied special high-frequency power circuit technique for thermal converse technique and IH(Induction-Heating) magnetic induction heating generated from induction-heated metallic package that is for distillation unit. In this occurs not burning, so that the working environment can be improved. This electromagnetic induction heating technique is used high frequency inverter. By using high frequency inverter high frequency alternative current (HFAC) in the range of [kHz] can be made with conventional alternative current In this contribution IGBT module is used for high frequency inverter. In this paper are discussed action analysis and characteristics analysis of 1.5[kW]-Class half-bridge resonant inverter system and resonant metallic packaged. In addition, by using this system,t how two step heating superheated steam generator is developed and application of system are also discussed.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.23 no.10
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• pp.100-106
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• 2009

In this study, methods of overheat detection at the coupling or wire in electrical facility are investigated, operating characteristic about the optic temperature sensor for continuous on-line temperature monitoring in diagnostics system of electrical facility is analyzed. Heating sources in the experiment for operating characteristics of optic temperature sensor use black body and hot plate, output voltage of optic temperature sensor in accordance with temperature variation is analyzed. Overheat generation due to poor contact at the circuit breaker in panel board detects using a thermocouple, infrared thermal camera and optic temperature sensor, and experiment results are analyzed. The effect of optic temperature sensor is the same that of other methods. These results expect to use basic research material for adjusting field of electrical diagnostics system using RFID type optic temperature sensor in the near future.

• Journal of Biomedical Engineering Research
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• v.32 no.1
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• pp.45-54
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• 2011

Cuff electrodes have a benefit for chronic electroneurogram(ENG) recording while minimizing nerve damage. However, the ENG signals are usually contaminated by electromyogram(EMG) activity from the surrounding muscle, the thermal noise generated within the source resistance, and the electric noise generated primarily at the first stage of the amplifier. This paper proposes a new cuff electrode to reduce the interference of EMG signals. An additional middle electrode was placed at the center of cuff electrode. As a result, the proposed cuff electrode achieved a higher signal-to-interference ratio compared to the conventional tripolar cuff. The cuff electrode was then assembled together with closure, headstage, and hermetic case including electronic circuits. This paper also presents a lownoise amplifier system to improve signal-to-noise ratio. The circuit was designed based on the noise analysis to minimize the electronic noise. The result shows that the total noise of the amplifier was below $1{\mu}V_{rms}$ for a cuff impedance of $1\;k{\Omega}$ and the common-mode rejection ratio was 115 dB at 1 kHz. In the current study, the performance of nerve cuff electrode system was evaluated by monitoring afferent nerve signals under mechanical stimuli in a rat animal model.

• The Transactions of the Korean Institute of Power Electronics
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• v.10 no.5
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• pp.481-487
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• 2005

Proposed induction-heated system is innovative system which applied special high-frequency power circuit technique for thermal converse technique and IH(Induction-Heating) magnetic induction heating generated from induction-heated metallic package that is for distillation unit. In this occurs not burning, so that the working environment can be improved. This electromagnetic induction heating technique is used high frequency inverter, By using high frequency inverter high frequency alternative current in the range of [kHz] can be made with conventional alternative current. In this contribution IGBT module is used for high frequency inverter. This paper proposes new fluid heating method. Which is operated as follows. Working coil, which is wrapped outside of pipeline, makes the eddy current. Inside of heating vessel in isolated pipeline the specially designed stainless metallic package is inserted, which can be heated by eddy current losses. And then In this paper are discussed action analysis and characteristics analysis of 5[kW] class full-bridge resonant inverter system and resonant metallic package. In addition, by using this system, how high-efficiency heater is developed and application of system are also discussed.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.9
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• pp.8-13
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• 2008

Noise in homogeneous extrinsic semiconductor samples is calculated due to distributed diffusion noise sources. As the length of the device shrinks at a fixed bias voltage, the ac-wise short-circuit noise current shows excess noise as well as thermal noise spectra. This excess noise behaves like a full shot noise when the channel length becomes very small compared with the extrinsic Debye length. For the first time, the analytic formula of the excess noise in extrinsic semiconductors from velocity-fluctuation noise sources is given for finite frequencies. This formula shows the interplay between transit time, dielectric relaxation time, and velocity relaxation time in determining the terminal noise current as well as the carrier density fluctuation. As frequency increases, the power spectral density of the excess noise rolls off. This formula sheds light on noise in nanoscale MOSFETs where quasi-ballistic transport plays an important role in carrier transport and noise.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.61-67
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• 2020

