• Title/Summary/Keyword: thermal circuit

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Thermal Residual Stresses in the Frequency Selective Surface Embedded Composite Structures and Design of Frequency Selective Surface (주파수 선택적 투과막이 결합된 복합재료의 잔류응력평가 및 선택적 투과막 설계)

  • Kim, Ka-Yeon;Chun, Heoung-Jae;Kang, Kyung-Tak;Lee, Kyung-Won;Hong, Ic-Pyo;Lee, Myoung-Keon
    • Composites Research
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    • v.24 no.1
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    • pp.37-44
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    • 2011
  • In this paper, Particle Swarm Optimization(PSO) is applied to the design of the Frequency Selective Surface(FSS) and residual stresses of hybrid radome is predicted. An equivalent circuit model with Square Loops arrays was derived and then PSO was applied for acquiring the optimized geometrical parameters with proper resonant frequency. Residual stresses occur in the FSS embedded composite structures after cocuring and have a great influence on the strength of the FSS embedded composite structures. They also effect transmission quality because of delamination. Therefore, the thermal residual stresses of FSS embedded composite structures were analyzed using finite element analysis with considering the effects of FSS pattern, and composite stacking sequence.

Warpage Improvement of PCB with Material Properties Variation of Core (코어 물성 변화에 따른 인쇄회로기판의 warpage 개선)

  • Yoon Il-Soung
    • Journal of the Microelectronics and Packaging Society
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    • v.13 no.2 s.39
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    • pp.1-7
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    • 2006
  • In this paper, warpage magnitude and shape of printed-circuit board in case that properties of core and thickness of solder resist are varied are investigated. The cause of warpage is coefficient of thermal expansion differences of stacked materials. Therefore, we need small difference of coefficient of thermal expansion that laminated material, and need to decrease asymmetric of top side and bottom side in structure shape. Also, we can control occurrence of warpage heightening hardness of core in laminated material. Composite material that make core are exploited in connection with the structural bending twisting coupling resulting from directional properties of fiber reinforced composite materials and from ply stacking sequence. If we use such characteristic, we can control warpage with change of material properties. In this paper, warpage of two layer stacked chip scale package is investigated, and evaluate improvement result using an experiment and finite element method tool.

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Analysis for Electrical Fire Possibility Using Fuzzy Logic with Input Variables of Overcurrent and Saturation Time in the Indoor Wiring (전기배선에서 과전류와 포화시간을 입력변수로 갖는 퍼지기반 전기화재가능성 분석)

  • Kim, Eun-Jin;Kim, Doo-Hyun;Kim, Sung-Chul
    • Journal of the Korean Society of Safety
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    • v.30 no.6
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    • pp.34-39
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    • 2015
  • The study is aimed to develop fuzzy logic system that has overcurrent and saturation time as input variable and possibility of electrical fire as output variable by making bad conductor area with physical damage to indoor wiring. Most previous studies focused on thermal characteristics depending on the current size and no study considered the current size and saturation time at the same time. Therefore, the paper made into account current value and saturation time together. To this end, it created bad conductor area half the size of IV conductor (1.6 mm) on purpose and transmit electrical current from 10A to 60A by unit of 2A to find out the thermal characteristics and saturation time for current. Based on the data that came out, the study applied fuzzy logic and established the current and saturation time as input variable and chance of fire as output variable. As a result, the center of area of the system that depended only on the existing current value was 75 while the system that applied both current and saturation time presented the chance of fire at 92. It is found that the chance of bad conductor area and deteriorated insulation of electrical wire had current and saturation time as important variables. The data can be used as basic data like deteriorated wire insulation or operation features of circuit breaker in investigating the cause of electrical fire.

Small Molecular Solar Cells toward Improved Efficiency and Stability

  • Kim, Ji-Hwan;Kim, Hyo-Jeong;Jeong, Won-Ik;Kim, Tae-Min;Lee, Yeong-Eun;Kim, Se-Yong;Kim, Jang-Ju
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.08a
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    • pp.73-73
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    • 2011
  • We will report a few methods to improve the efficiency and stability in small molecule based organic solar cells, including the formation of bulk heterojunctions (BHJs) through alternative thermal deposition (ATD), the use of a micro-cavity structure and interface modifications. By ATD which is a simple modification of conventional thermal evaporation, the thicknesses of alternative donor and acceptor layers were precisely controlled down to 0.1 nm, which is critical to form BHJs. The formation of a BHJ in copper(II) phthalocyanine (CuPc) and fullerene (C60) systems was confirmed by AFM, GISAXS and absorption measurements. From analysis of the data, we found that the CuPc|C60 films fabricated by ATD were composed of the nanometer sized disk shaped CuPc nano grains and aggregated C60, which explains the phase separation of CuPc and C60. On the other hand, the co-deposited CuPc:C60 films did not show the existence of separated CuPc nano grains in the CuPc:C60 matrix. The OPV cells fabricated using the ATD method showed significantly enhanced power conversion efficiency compared to the co-deposited OPV cells under a same composition [1]. We will also present by numerical simulation that adoption of microcavity structure in the planar heterojunction can improve the short circuit current in single and tandem OSCs [2]. Interface modifications also allowed us to achieve high efficiency and high stability OSCs.

