• Journal of Electrical Engineering and Technology
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• 제12권3호
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• pp.1156-1165
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• 2017

A high performance interleaved bridgeless boost power factor correction (PFC) rectifier operating under the critical current conduction mode (CrM) is proposed in this paper to improve the efficiency and system performance of various applications, such as nano-grid systems. By combining the interleaved technique with the bridgeless topology, the circuit contains two independent branches without rectifier diodes. The branches operate in interleaved mode for each respective half-line period. Moreover, when operating in CrM, all the power switches take on soft-switching, thereby reducing switching losses and raising system efficiency. In addition, the input current flows through a minimum amount of power devices. By employing a commercial PFC controller, an effective control scheme is used for the proposed circuit. The operating principle of the proposed circuit is presented, and the design considerations are also demonstrated. Simulations and experiments have been carried out to evaluate theoretical analysis and feasibility of the proposed circuit.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1993년도 정기총회 및 추계학술대회 논문집 학회본부
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• pp.82-84
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• 1993

A method for simulating general characteristics and temperature characteristics of magnetizing fixture coil of the capacitor discharge impulse magnetizer-magnetizing fixture system using SPICE is presented. This method has been developed which can aid the design, understanding and inexpensive, time-saving of magnetizing circuit. As the detailed characteristics of magnetizing circuit can be obtained, the efficient design of the magnetizing circuit which produce desired magnet will be possible using our SPICE modeling. Especially, The knowledge of the temperature of the magnetizing fixture is very important to forecast the characteristics of the magnetizing circuits tinder different conditions. The capacitor voltage was not raised above 810[V] to protect the magnetizing fixture from excessive heating. The temperature estimation method uses multi-lumped model with equivalent thermal resistance and thermal capacitance.

• Journal of Electrical Engineering and Technology
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• 제10권5호
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• pp.2040-2045
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• 2015

This paper deals with the electromagnetic and thermal analysis of high speed induction motor. The induction motor is analyzed by time-varying magnetic finite element method and its thermal analysis is carried out by using analytical lumped-circuit method. Analysis results are compared with the experiment of 29kW high speed motor prototype at 12,000rpm.

• 한국자동차공학회논문집
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• 제16권3호
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• pp.15-22
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• 2008

Applications of bonded dissimilar materials such as integrated circuit(IC) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in bonded joints of dissimilar materials. In order to investigate the IC package crack propagating from the edge of die pad and resin, the fracture parameters of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method(BEM). From these results, crack propagation direction and path by thermal stress in the IC package were numerically simulated with boundary element method.

• 설비공학논문집
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• 제9권1호
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• pp.1-13
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• 1997

This paper reports the dynamic analysis of energy consumption for an office building by heat resistance-capacitance method. If a building is divided into several wall components and the wall components is replaced by one thermal capacitance and several thermal resistances, the building becomes an electric circuit. By solving the simultaneous equations of the circuit, the dynamic heat transfer characteristics and the energy consumption rate of the building were predicted. Accuracy of modified BIN method was evaluated by the present resistance-capacitance method. The result shows that modified BIN method overpredicts the heating load of the office building 15%. Annual energy consumptions of equipments(fan, boiler, chiller) for various ventilating control system(CAV, VAV, FCU+VAV, FCU+CAV) were compared. FCU+CAV shows the minimum annual energy consumption.

• 전기학회논문지
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• 제63권1호
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• pp.42-47
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• 2014

The use of BLDC motor in Vehicle and industrial field, it is operated by continuous and intermittent driving. When the intermittent driving is occurred by the rise and fall of temperature repeatedly, it was represented by different characteristics in case of continuous driving. So, it is very important that heat source estimation according to the duty ratio. In this paper, temperature characteristics according to the operating method of BLDCM was calculated by using the thermal equivalent circuit, and the validity of the study was demonstrated as compared to the calculated and experimental results.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 추계기술심포지움논문집
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• pp.153-157
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• 2002

Thermal management is very important for the success of high density circuit design in LTCC. To realized more accurate thermal analysis for structure design, a series of simple thermal resistance measurement by laser flash method and parametric numerical analysis have been carried out. The design of via filled material would be useful in thermal management of power devices.

• International Journal of Precision Engineering and Manufacturing
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• 제4권4호
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• pp.51-56
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• 2003

Generally, the build-up printed circuit board manufactured by a sequential process involving etching, plating, drilling, etc, which requires many types of equipments and long lead time. Etching process is suitable for mass production, however, it is not adequate for manufacturing a prototype in the development stage. In this study, we introduce a screen printing technology for prototyping a build-up printed circuit board. As for the material, photo/thermal curable resin and conductive paste are used for the formation of dielectric and conductor. The build-up structure is made by subsequent processes such as formation of a liquid resin thin layer, solidification by a UV/IR light, and via hole filling with a conductive paste. By use of photo curable resin, productivity is greatly enhanced compared with thermal curable resin. Finally, the basic concept and the possibility of build-up printed circuit board prototyping are proposed in comparison with the conventional process.

• 마이크로전자및패키징학회지
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• 제18권3호
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• pp.59-65
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• 2011

소형화, 박형화 및 집적화의 경향에 따라 FCBGA가 휴대폰과 같은 전자제품에 활발히 사용되고 있다. 그러나, 플립칩은 전기적 저항에 의한 열이 필연적으로 발생하며, 발생된 열은 패키지의 소형화에 따라 열의 분산 면적 감소로 인하여 발열의 증가가 나타나게 된다. 발열은 온도와 응력에 민감하게 반응하는 소자의 수명을 저해하고, 시스템에 있어 고장의 발생을 가져올 수 있다. 따라서 본 논문에서는 플립칩의 발열문제를 해결하기 위하여 Comsol 3.5a의 heat transfer module을 이용하여 FCBGA의 발열 특성을 정량적으로 분석하였다. 그리고 열 문제를 해결하기 위하여 시뮬레이션을 통한 새로운 마이크로 구조가 부착된 플립칩을 제안하였다. 또한 마이크로 패턴 구조의 형상, 높이, 간격에 대한 열 소산을 분석함으로써, 기존 플립칩에 비하여 열소산 특성이 18% 향상됨을 확인하였다.

• 한국압력기기공학회 논문집
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• 제14권1호
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• pp.8-14
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• 2018

Printed circuit heat exchangers (PCHEs) are widely used with an increasing demand for industrial applications. PCHEs are capable of operating at high temperatures and pressure. We consider a PCHE as a candidate intermediate heat exchanger type for a high temperature gas-cooled reactor (HTGR). For conventional application using stainless steels, design and manufacturing of PCHEs are well established. For applications to HTGR, knowledge of longitudinal conduction and deformation of channel is required to estimate design margin. This paper analyzes the effects of longitudinal conduction and deformation of channel on thermal performance using a code internally developed for design and analysis of PCHEs. The code has a capability of two dimensional simulations. Longitudinal conduction is estimated using the code. In HTGR operating condition, about ten percent of design margin is required to compensate thermal performance. The cross-sectional images of PCHE channels are obtained using an optical microscope. The images are processed with computer image process technique. We quantify the deformation of channel with dimensional parameters. It is found that the deformation has negative effect on structural integrity. The deformation enhances thermal performance when the shape of channel is straight in laminar flow regime. It reduces thermal performance in cases of a zigzag channel and turbulent flow regime.