In this paper, we calculated the warpage of bare substrates and chip attached substrates by using FEM (Finite Element Method), and compared and analyzed the effect of the chips' attachment on warpage. Also, the effects of layer thickness of substrates for reducing warpage were analyzed and the conditions of layer thickness were analyzed by signal-to-noise ratio of Taguchi method. According to the analysis results, the direction of warpage pattern in substrates can change when chips are attached. Also, the warpage decreases as the difference in the CTE (coefficient of thermal expansion) between the top and bottom of the package decreases and the stiffness of the package increases after chips are loaded. In addition, according to the impact analysis of design parameters on substrates where chips are not attached, in order to reduce warpage, the inner layers of the circuit layer Cu1 and Cu4 has be controlled first, and then concentrated on the thickness of the solder resist on the bottom side and the thickness of the prepreg layer between Cu1 and Cu2.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.647-650
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• 2006

Low temperature polycrystalline silicon (LTPS) technology using a high power laser have been widely applied to thin film transistors (TFTs) for liquid crystal, organic light emitting diode (OLED) display, driver circuit for system on glass (SOG) and static random access memory (SRAM). Recently, the semiconductor industry is continuing its quest to create even more powerful CPU and memory chips. This requires increasing of individual device speed through the continual reduction of the minimum size of device features and increasing of device density on the chip. Moreover, the flat panel display industry also need to be brighter, with richer more vivid color, wider viewing angle, have faster video capability and be more durable at lower cost. Kornic Systems Co., Ltd. developed the $KORONA^{TM}$ LTP/GLTP series - an innovative production tool for fabricating flat panel displays and semiconductor devices - to meet these growing market demands and advance the volume production capabilities of flat panel displays and semiconductor industry. The $KORONA^{TM}\;LTP/GLTP$ series using DPSS laser and XeCl excimer laser is designed for the new generation of the wafer & FPD glass annealing processing equipment combining advanced low temperature poly-silicon (LTPS) crystallization technology and object-oriented software architecture with a semistandard graphical user interface (GUI). These leading edge systems show the superior annealing ability to the conventional other method. The $KORONA^{TM}\;LTP/GLTP$ series provides technical and economical benefits of advanced annealing solution to semiconductor and FPD production performance with an exceptional level of productivity. High throughput, low cost of ownership and optimized system efficiency brings the highest yield and lowest cost per wafer/glass on the annealing market.

• The Journal of Korean Physical Therapy
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• v.13 no.3
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• pp.509-527
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• 2001

The Sun's ray is composed of Infrared(49%), Visible light(40%) and Ultra violet(11%), however the ray getting to the earth is FIR(Far infrared; 60%), IR(Infrared; 20%), and UV(Ultra Violet; 20%). Human beings has utilized FIR already from time immemorial. Hershel found out Infrared for the first time. in the Industrial Revolution the Infrared and FIR had been begun to use making products. In these days, with contemporary science FIR would be begun to clear up the implication in the human body and organic compound. IR classified by wavelength three parts NlR, MIR, FIR. There is FIR which is radiated from healthy human body the wave length is 8-l4m. The human body is composed of proteins which get easily changed by a thermal factor (about 42 $^{\circ}$C over). FIR with low temperature can deeply penetrate on the human body composed things without troublesomes, since FIR has effectively operated on the human body at low temperature (35-40 $^{\circ}$C). When FlR penetrated on the human body. it would inhibit the abnormal genes and cells expression, and then information of DNA and RNA would be reexpressed for arranging DNA and RNA abnormal state. As FlR's receptors in the body, it could be presumed that N-glycosyl linkage of purine and deoxyribose, RNA splicing process, and Heat shock protein. To take the FIR which was a optimized wavewlength and strength, at first, we induced the characteristic algorithm and the computerized programing. Then we formed that the formular of optimized FIR with physical, mathematical logic and theory. especially, Plank, Kirchhoff, Wien, Stefan-Boltzmann's logic and law. In the long run, the formular was induced with integration mathematical, since we had to know the molecular wavelength. Based on the induced formular as above, we programmed the optimized FlR radiating computerized program. In this research, we designed the eletronic circuit f3r interfacing with human body to diagnosis and treatment with FIR sensor which radiated FIR wavelength optimized.