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Evaluation of Flexible Complementary Inverters Based on Pentacene and IGZO Thin Film Transistors

  • Kim, D.I.;Hwang, B.U.;Jeon, H.S.;Bae, B.S.;Lee, H.J.;Lee, N.E.
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.154-154
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    • 2012
  • Flexible complementary inverters based on thin-film transistors (TFTs) are important because they have low power consumption and high voltage gain compared to single type circuits. We have manufactured flexible complementary inverters using pentacene and amorphous indium gallium zinc oxide (IGZO) for the p-channel and n-channel, respectively. The circuits were fabricated on polyimide (PI) substrate. Firstly, a thin poly-4-vinyl phenol (PVP) layer was spin coated on PI substrate to make a smooth surface with rms surface roughness of 0.3 nm, which was required to grow high quality IGZO layers. Then, Ni gate electrode was deposited on the PVP layer by e-beam evaporator. 400-nm-thick PVP and 20-nm-thick ALD Al2O3 dielectric was deposited in sequence as a double gate dielectric layer for high flexibility and low leakage current. Then, IGZO and pentacene semiconductor layers were deposited by rf sputter and thermal evaporator, respectively, using shadow masks. Finally, Al and Au source/drain electrodes of 70 nm were respectively deposited on each semiconductor layer using shadow masks by thermal evaporator. The characteristics of TFTs and inverters were evaluated at different bending radii. The applied strain led to change in voltage transfer characteristics of complementary inverters as well as source-drain saturation current, field effect mobility and threshold voltage of TFTs. The switching threshold voltage of fabricated inverters was decreased with increasing bending radius, which is related to change in parameters of TFTs. Throughout the bending experiments, relationship between circuit performance and TFT characteristics under mechanical deformation could be elucidated.

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Hybrid complementary circuits based on organic/inorganic flexible thin film transistors with PVP/Al2O3 gate dielectrics

  • Kim, D.I.;Seol, Y.G.;Lee, N.E.;Woo, C.H.;Ahn, C.H.;Ch, H.K.
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.479-479
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    • 2011
  • Flexible inverters based on complementary thin-film transistor (CTFTs) are important because they have low power consumption and other advantages over single type TFT inverters. In addition, integrated CTFTs in flexible electronic circuits on low-cost, large area and mechanically flexible substrates have potentials in various applications such as radio-frequency identification tags (RFIDs), sensors, and backplanes for flexible displays. In this work, we introduce flexible complementary inverters using pentacene and amorphous indium gallium zinc oxide (IGZO) for the p-channel and n-channel, respectively. The CTFTs were fabricated on polyimide (PI) substrate. Firstly, a thin poly-4-vinyl phenol (PVP) layer was spin coated on PI substrate to make a smooth surface with rms surface roughness of 0.3 nm, which was required to grow high quality IGZO layers. Then, Ni gate electrode was deposited on the PVP layer by e-beam evaporator. 400-nm-thick PVP and 20-nm-thick ALD Al2O3 dielectric was deposited in sequence as a double gate dielectric layer for high flexibility and low leakage current. Then, IGZO and pentacene semiconductor layers were deposited by rf sputter and thermal evaporator, respectively, using shadow masks. Finally, Al and Au source/drain electrodes of 70 nm were respectively deposited on each semiconductor layer using shadow masks by thermal evaporator. Basic electrical characteristics of individual transistors and the whole CTFTs were measured by a semiconductor parameter analyzer (HP4145B, Agilent Technologies) at room temperature in the dark. Performance of those devices then was measured under static and dynamic mechanical deformation. Effects of cyclic bending were also examined. The voltage transfer characteristics (Vout- Vin) and voltage gain (-dVout/dVin) of flexible inverter circuit were analyzed and the effects of mechanical bending will be discussed in detail.

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The Effect of Insulating Material on WLCSP Reliability with Various Solder Ball Layout (솔더볼 배치에 따른 절연층 재료가 WLCSP 신뢰성에 미치는 영향)

  • Kim, Jong-Hoon;Yang, Seung-Taek;Suh, Min-Suk;Chung, Qwan-Ho;Hong, Joon-Ki;Byun, Kwang-Yoo
    • Journal of the Microelectronics and Packaging Society
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    • v.13 no.4
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    • pp.1-7
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    • 2006
  • A major failure mode for wafer level chip size package (WLCSP) is thermo-mechanical fatigue of solder joints. The mechanical strains and stresses generated by the coefficient of thermal expansion (CTE) mismatch between the die and printed circuit board (PCB) are usually the driving force for fatigue crack initiation and propagation to failure. In a WLCSP process peripheral or central bond pads from the die are redistributed into an area away using an insulating polymer layer and a redistribution metal layer, and the insulating polymer layer affects solder joints reliability by absorption of stresses generated by CTE mismatch. In this study, several insulating polymer materials were applied to WLCSP to investigate the effect of insulating material. It was found that the effect of property of insulating material on WLCSP reliability was altered with a solder ball layout of package.

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A Study on the interface of information processing system on Human enhancement fire fighting helmet (휴먼 증강 소방헬멧 정보처리 시스템 인터페이스 연구)

  • Park, Hyun-Ju;Lee, Kam-Yeon
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2018.10a
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    • pp.497-498
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    • 2018
  • In the fire scene, it is difficult to see 1m ahead because of power failure, smoke and toxic gas, even with thermal imaging camera and Xenon searchlight. Analysis of the smoke particles in the fire scene shows that even if the smoke is $5{\mu}m$ or less in wavelength, it is difficult to obtain a front view when using a conventional thermal imaging camera if the visual distance exceeds 1 meter. In the case of black smoke with a particle wavelength of $5{\mu}m$ or more, a space permeation sensor technology using various sensors other than a single sensor is required because chemical materials, gas, and water molecules are mixed. Firefighters need a smoke detection technology for smoke detection and spatial information visualization for forward safety view.In this paper, we design the interface of the information processing system with 32bit CPU core and peripheral circuit. We also implemented and simulated the interface with Lidar sensor. Through this, we provide interface that can implement information processing system of human enhancement fire helmet in the future.

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Application of Police Video Equipment for Fighting Crime and Legal Trends (범죄 대응을 위한 경찰 영상장비의 활용과 법 동향)

  • Lee, Hoon;Lee, Won-Sang
    • Informatization Policy
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    • v.25 no.2
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    • pp.3-19
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    • 2018
  • With the introduction of video cameras into law enforcement, a great deal of police organizations have adopted the technology in their routine crime prevention activities. The up-to-date systems of ambient surveillance energized by CCTV, police wearable cameras, drones, and thermal imaging devices enable the police to thoroughly monitor public spaces as well as to rigorously arrest on-scene criminals. These efforts to improve the level of surveillance are often met with public resistance raising concerns over citizens' rights to privacy. Recent studies on the use of police video equipment have constantly raised the issues related to the lack of applicable legal provisions, risk of personal information and privacy infringement as well as security vulnerabilities. In this regard, the present study attempted to review the public surveillance methods currently used by law enforcement agencies worldwide within the context of public safety and individual rights to privacy. Furthermore, the present study also discussed the legal boundaries of police use of video equipment to address public concerns over privacy issues.

An Experimental Study on the Characteristics of Electrochemical Reactions of RDF/RPF in the Direct Carbon Fuel Cell (직접탄소 연료전지에서 RDF 및 RPF의 전기화학반응 특성에 관한 실험적 연구)

  • Ahn, Seong Yool;Rhie, Young Hoon;Eom, Seong Yong;Sung, Yeon Mo;Moon, Cheor Eon;Kang, Ki Joong;Choi, Gyung Min;Kim, Duck Jool
    • Transactions of the Korean hydrogen and new energy society
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    • v.23 no.5
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    • pp.513-520
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    • 2012
  • The electrochemical reaction of refuse derived fuel (RDF) and refuse plastic/paper fuel (RPF) was investigated in the direct carbon fuel cell (DCFC) system. The open circuit voltage (OCV) of RPF was higher than RDF and other coals because of its thermal reactive characteristic under carbon dioxide. The thermal reactivity of fuels was investigated by thermogravimetric analysis method. and the reaction rate of RPF was higher than other fuels. The behavior of all sample's potential was analogous in the beginning region of electrochemical reactions due to similar functional groups on the surface of fuels analyzed by X-ray Photoelectron Spectroscopy experiments. The potential level of RDF and RPF decreased rapidly comparing to coals in the next of the electrochemical reaction because the surface area and pore volume investigated by nitrogen gas adsorption tests were smaller than coals. This characteristic signifies the contact surface between electrolyte and fuel is restricted. The potential of fuels was maintained to the high current density region over 40 $mA/cm^2$ by total carbon component. The maximum power density of RDF and RPF reached up to 45~70% comparing to coal. The obvious improvement of maximum power density by increasing operating temperature was observed in both refuse fuels.